Product Data Sheet STF0A36B – Full Color LED The Best lm/W in Full Color Products Full Color LED - 3528 Series STF0A36B (Full Color) RoHS Product Brief Description Features and Benefits • This surface-mount LED comes in standard package dimension (3.5mmx2.8mmx0.7mm). It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. • • • • • • • • The package design coupled with careful selection of component materials allow these products to perform with high reliability. Key Applications • • • Reflector type package Market standard 3528 package 3 chips in a package Low Thermal Resistance Red, Green, Blue color & White balance UL certification RoHS compliant Advertising light Electric appliance Other decoration lighting Table 1. Product Selection Table Dominant wavelength ［nm］ Part Number STF0A36B Rev5.0, Jul 17, 2014 Color Min. Typ. Max. Red - 625 - Green - 525 - Blue - 457 - 1 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 5 • Reliability Test 8 • Color Bin Structure 9 • Mechanical Dimensions 11 • Material Structure 12 • Reflow Soldering Characteristics 13 • Emitter Tape & Reel Packaging 14 • Product Nomenclature 16 • Handling of Silicone Resin for LEDs 17 • Precaution For Use 18 • Company Information 21 Rev5.0, Jul 17, 2014 2 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Performance Characteristics Table 2. Electro-Optical characteristics, Ta=25℃ Value Parameter Color Symbol Condition Typ Max IF =20 mA - 2.0 2.4 IF =20 mA - 3.15 3.6 IF =20 mA - 3.15 3.5 - - 10 - - 10 - - 10 IF =20 mA - 650 - IF =20 mA - 1300 - Blue IF =20 mA - 250 - Red IF =20 mA - 625 - IF =20 mA - 525 - Blue IF =20 mA - 457 - Red IF =20 mA - 15 - IF =20 mA - 18 - IF =20 mA - 18 - Red Forward Voltage Green VF Blue Red Reverse Current Green IR VR=5V Blue Red Luminous Intensity Dominant wavelength Spectral Bandwidth Unit Min Green Green Green IV λd Δλ Blue V µA mcd nm nm Viewing Angle R,G,B 2θ1/2 IF =20 mA /chip - 120 - ° Thermal Resistance (J to S) R,G,B RθJ-S IF =20 mA /chip - 48 - ℃/W Notes : All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of Seoul Semiconductor. (Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V) Rev5.0, Jul 17, 2014 3 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Performance Characteristics Table 3. Absolute maximum ratings Value Parameter Symbol Unit Red Green Blue Power Dissipation Pd 72 102 102 mW Forward Current IF 30 30 30 mA Peak Forward Current IFM *1 100 100 100 mA Operation Temperature Topr. -40 ~ 100 ℃ Storage Temperature Tstg. -40 ~ 100 ℃ Notes : (1) Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. (2) IFM was measured at Tw≤0.1 msec of pulse width and D≤1/10 of duty ratio. (3) LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Rev5.0, Jul 17, 2014 4 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Characteristics Graph Forward Current FI(mA) Fig 1. Forward Current vs. Forward Voltage, Ta=25℃ 10 1 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 Forward Voltage VF(V) Fig 2. Relative Intensity vs. Forward Current, Ta=25℃ 160 Luminous Intensity IV(%) 140 120 100 80 60 40 20 0 0 5 10 15 20 25 30 Forward Current IF(mA) Rev5.0, Jul 17, 2014 5 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Characteristics Graph Fig 3. Radiation Diagram 90 1.0 120 60 0.8 0.6 30 150 0.4 0.2 0.0 180 0 0.2 0.4 0.6 0.8 Fig 4. Forward Current vs. Derating Curve, Ta=25℃ 1.0 Forward current FI(mA) 30 1-chip ON 3-chip ON 20 10 0 -40 -20 0 20 40 60 80 100 Ambient temperature Ta(℃) Rev5.0, Jul 17, 2014 6 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Characteristics Graph Fig 5. Forward Current vs. Duty Ratio, T a=25℃ B 0.30 2.0 tp Maximum Forward Current IF Max [A] B 1.5 1.0 D=tp/T IF 0.5 0.25 0.0 0 2 T 4 A 6 8 10 0.20 0.15 D= 1 0.5 0.05 0.005 0.10 0.05 0.00 1E-5 1E-4 1E-3 0.01 0.1 1 10 100 TP Fig 6. Forward Current vs. Duty Ratio, T a=85℃ B 2.0 tp 1.5 B Maximum Forward Current IF Max [A] 0.30 1.0 D=tp/T IF 0.5 0.25 0.0 0 2 T 4 A 6 8 10 0.20 0.15 D= 1 0.5 0.05 0.005 0.10 0.05 0.00 1E-5 1E-4 1E-3 0.01 0.1 1 10 100 TP Rev5.0, Jul 17, 2014 7 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Reliability Test Table 4. Reliability Test Item Reference Test Condition Duration /Cycle Number of Damage Thermal Shock EIAJ ED-4701 Ta =-40oC (30MIN) ~ 100oC (30MIN) 100 Cycle 0/22 =-40oC 25oC Temperature Cycle EIAJ ED-4701 Ta (30MIN) ~ (5MIN) ~ 100oC (30MIN) ~ 25oC (5MIN) 100 Cycle 0/22 High Temperature Storage EIAJ ED-4701 Ta =100oC 1000 Hours 0/22 High Temperature High Humidity Storage EIAJ ED-4701 Ta =85oC, RH=85% 1000 Hours 0/22 Low Temperature Storage EIAJ ED-4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =20mA 1000 Hours 0/22 High Temperature High Humidity Life Test Internal Reference Ta =85oC, RH=85%, IF =15mA 300 Hours 0/22 High Temperature Life Test Internal Reference Ta =85oC, IF =20mA 500 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =20mA 1000 Hours 0/22 ESD(HBM) MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 Table 5. Criteria for Judging the Damage Criteria for Judgement Item Symbol Condition MIN MAX Forward Voltage VF IF =20mA - USL*1 × 1.2 Luminous Intensity IV IF =20mA LSL*2 × 0.5 - Notes : (1) *1 USL : Upper Standard Level (2) *2 LSL : Lower Standard Level. Rev5.0, Jul 17, 2014 8 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Color Bin Structure Table 6. Bin Code Description Luminous Intensity (mcd) Part Number Bin Code Min. Max. A 900 1,500 B 1,500 2,000 C 2,000 2,500 D 2,500 3,000 STF0A36B Notes : White Balance Intensity Rank (Red : 15mA / Green : 20mA / Blue : 12mA) Rev5.0, Jul 17, 2014 9 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Color Bin Structure White Color Coordinates Define 0.32 0.30 g h 0.28 y e f 0.26 c d 0.24 a 0.22 0.20 b 0.20 0.25 0.30 x a b c d CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.212 0.209 0.241 0.209 0.219 0.233 0.248 0.233 0.241 0.209 0.270 0.209 0.248 0.233 0.277 0.283 0.248 0.233 0.277 0.233 0.255 0.257 0.284 0.257 0.219 0.233 0.248 0.233 0.226 0.257 0.255 0.257 e f g h CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.226 0.257 0.255 0.257 0.233 0.281 0.262 0.281 0.255 0.257 0.284 0.257 0.262 0.281 0.291 0.281 0.262 0.281 0.291 0.281 0.269 0.305 0.298 0.305 0.233 0.281 0.262 0.281 0.240 0.305 0.269 0.305 •* Measurement Uncertainty of the Color Coordinates : ± 0.01 Rev5.0, Jul 17, 2014 10 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Mechanical Dimensions 許容誤差: ±0.1, 単位: ㎜ ① ② ③ ④ B ⑤ R ⑥ G * G, B contain Zener diode each other Recommended Metal Mask pattern Recommended Solder pattern Notes : (1) Recommended Metal Mask Thickness : 0.12mm Rev5.0, Jul 17, 2014 11 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Material Structure Parts No. Name Description Materials ① Lead Frame Metal Ag Plating Copper Alloy ② Chip Source Red, Green, Blue LED R : AlInGaP G, B : InGaN ③ Wire Metal Gold Wire ④ Encapsulation Silicone Silicon Resin + Diffuser ⑤ Body Thermo Plastic Heat-Resistant Polymer Rev5.0, Jul 17, 2014 12 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Table 7. Reflow Soldering Characteristics Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. Rev5.0, Jul 17, 2014 13 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Emitter Tape & Reel Packaging 11.4 ± 0.1 180 +0 -3 2.0 9.0 ± 0.3 LABLE ± 0.2 30° 60 13 ±0.2 10 22 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 3,500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev5.0, Jul 17, 2014 14 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box Rev5.0, Jul 17, 2014 15 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Product Nomenclature Table 8. Part Numbering System : X1X2X3X4X5X6X7X8 Part Number Code Description Part Number Value X1 Company S X2 Top View LED series T X3 Color Specification F0 Full Color X4 Package series A A series X5X6 Characteristic code 36 X7 Revision B Table 9. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17 Lot Number Code Description Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number Rev5.0, Jul 17, 2014 Lot Number 16 Value www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. Rev5.0, Jul 17, 2014 17 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. Rev5.0, Jul 17, 2014 18 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Precaution for Use (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) Attaching LEDs, do not use adhesives that outgas organic vapor. (15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (16) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev5.0, Jul 17, 2014 19 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires - This damage usually appears due to the thermal stress produced during the EOS event c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev5.0, Jul 17, 2014 20 www.seoulsemicon.com Product Data Sheet STF0A36B – Full Color LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev5.0, Jul 17, 2014 21 www.seoulsemicon.com