Push Switches Cautions Slide 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. Detector 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 3. Check and conform to soldering requirements under actual mass production conditions. 6. After mounting the switches, if you intend to put the board into an oven in order to harden adhesive for other parts, please consult with us. 9. Solder the switches with detent at the detent position. Soldering switches fixed at the center of the detent may deform the detent mechanisms. Dual-in-line Package Type 8. If you use a through-hole PC board or a PC board thinner or thicker than the recommendation, here may be greater heat stress. Verify the soldering conditions thoroughly before use. Power 7. Before soldering switches with locking mechanism, release the locks. If they are soldered without releasing the locks, the soldering heat may deform the locking mechanism. Rotary 5. Flux from around and above the PC board should not adhere to the switches. Push 4. When soldering twice, wait until the first soldered portion cools to normal temperature. Continuous heating will deform the external portions, loosen or dislodge terminals, or may deteriorate their electrical characteristics. 10. No cleaning. 11. Protect small and thin switches from external forces in the set mounting process. 14. The switch will be break if you apply a greater stress than that specified. Take great care not to let the switch be subject to greater stress than specified. Vertical Type 13. The products are designed and manufactured for direct current resistance. Contact us for use of other resistances such as inductive（L）or capacitive（C） . Horizontal Type 12. Tighten the mounting screws by applying the specified torque. Tightening with larger torque than the specified one will result in malfunction or breakage of screws. 15. Be sure to release the locks before removing the knobs. Otherwise, the locking mechanism may be deformed. 16. Be sure to use the forced travel close to the position of the whole travel as much as possible. 17. Insert these switches to the specified mounting surface and mount them horizontally. If not mounted horizontally, these switches will malfunction. 18. Use of the switches in a dusty environment may lead the dusts entering through the openings and cause imperfect contact or malfunction. Take this into account for set design. 19. Corrosive gas if generated by peripheral parts of a set, malfunction such as imperfect contact may occur. Thorough investigation shall be required beforehand. 20. Storage Store the products as delivered at normal temperature and humidity, out of direct sunlight and away from corrosive gases. Use them as soon as possible and no later than six months after delivery. Once the seal is broken, use them as soon as possible. 139