Data Sheet

X7R Dielectric
General Specifications
X7R formulations are called “temperature stable” ceramics and
fall into EIA Class II materials. X7R is the most popular of these
intermediate dielectric constant materials. Its temperature variation of capacitance is within ±15% from -55°C to +125°C. This
capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical operating conditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capacitance
due to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
0805
5
C
103
M
A
T
Size
(L" x W")
Voltage
4V = 4
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
Dielectric
X7R = C
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
Capacitance
Tolerance
J = ± 5%*
K = ±10%
M = ± 20%
Failure
Rate
A = Not
Applicable
*≤1μF only,
contact factory for
additional values
2
A
Terminations
T = Plated Ni
and Sn
7 = Gold Plated*
Z= FLEXITERM®**
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
Special
Code
A = Std. Product
*Optional termination
Contact
Factory For
Multiples
**See FLEXITERM®
X7R section
X7R Dielectric�
Typical Temperature Coefficient
⌬ Capacitance vs. Frequency
+30
10
+20
% ⌬ Capacitance
0
-5
-10
-15
-20
0
20
40
60
0
-10
-20
-30
1KHz
-25
-60 -40 -20
+10
80 100 120 140
Temperature °C
10 KHz
100 KHz
1,000 pF
1210
Impedance, ⍀
Impedance, ⍀
1.00
0.10
Frequency, MHz
100
0
0
20
40
1000
1.0
0.1
1
10
80
100
120
Variation of Impedance with Chip Size�
Impedance vs. Frequency�
100,000 pF - X7R�
10
�
�
1206
0805
1210
1.0
0.1
.01
.01
60
Temperature °C
Variation of Impedance with Chip Size�
Impedance vs. Frequency�
10,000 pF - X7R�
�
10
1206
�
0805
10,000 pF
100
10 MHz
1,000
Frequency
Variation of Impedance with Cap Value�
Impedance vs. Frequency�
1,000 pF vs. 10,000 pF - X7R�
0805�
�
10.00
0.01
10
1 MHz
Insulation Resistance vs Temperature
10,000
Impedance, ⍀
% Cap Change
5
Insulation Resistance (Ohm-Farads)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
100
Frequency, MHz
1,000
1
10
100
1,000
Frequency, MHz
17
X7R Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
X7R Specification Limits
-55ºC to +125ºC
Within specified tolerance
≤ 2.5% for ≥ 50V DC rating
≤ 3.0% for 25V DC rating
≤ 3.5% for 25V and 16V DC rating
≤ 5.0% for ≤ 10V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
18
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±7.5%
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
No visual defects
≤ ±12.5%
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12.5%
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0101*
0201
0402
0603
0805
1206
Soldering
Packaging
Reflow Only
Paper/Embossed
Reflow Only
All Paper
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
0.60 ± 0.03
(0.024 ± 0.001)
0.30 ± 0.03
(0.011 ± 0.001)
0.15 ± 0.05
(0.006 ± 0.002)
10 16 25
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A
A
A
A
A
A
A
A
A
A
A
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
10 16 25
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16 25 50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16 25 50
(L) Length
(W) Width
(t) Terminal
Cap
(pF)
Cap
(μF)
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
2.2
4.7
10
22
47
100
Letter
Max.
Thickness
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
225
475
106
226
476
107
WVDC
0.40 ± 0.02
(0.016 ± 0.0008)
0.20 ± 0.02
(0.008 ± 0.0008)
0.20 ± 0.02
(0.008 ± 0.0008)
10
A
A
A
A
A
A
A
SIZE
0101
A
0.33
(0.013)
50
A
A
A
A
A
6.3
50
6.3
G
G
J
J
J
J
J
C
10
G
G
G
J
J
J
J
J
100 200 6.3
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
P
10
B
0.22
(0.009)
10
16
25
50
6.3
0201
C
E
0.56
0.71
(0.022)
(0.028)
PAPER
10
16
25
50
6.3
10
16
0402
G
0.90
(0.035)
25
50
100 200 6.3
0603
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
10
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
P
P
P
10
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
P
P
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
P
P
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
100 200
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
6.3
J
J
J
J
J
J
J
J
J
J
J
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
Q
6.3
10
16
25
50
N
P
50
100 200
10
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16 25 50 100 200 500
0805
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
M
M
M
M
P
P
K
K
K
K
M
M
M
M
P
P
100 200 500
1206
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
NOTE: Contact factory for non-specified capacitance values
*EIA 01005
19
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
1210
1812
1825
2220
2225
Reflow Only
Paper/Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
5.70 ± 0.40
(0.225 ± 0.016)
5.00 ± 0.40
(0.197 ± 0.016)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
200
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
200
10
16
500
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
P
P
Z
Z
Z
Z
Z
Z
10
16
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
X
X
Z
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
M
P
Q
Q
X
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
M
M
Z
Z
M
M
M
M
M
M
P
Q
Q
Q
Q
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
Z
Z
Z
25
B
0.22
(0.009)
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
Z
Z
Z
K
K
K
K
K
K
K
K
K
M
P
Q
X
Z
Z
Z
K
K
K
K
K
K
K
P
P
X
K
P
P
X
Z
Z
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
M
M
M
M
M
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
500
L
W
T
t
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
Z
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
100
200
500
50
P
P
P
P
P
P
P
P
P
P
P
P
P
X
X
P
P
P
P
P
P
P
X
X
X
X
X
X
100
200
Z
50
100
200
500
16
25
1210
A
0.33
(0.013)
500
䉲
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z
Z
C
E
0.56
0.71
(0.022)
(0.028)
PAPER
50
100
200
500
50
1812
G
0.90
(0.035)
NOTE: Contact factory for non-specified capacitance values
20
16
䉲
SIZE
Letter
Max.
Thickness
200
䉲
Cap
(μF)
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
䉲
Cap
(pF)
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
䉲
(t) Terminal
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50
100
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
106
226
476
107
WVDC
䉲
(L) Length
䉲
SIZE
Soldering
Packaging
J
0.94
(0.037)
K
1.02
(0.040)
100
200
25
1825
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
50
2220
X
2.29
(0.090)
2225
Y
2.54
(0.100)
Z
2.79
(0.110)