DCR5240H52 Phase Control Thyristor Preliminary Information DS6160- 1 September 2014 (LN31988) KEY PARAMETERS FEATURES Double Side Cooling High Surge Capability VDRM IT(AV) ITSM dV/dt* dI/dt 5200V 5240A 77800A 2000V/µs 200A/µs * Higher dV/dt selections available APPLICATIONS High Power Drives High Voltage Power Supplies Static Switches VOLTAGE RATINGS Part and Ordering Number DCR5240H52* DCR5240H50 DCR5240H48 Repetitive Peak Voltages VDRM and VRRM V 5200 5000 4800 Conditions Tvj = -40°C to 125°C, IDRM = IRRM = 600mA, VDRM, VRRM tp = 10ms, VDSM & VRSM = VDRM & VRRM + 100V respectively Lower voltage grades available. o o *5000V @ -40 C, 5200V @ 0 C Outline type code: H (See Package Details for further information) ORDERING INFORMATION Fig. 1 Package outline When ordering, select the required part number shown in the Voltage Ratings selection table. For example: DCR5240H52 Note: Please use the complete part number when ordering and quote this number in any future correspondence relating to your order. 1/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR CURRENT RATINGS Tcase = 60°C unless stated otherwise Symbol Parameter Test Conditions Max. Units 5240 A Double Side Cooled IT(AV) Mean on-state current IT(RMS) RMS value - 8230 A Continuous (direct) on-state current - 7290 A IT Half wave resistive load SURGE RATINGS Symbol ITSM 2 It Parameter Surge (non-repetitive) on-state current Test Conditions Max. Units 10ms half sine, Tcase = 125°C 77.80 kA VR = 0 30.27 MA s Min. Max. Units 2 I t for fusing 2 THERMAL AND MECHANICAL RATINGS Symbol Rth(j-c) Rth(c-h) Parameter Thermal resistance – junction to case Thermal resistance – case to heatsink Test Conditions Double side cooled DC - 0.004255 °C/W Single side cooled Anode DC - 0.008 °C/W Cathode DC - 0.0093 °C/W Double side - 0.0009 °C/W - 0.0018 °C/W - 125 °C Clamping force 135.0kN (with mounting compound) Blocking VDRM / VRRM Single side Tvj Virtual junction temperature Tstg Storage temperature range -55 125 °C Fm Clamping force 120 155 kN 2/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR DYNAMIC CHARACTERISTICS Symbol IRRM/IDRM Parameter Test Conditions Min. Max. Units Peak reverse and off-state current At VRRM/VDRM, Tcase = 125°C - 600 mA dV/dt Max. linear rate of rise of off-state voltage To 67% VDRM, Tj = 125°C, gate open - 2000 V/µs dI/dt Rate of rise of on-state current From 67% VDRM to 2x IT(AV) Repetitive 50Hz - 200 A/µs Gate source 30V, 10, Non-repetitive - 500 A/µs tr < 0.5µs, Tj = 125°C VT(TO) rT tgd Threshold voltage – Low level 500 to 4000A at Tcase = 125°C - 0.975 V Threshold voltage – High level 4000 to 8000A at Tcase = 125°C - 1.222 V On-state slope resistance – Low level 500A to 4000A at Tcase = 125°C - 0.175 m On-state slope resistance – High level 4000A to 8000A at Tcase = 125°C - 0.118 m VD = 67% VDRM, gate source 30V, 10 - 3 µs 500 µs 2230 4290 µC 38 52 A Delay time tr = 0.5µs, Tj = 25°C tq Turn-off time IT = 3000A, Tj = 125°C, VR = 200V, dI/dt = 1A/µs, dVDR/dt = 20V/µs linear QS Stored charge IT = 3000A, Tj = 125°C, dI/dt – 1A/µs, VRpeak ~3100V, VR ~ 2100V IRR Reverse recovery current IL Latching current Tj = 25°C, VD = 5V - 3 A IH Holding current Tj = 25°C, RG-K = , ITM = 500A, IT = 5A - 300 mA 3/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR GATE TRIGGER CHARACTERISTICS AND RATINGS Symbol Parameter Test Conditions Max. Units VGT Gate trigger voltage VDRM = 5V, Tcase = 25°C 1.5 V VGD Gate non-trigger voltage At 50% VDRM, Tcase = 125°C 0.4 V IGT Gate trigger current VDRM = 5V, Tcase = 25°C 350 mA IGD Gate non-trigger current At 50% VDRM, Tcase = 125°C 10 mA CURVES 12000 Instantaneous on state current , IT - (A) 10000 8000 6000 4000 min 25°C max 25°C 2000 min 125°C max 125°C 0 0.50 1.00 1.50 2.00 2.50 Instantaneous on state voltage, VT - (V) Fig.2 Maximum & minimum on-state characteristics VTM EQUATION VTM = A + Bln (IT) + C.IT+D.IT Where A = 2.0022 B = -0.2464 C = -0.0000027 D = 0.02699 these values are valid for Tj = 125°C for IT 500A to 8000A 4/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR 15000 130 14000 120 12000 110 Maximum permissible case temperature - (ºC) 13000 Mean Power Dissipation (W) 11000 100 10000 9000 8000 7000 180 6000 120 90 5000 60 30 4000 3000 2000 1000 0 0 2000 4000 6000 90 80 180 70 120 60 90 50 60 40 30 30 20 10 0 0 2000 Mean on-state current, It(av) - (A) Fig.3 On-state power dissipation – sine wave 6000 8000 Fig.4 Maximum permissible case temperature, double side cooled – sine wave 130 15000 120 14000 180 13000 120 110 90 100 12000 60 11000 30 90 10000 Mean Power Dissipation - (W) Maximum permissable Heatsink Temp, ºC 4000 Mean on-state current, It (av) - (A) 80 70 60 50 40 30 9000 8000 7000 d.c. 180 120 90 60 30 6000 5000 4000 3000 20 2000 10 1000 0 0 0 2000 4000 Mean on-state current. It 6000 (av) 8000 - (A) Fig.5 Maximum permissible heatsink temperature, double side cooled – sine wave 0 2000 4000 6000 8000 Mean on-state current, It(av) - (A) Fig.6 On-state power dissipation – rectangular wave 5/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR 130 120 120 d.c. 180 120 90 60 30 100 90 d.c. 100 Maximum permissable Heatsink Temp, ºC Maximum permissible case temperature - (ºC) 110 80 70 60 50 40 30 20 180 120 90 80 60 30 60 40 20 10 0 0 0 2000 4000 6000 Mean on-state current, It 8000 (av) 10000 0 2000 1 Double side cooled Anode side cooled Double side cooled 10 8000 Anode side cooled - (A) 3 4 1.24786361 Ti (s) 0.67007122 0.14563223 0.01981569 1.28702484 Ri (°C/kW) 0.51177271 1.94595762 0.91956601 4.66635596 Ti (s) 2.89822124 0.50524092 Ti (s) Cathode side cooled 2 Ri (°C/kW) Cathode side cooled Ri (°C/kW) 8 (av) 10000 Fig.8 Maximum permissible heatsink temperature, double side cooled – rectangular wave 12 Transient Thermal Resistance (K/kW) 6000 Mean on-state current. It - (A) Fig.7 Maximum permissible case temperature, double side cooled – rectangular wave 0.8334561 0.60621847 1.56769894 0.0358286 10.6466908 2.41723953 1.53684913 0.62607497 4.9592331 3.44130269 0.26943359 0.02350127 10.172444 i 4 Zth [Ri (1 exp(T / Ti )] i 1 6 DRth(j-c) Conduction Tables show the increments of thermal resistance R th(j-c) when the device operates at conduction angles other than d.c. 4 Double side cooling DZth (z) q° sine. rect. 180 0.38 0.26 120 0.44 0.37 90 0.49 0.43 60 0.54 0.49 30 0.58 0.55 15 0.60 0.58 2 0 0.001 4000 0.01 0.1 Time (s) 1 10 Anode Side Cooling DZth (z) q° sine. rect. 180 0.32 0.23 120 0.36 0.31 90 0.41 0.36 60 0.45 0.40 30 0.48 0.45 15 0.49 0.48 Cathode Sided Cooling DZth (z) q° sine. rect. 180 0.33 0.23 120 0.38 0.33 90 0.43 0.37 60 0.47 0.43 30 0.51 0.48 15 0.52 0.51 100 Fig.9 Maximum (limit) transient thermal impedance – junction to case (°C/kW) 6/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR 80 60 260 240 60 Conditions: Tj = 125°C VR = 0 220 50 40 30 20 10 50 200 180 40 160 140 30 120 100 20 80 60 10 40 20 0 1 10 Number of cycles at 50Hz 100 0 1 Fig.10 Multi-cycle surge current 15000 0 100 350 Conditions: Tj = 125°C Vpeak ~ 3100V VRM ~ 2100V snubber as appropriate to control reverse volts Conditions: Tj = 125°C Vpeak ~ 3100V VRM ~ 2100V snubber as appropriate to control reverse volts 300 Qs max = 4285.9*(di/dt) 0.4606 10000 10 Pulse width, tp - (ms) Fig.11 Single-cycle surge current Reverse recovery current, IRR - (A) Stored charge, Qs - (uC) ITSM I2t I2t value - (MA2s) Conditions: Tj = 125°C VR = 0 Pulse width = 10ms Peak half sine forward current, ITSM - (kA) Peak half sine forward current, I TSM - (kA) 70 5000 Qs min = 2236.7*(di/dt) 0.5493 250 IRR max = 52.063*(di/dt) 0.7707 200 150 IRR min = 37.929*(di/dt) 0.8242 100 50 0 0 0 1 2 3 4 5 6 7 8 9 10 Rate of decay of on state current, di/dt - (A/µs) Fig.12 Stored charge 11 0 1 2 3 4 5 6 7 8 9 10 Rate of decay of on state current, di/dt - (A/µs) 11 Fig.13 Reverse recovery current 7/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR 10 9 Gate trigger voltage, V GT - (V) 8 Upper Limit 7 6 Preferred gate drive area 5 4 3 Tj = -40oC 2 Lower Limit Tj = 25oC Tj = 125oC 1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Gate trigger current IGT, - (A) Fig14 Gate Characteristics 30 Lower Limit Upper Limit 5W 25 10W 20W Gate trigger voltage, VGT - (V) 50W 100W 20 150W -40C 15 10 5 0 0 1 2 3 4 5 6 7 8 9 10 Gate trigger current, IGT - (A) Fig. 15 Gate characteristics 8/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Device DCRxxxxH42 DCR5240H52 DCR5890H52 DCR4420H65 DCR4660H65 DCR3640H85 DCR3980H85 Maximum Minimum Thickness Thickness (mm) (mm) 35.15 34.28 35.27 34.4 35.27 34.4 35.3 34.7 35.3 34.7 35.65 35.05 35.65 35.05 Lead length: 420mm Lead terminal connector: M4 ring Package outline type code: H Fig.16 Package outline 9/10 www.dynexsemi.com DCR5240H52 SEMICONDUCTOR IMPORTANT INFORMATION: This publication is provided for information only and not for resale. The products and information in this publication are intended for use by appropriately trained technical personnel. Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and the completeness of the product data for the application. The user is responsible for product selection and ensuring all safety and any warning requirements are met. Should additional product information be needed please contact Customer Service. Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. The information is provided without any warranty or guarantee of any kind. This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the most up to date version and has not been superseded. The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property. The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design and safety precautions should always be followed to protect persons and property. Product Status & Product Ordering: We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for production. The annotations are as follows:Target Information: Preliminary Information: No Annotation: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. The product design is complete and final characterisation for volume production is in progress.The datasheet represents the product as it is now understood but details may change. The product has been approved for production and unless otherwise notified by Dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request. Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. HEADQUARTERS OPERATIONS CUSTOMER SERVICE DYNEX SEMICONDUCTOR LIMITED Doddington Road, Lincoln, Lincolnshire, LN6 3LF United Kingdom. Phone: +44 (0) 1522 500500 Fax: +44 (0) 1522 500550 Web: http://www.dynexsemi.com Phone: +44 (0) 1522 502753 / 502901 Fax: +44 (0) 1522 500020 e-mail: [email protected] Dynex Semiconductor Ltd. Technical Documentation – Not for resale. 10/10 www.dynexsemi.com