LD-201 Series LED displays Flat displays LD-201 Series !External Dimensions (Units : mm) The LD-201 series were designed in response to the need for small, flat displays. These are single-chip, flat displays with high luminance. !Features 1) Planar emission from a single chip. 2) Thin outer casing, multiple units can be coupled together. 3) Long leads are suitable for a wide range of mounting options. 3.18 3.68±0.1 5.58 3.8±0.1 6.0±0.1 1.7 0.38 1.7 6.73±0.1 5.7±0.1 Cathode mark 6.3±0.1 Pin No.1 2 0.6 0.5 2.5±1.0 0.5 24.0Min. 0.6 Pin No.1 2 (2.5) Cathode cut Tolerances are ±0.3 unless otherwise noted : !Selection guide Emitting color Type Red Orange Yellow Green LD-201VR LD-201DU ∗ LD-201YY ∗ LD-201MG ∗ Order-based production. !Absolute maximum ratings (Ta=25°C) Parameter Symbol Green LD-201MG Unit Power dissipation PD 60 60 60 75 mW Forward current Red LD-201VR Orange LD-201DU Yellow LD-201YY IF 20 20 20 25 mA Peak forward current IFP 60∗ 60∗ 60∗ 60∗ mA Reverse voltage VR 3 3 3 3 V Operating temperature Topr −25∼+75 ˚C Storage temperature Tstg −30∼+85 ˚C ∗ Pulse width 1ms duty 1 / 5 LD-201 Series LED displays !Electrical and optical characteristics (Ta=25°C) Parameter Red Symbol Conditions Orange Yellow Green Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Forward voltage VF IF=10mA − 2.0 2.8 − 2.0 2.8 − 2.1 2.8 − 2.1 2.8 V Reverse current IR VR=3V − − 10 − − 10 − − 10 − − 10 µA Peak wavelength λP IF=10mA − 650 − − 610 − − 585 − − 563 − nm Spectral line half width ∆λ IF=10mA − 40 − − 40 − − 40 − − 40 − nm Electrical and optical are guaranteed values per element. !Luminous intensity vs. wavelength Axial Luminous Intensity 1.0 Green Yellow 0.8 Orange Red 0.6 0.4 0.2 0 500 550 600 650 700 750 Wavelength : λP (nm) !Luminous intensity Type Min. Typ. Max. Unit Red LD-201VR 2.2 6.3 − mcd Orange LD-201DU 2.2 6.3 − mcd Yellow LD-201YY 1.4 4.0 − mcd Green LD-201MG 3.6 10 − mcd Color Note1: Measured at IF = 10mA !Operation notes When forming leads, the bend should be at least 2mm from the base of the package. Solder after forming the leads, and ensure that the inside of the LED is not subjected to mechanical stress while it is hot.