ROHM BD9243MUV

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STRUCTURE
Silicon Monolithic Integrated Circuit
NAME OF PRODUCT
DC-AC Inverter Control IC
TYPE
BD9243MUV
FUNCTION
・
・
・
・
・
・
・
・
・
・
36V High voltage process
1ch control with Full-Bridge
Lamp current and voltage sense feed back control
Sequencing easily achieved with Soft Start Control
Short circuit protection with Timer Latch
Under Voltage Lock Out
Circuit protection with quick Shutdown
Mode-selectable the operating or stand-by mode by stand-by pin
BURST mode controlled by PWM and DC input
VQFN024V4040 small package
○Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Limits
Unit
Supply Voltage
VCC
36
V
BST PIN
BST
40
V
SW PIN
SW
36
V
BST-SW voltage difference
BST-SW
15
V
Operating Temperature Range
Topr
-40~+85
℃
Storage Temperature Range
Tstg
-55~+150
℃
Maximum Junction Temperature
Tjmax
+150
℃
Pd
700*
mW
Power Dissipation
*
Pd derate at 5.6mW/℃ for temperature above Ta = 25℃ (When mounted on a PCB 70.0mm×70.0mm×1.6mm)
〇Operating condition
Parameter
Supply voltage
BST voltage
Symbol
Limits
Unit
VCC
8.0~30.0
V
BST
5.0~37.5
V
BST-SW
5.0~14.0
V
oscillation frequency
FOUT
30~110
kHz
BCT oscillation frequency
fBCT
0.05~1.00
kHz
BST-SW voltage difference
REV. A
2/4
○Electric Characteristics(Ta=25℃、VCC=24V、STB=3.0V)
Parameter
Limits
Symbol
Unit
MIN.
TYP.
MAX.
Conditions
((WHOLE DEVICE))
Operating current
Icc1
-
2.2
5.0
mA
Stand-by current
Icc2
-
0
10
μA
FOUT=60kHz, FB=SW=GND, BST=OPEN
((STAND BY CONTROL))
Stand-by voltage H
VstH
2.0
-
VCC
V
System ON
Stand-by voltage L
VstL
-0.3
-
0.8
V
System OFF
Operating voltage (VCC)
V_VCCUVP
6.17
6.50
6.83
V
Hesteresis width (VCC UVLO)
⊿V_VCCUVP
0.37
0.50
0.63
V
REG output voltage
VREG
7.35
7.50
7.65
V
REG source current
IREG
20
-
-
mA
RT Output Voltage
VRT
1.05
1.50
1.95
V
SRT ON Resistor value
RSRT
-
100
200
Ω
Soft start Charge Current
TSS
1.5
2.0
2.5
uA
SS term start voltage
VSS_ST
0
50
150
mV
SS term end voltage
VSS_END
2.8
3.0
3.2
V
BOSC Max voltage
VBCTH
1.94
2.00
2.06
V
fBCT=0.3kHz
BOSC Min voltage
VBCTL
0.4
0.5
0.6
V
fBCT=0.3kHz
BOSC frequency
FBCT
291
300
309
Hz
BCT=10000pF
IS threshold voltage
VIS
1.225
1.250
1.275
V
VS threshold voltage
VVS
1.215
1.250
1.285
V
IS source current 1
IIS1
-
-
0.9
μA
DUTY=2.2V
IS source current 2
IIS2
40
50
60
μA
DUTY=0V IS=1.0V
VS source current
IVS
-
-
0.9
μA
IS COMP detect voltage
VISCOMP
0.606
0.625
0.644
V
LN output sink resistance
RsinkLN
1.5
3
6
Ω
LN output source resistance
RsourceLN
5
10
20
Ω
HN output sink resistance
RsinkHN
1.5
3
6
Ω
HN output source resistance
RsourceHN
5
10
20
Ω
VBST-VSW=7.0V
MAX DUTY
MAX DUTY
46.0
48.5
49.5
%
FOUT=60kHz, SW=GND, BST=OPEN
OFF period
TOFF
100
200
400
ns
SW=GND, BST=OPEN
Drive output frequency
FOUT
57.9
60.0
62.1
kHz
RT=82kΩ
((VCC UVLO BLOCK))
((REG BLOCK))
VCC>8.5V, Io=10mA
((OSC BLOCK)
((SOFT START BLOCK))
((BOSC BLOCK))
((FEED BACK BLOCK))
((OUTPUT BLOCK))
((TIMER
LATCH BLOCK)
CP timer latch detect voltage
VCP
1.9
2.0
2.1
V
CP timer latch charge current
ICP
0.85
1.0
1.15
μA
COMP1 over voltage detect voltage
VCOMP1
3.88
4.00
4.12
V
Hysteresis width (COMP1)
⊿VCOMP1
0.15
0.20
0.25
V
COMP2 over voltage detect voltage
VCOMP2
3.88
4.00
4.12
V
((COMP BLOCK))
(This product is not designed to be radiation-resistant.)
REV. A
VBST-VSW=7.0V
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〇Package Dimensions
〇Block Diagram
Device Mark
VCC
RT
REG
REG
BLOCK
D9243
STB
BLOCK
STB
BCT
OSC
BOSC
DUTY
DUTY
BLOCK
SYSTEM ON/OFF
SS
Lot No.
BST1
BST2
FB
IS
F/B
BLOCK ①
VS
PWM
BLOCK
①
SS
CT
LOGIC
BLOCK
①
HN1
HN
BLOCK①
HN2
SW1
SW2
REG
PROTECT
BLOCK
LN
BLOCK②
GND
VCC
COMP1
COMP2
CP
UVLO
BLOCK
LN1
LN2
PGND
SRT
VQFN024V4040 (UNIT:mm)
○Pin Description
PIN
PIN
PIN NAME
FUNCTION
No.
PIN NAME
FUNCTION
No.
1
GND
2
BCT
Ground
13
BST1
Boot-strap input for HN1 output
14
REG
Regulator output
15
LN1
NMOS FET driver (Ch. 1)
16
PGND
Power Ground for FET drivers
External capacitor between BCT and GND for adjusting the
BURST triangle oscillator
3
DUTY
Control Burst-dimming by PWM signal or DC
External capacitor between SS and GND for Soft Start Control
4
SS
and detect the time of Soft Start
5
CP
External capacitor between CP and GND for timer latch
17
LN2
NMOS FET driver (Ch. 2)
6
FB
Error amplifier output
18
BST2
Boot-strap input for HN2 output
7
IS
Error amplifier input 2
19
HN2
NMOS FET driver (Ch. 2)
8
VS
Error amplifier input 1
20
SW2
Lower rail voltage for HN2 output
9
COMP2
Input of over voltage detector2
21
VCC
Power supply input with UVLO Protection
10
COMP1
Input of over voltage detector1
22
STB
Stand-by switch
11
SW1
Lower rail voltage for HN1 output
23
SRT
External resister from SRT to RT for adjusting the start-up Triangle
oscilator
External resistor between RT and GND for adjustment frequency of saw
12
HN1
NMOS FET driver (Ch. 1)
24
RT
tooth wave
REV. A
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〇NOTE FOR USE
1. When designing the external circuit, including adequate margins for variation between external devices and IC. Use adequate
margins for steady state and transient characteristics.
2. The circuit functionality is guaranteed within of ambient temperature operation range as long as it is within recommended
operating range. The standard electrical characteristic values cannot be guaranteed at other voltages in the operating ranges,
however the variation will be small.
3. Mounting failures, such as misdirection or miscounts, may harm the device.
4. A strong electromagnetic field may cause the IC to malfunction.
5. The GND pin should be the location within ±0.3V compared with the PGND pin.
6. If the voltage between VCC and I/O pins or GND and I/O pins is in opposite from the normal potential difference, unusual
current flow into pins may occur which can destroy the IC. To avoid such occurrence it is recommended to place protection
diodes for prevention against backward current flow.
7. BD9243MUV incorporate a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee
its operation of the thermal shutdown circuit is assumed.
8. Absolute maximum ratings are those values that, if exceeded, may cause the life of a device to become significantly shortened.
Moreover, the exact failure mode caused by short or open is not defined. Physical countermeasures, such as a fuse,
need to be considered when using a device beyond its maximum ratings.
9. About the external FET, the parasitic Capacitor may cause the gate voltage to change, when the drain voltage is switching.
Make sure to leave adequate margin for this IC variation.
10. By STB voltage, BD9243MUV are changed to 2 states. Therefore, do not input STB pin voltage between one state and the other
state (0.8~2.0V).
11. The pin connected a connector need to connect to the resistor for electrical surge destruction.
12.This IC is a monolithic IC which (as shown is Fig.4)has P+ substrate and between the various pins. A P-N junction is
formed from this P layer of each pin. For example, the relation between each potential is as follows,
○(When GND > PinB and GND > PinA, the P-N junction operates as a parasitic diode.)
○(When PinB > GND > PinA, the P-N junction operates as a parasitic transistor.)
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits as well as operation faults and physical damage. Accordingly you must not use methods by which
parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin
Transistor (NPN)
Resistance
(PinA)
C
(PinB)
P
P
N
P
P
N
N
N
B
GND
P
P
N
N
P substrate
N
P substrate
GND
GND
Parasitic diode
E
Parasitic diode
(PinB)
B
(PinA)
C
E
Parasitic diode
Parasitic
GND
GND
Other adjacent components
Fig.4. Simplified structure of a Bipolar IC
REV. A
Notice
Notes
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