Datasheet - Diodes Incorporated

ZXSC410/ZXSC420/ZXSC440
DC-DC BOOST SWITCHING CONTROLLERS
Description
Pin Assignments
ZXSC410 (SOT26)
The ZXSC410/420/440 are DC-DC boost controllers. Their wide input
voltage range makes them suitable for operation for a number of
battery configurations including single Li-Ion cell and 2~3
alkaline/NiCd/NiMH cells. Using high gain Diodes Zetex-brand
switching npn-transistors allows high-voltage boost ratios and/or high
output current depending on the transistor. The ZXSC410/440 has a
shutdown feature that can also be used for some dimming
functionality. ZXSC420/440 includes an End of Regulation flag that
can be used to indicate when the regulator is no longer able to
maintain the regulated output voltage/current or has reached the
required current/voltage. The ZXSC440 combines the features of the
ZXSC410 and ZXSC420 into one device.
VCC 1
GND 2
STDN 3
ZXSC420 (SOT26)
VCC 1
GND 2
EOR 3
Features









8 DRIVE
7 VFB
6 SENSE
ZXSC440 (MSOP-8)
1.65V to 8V Supply Range
Typical Output Regulation of ±1%
Over 85% Typical Efficiency
Output Currents Up to 300mA
4.5µA Typical Shutdown Current ZXSC410/440
End of Regulation Output ZXSC420/440
Available in SOT26 and MSOP-8
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
DRIVE
VFB
SENSE
N/C
1
2
3
4
8
7
6
5
VCC
GND
EOR
STDN
Applications




Notes:
8 DRIVE
7 VFB
6 SENSE
System Power for Battery Portable Products
LCD Bias
Local Voltage Conversion
High-Brightness LED Driving
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
22µH
ZHCS2000
ZXTN25012EFH
100µF
22µF
ZXSC410
18mΩ
ZXSC410/ZXSC420/ZXSC440
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820mΩ
August 2015
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ZXSC410/ZXSC420/ZXSC440
Pin Descriptions
Pin Name
ZXSC410
Pin Number
ZXSC420
ZXSC440
Function
VCC
GND
STDN
EOR
1
1
8
Supply Voltage
2
3
—
2
—
3
7
5
6
Sense
4
4
3
VFB
5
5
2
Drive
6
6
1
NC
—
—
4
Ground
Shutdown (ZXSC410 and ZXSC440)
End of regulation (ZXSC420 and ZXSC440)
Inductor current sense input. Internal threshold voltage set to 28mV.
Connect external sense resistor.
Reference voltage. Internal threshold set to 300mV.
Connect external resistor network to set output voltage.
Drive output for external switching transistor.
Connect to base or gate of external switching transistor.
No connection
Functional Block Diagram
ZXSC410/ZXSC420/ZXSC440
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ZXSC410/ZXSC420/ZXSC440
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Parameter
Rating
Unit
VCC
-0.3 to +10
V
Drive
-0.3 to VCC +0.3
V
EOR
-0.3 to VCC +0.3
V
STDN
-0.3 to The lower of (+5.0) or (VCC +0.3)
V
VFB, Sense
Operating Temperature
Storage Temperature
Power Dissipation @ +25°C
-0.3 to The lower of (+5.0) or (VCC +0.3)
-40 to +85
-55 to +120
450
°C
°C
mW
Caution:
V
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
VCC
Parameter
Min
Max
1.8
8
V
-40
+85
°C
Shutdown Threshold
1.5
VCC
V
Shutdown Threshold
0
0.55
V
TA
VCC Range
Ambient Temperature Range
VIH
VIL
Electrical Characteristics
Symbol
Unit
(VCC = 3V, @TA = +40°C to +85°C, unless otherwise specified.)
Parameter
Quiescent Current
Conditions
Min
Typ
Max
Unit
VCC = 8V
-
-
-
220
µA
Shutdown Current
-
4.5
-
µA
Efficiency
50mA > IOUT > 300mA
-
85
-
%
ACCREF
Reference Tolerance
-3.0
-
+3.0
%
TCOREF
Reference Temp Co.
1.8V < VCC < 8V
-
-
0.005
-
%/°C
1.8V < VCC < 8V
-
-
1.7
-
µs
-
-
200
kHz
mV
IQ (Note 4)
ISTDN
EFF (Note 5)
TDRV
Discharge Pulse Width
Operating Frequency
FOSC
Input Parameters
Sense Voltage (Note 5)
VSENSE
ISENSE
VFB
IFB (Note 6)
-
22
28
34
Sense Input Current
VFB = 0V; VSENSE = 0V
-1
-7
-15
µA
Feedback Voltage
TA = +25°C
291
300
309
mV
Feedback Input Current
VFB = 0V; VSENSE = 0V
-
-1.2
-
-4.5
µA
-
0.5
-
%/V
VIN > 2V, VOUT = VIN
Line Voltage Regulation
dVLN
Output Parameters
Output Current
IOUT (Note 7)
300
-
-
mA
IDRIVE
Transistor Drive Current
VDRIVE = 0.7V
2
3.4
5
mA
VDRIVE
Transistor Voltage Drive
0
-
VCC -0.4
V
CDRIVE
MOSFET Gate Drive cpbty
1.8V < VCC < 8V
-
VOHEOR
EOR Flag Output High
IEOR = -300nA
VOLEOR
EOR Flag Output Low
TEOR
EOR Delay Time
dILD
Load Current Regulation
Notes:
-
300
-
pF
2.5
-
VCC
V
IEOR = 1mA
0
-
1.15
V
TA = +25°C
-
70
195
250
µs
-
-
0.01
%/mA
4. Excluding gate/base drive current.
5. Effective sense voltage observed when switching at approximately 100kHz. The internal comparator propagation delay of approximately 1µs causes an
increase in the effective sense voltage over a DC measurement of the sense voltage.
6. IFB is typically half of these values at 3V.
7. System not device specification, including recommended transistors.
ZXSC410/ZXSC420/ZXSC440
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ZXSC410/ZXSC420/ZXSC440
Typical Characteristics
29.0
8
ISTDN = 0V
SHUTDOWN CURRENT (µA)
SENSE VOLTAGE (mV)
TA = 85°C
28.5
TA = 25°C
28.0
27.5
TA = -40°C
27.0
6
TA = 85°C
5
TA = 25°C
4
3
2
1
2
3
4
5
6
7
INPUT VOLTAGE (V)
Input Voltage vs. Sense Voltage
1
8
3.6
2
3
4
5
6
7
INPUT VOLTAGE (V)
Input Voltage vs. Shutdown Voltage
8
310
3.5
FEEDBACK VOLTAGE (mV)
TA = 85°C
DRIVE CURRENT (mA)
TA = -40°C
7
TA = 25°C
3.4
TA = -40°C
3.3
TA = 25°C
TA = -40°C
300
T A = 85°C
290
3.2
1
2
3
4
5
6
7
INPUT VOLTAGE (V)
Input Voltage vs. Drive Current
ZXSC410/ZXSC420/ZXSC440
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1
2
3
4
5
6
7
INPUT VOLTAGE (V)
Input Voltage vs. Feedback Voltage
8
August 2015
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ZXSC410/ZXSC420/ZXSC440
Application Information
Functional Blocks
Bandgap Reference
All threshold voltages and internal currents are derived from a temperature compensated bandgap reference circuit with a reference voltage of
1.22V nominal.
Dynamic Drive Output
Depending on the input signal, the output is either “LOW” or “HIGH”. In the high state a 2.5mA current source, (max drive voltage = V CC -0.4V)
drives the base or gate of the external transistor. In order to operate the external switching transistor at optimum efficiency, both output states
are initiated with a short transient current in order to quickly discharge the base or the gate of the switching transistor.
Switching Circuit
The switching circuit consists of two comparators, Comp1 and Comp2, a gate U1, a monostable and the drive output. Normally the DRIVE output
is “HIGH”; the external switching transistor is turned on. Current ramps up in the inductor, the switching transistor and external current sensing
resistor. This voltage is sensed by comparator, Comp2, at input I SENSE. Once the current sense voltage across the sensing resistor exceeds
20mV, comparator Comp2 through gate U1 triggers a re-triggerable monostable and turns off the output drive stage for 2μs. The inductor
discharges to the load of the application. After 2μs a new charge cycle begins, thus ramping the output voltage. When the output voltage reaches
the nominal value and VFB gets an input voltage of more than 300mV, the monostable is forced “on” from Comp1 through gate U1, until the
feedback voltage falls below 300mV. The above action continues to maintain regulation.
EOR, End of Regulation Detector (ZXSC420/440)
The EOR circuit is a retriggerable 120μs monostable, which is re-triggered by every down regulating action of comparator Comp1. As long as
regulation takes place, output EOR is “HIGH” (high impedance, 100K to VCC). Short dips of the output voltage of less than 120μs are ignored. If
the output voltage falls below the nominal value for more than 120μs, output EOR goes ”LOW”. The reason for this to happen is usually a slowly
progressing drop of input voltage from the discharging battery. Therefore, the output voltage will also start to drop slowly. With the EOR detector,
batteries can be used to the ultimate end of discharge, with enough time left for a safe shutdown. It can also be used in high-voltage photoflash
with the ZXSC440 to show when the capacitor is fully charged.
Shutdown Control
The ZXSC410/440 offers a shutdown mode that consumes a standby current of less than 5µA. The ZXSC410/440 is enabled, and is in normal
operation, when the voltage at the STDN pin is between 1V and 8V (and also open circuit). The ZXSC410/440 is shutdown with the driver
disabled when the voltage at the STDN pin is 0.7V or lower. The STDN input is a high impedance current source of 1µA typ. The driving device
can be an open-collector or -drain or a logic output with a “High” voltage of 5V max. The device shutdown current depends on the supply voltage,
(see typical characteristics graph).The ZXSC440 with its STDN pin and EOR pins can be used as a camera flash driver.
The STDN pin is used to initiate the high-voltage capacitor charge cycle. The EOR pin is used as flag to show when the capacitor has been
charged to the appropriate level.
A transformer is used to boost the voltage. If designing a transformer, bear in mind that the primary current may be over an amp and, if this flows
through 10 turns, the primary flux will be 10 Amp. Small number of turns and small cores will need an air gap to cope with this value without
saturation. Secondary winding capacitance should not be too high as this is working at 300V and could soon cause excessive losses.
ZXSC410/ZXSC420/ZXSC440
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ZXSC410/ZXSC420/ZXSC440
Application Information (continued)
External Component Selection
Switching Transistor Selection
The choice of switching transistor has a major impact on the converter efficiency. For optimum performance, a bipolar transistor with low VCE(SAT)
and high gain is required. The VCEO of the switching transistor is also an important parameter as this sees the full output voltage when the
transistor is switched off. Diodes SOT26 transistors are an ideal choice for this application.
Schottky Diode Selection
As with the switching transistor, the Schottky rectifier diode has a major impact on the converter efficiency. A Schottky diode with a low forward
voltage and fast recovery time should be used for this application.
The diode should be selected so that the maximum forward current rating is greater or equal to the maximum peak current in the inductor, and
the maximum reverse voltage is greater or equal to the output voltage. The Diodes ZHCS Series meets these needs.
Inductor Selection
The inductor value must be chosen to satisfy performance, cost and size requirements of the overall solution.
Inductor selection has a significant impact on the converter performance. For applications where efficiency is critical, an inductor with a series
resistance of 500mΩ or less should be used.
Output Capacitors
Output capacitors are a critical choice in the overall performance of the solution. They are required to filter the output and supply load transient
currents. There are three parameters which are paramount in the selection of the output capacitors, capacitance, I RIPPLE and ESR. The
capacitance value is selected to meet the load transient requirements. The capacitors I RIPPLE rating must meet or exceed the current ripple of the
solution.
The ESR of the output capacitor can also affect loop stability and transient performance. The capacitors selected for the solutions and indicated
in the reference designs are optimized to provide the best overall performance.
Input Capacitors
The input capacitor is chosen for its voltage and RMS current rating. The use of low ESR electrolytic or tantalum capacitors is recommended.
Capacitor values for optimum performance are suggested in the reference design section.
Also note that the ESR of the input capacitor is effectively in series with the input and hence contributes to efficiency losses in the order of I RMS2
ESR.
Peak Current Definition
In general, the IPK value must be chosen to ensure that the switching transistor, Q1, is in full saturation with maximum output power conditions,
assuming worse case input voltage and transistor gain under all operating temperatureextremes.Once I PK is decided, the value of RSENSE can be
determined by:
RSENSE 
VSENSE
IPK
Sense Resistor
A low-value sense resistor is required to set the peak current. Power in this resistor is negligible due to the low sense voltage threshold, V SENSE.
ZXSC410/ZXSC420/ZXSC440
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ZXSC410/ZXSC420/ZXSC440
Application Information (cont.)
Output Power Calculation
By making the above assumptions for inductance and peak current the output power can be determined by:
POUT = IAV x VIN x η = (Watts)
Where:
IAV 
IPK x tON  tDIS 
2 tON  tOFF 
and,
tON 
IPK  L
VIN
and,
tDIS 
IPK  L
V OUT  VIN
and,
tOFF ≈ 1.7μs (internally set by ZXSC410/420/440)
and,
η = efficiency i.e. 100% = 1
Operating frequency can be derived by:
f
1
tON  tOFF
Output Adjustment
The ZXSC410/420/440 are adjustable output controllers allowing the end user the maximum flexibilty. They can be used both as switching
voltage regulators and as constant current regulators. A feedback voltage of 300mV provides a good compromise for both voltage and current
regulation.
For a constant output voltage operation a potential divider network is connected as follows:
VOUT
RA
VFB
RB
GND
The output voltage is determined by the equation:
 RA
VOUT  VFB 1 
 RB




where VFB = 300mV
The resistor values, RA and RB, should be maximized to improve efficiency and decrease battery drain but not so much that they strongly affect
the accuracy. Optimization can be achieved by assuming a current of IFB(MAX) = 2.2µA out of the VFB pin. Output is adjustable from VFB to the
(BR)VCEO of the switching transistor, Q1.
Note: For the reference designs, RA is assigned the label R2 and RB the label R3.
The ZXSC410/420/440 can also be used to generate a constant current between boosted output rail and the VFB pin by connecting a single
resistor between VFB and GND.
ZXSC410/ZXSC420/ZXSC440
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ZXSC410/ZXSC420/ZXSC440
Application Information (cont.)
LED Driving
The ZXSC410/420/440 make simple low-voltage boost LED drivers; The current setting resistor value is determined by the following equation:
ILED 
VFB
RLED
VFB
RLED
GND
Open-Circuit Protection
As a boost converter, if the load (LED chain) should become open-circuit, a Zener diode can be connected across the LED chain preventing
overvoltage and possible damage to the main switching transistor. The Zener diodes should be selected by ensuring its voltage rating is higher
than the combined forward voltage of the LED chain. Under open circuit conditions the current in the Zener diode defines the output current as:
VFB
IZ 
RZ
The circuit example below give an open circuit output
current of 300µA.
To
converter
ZD1
RZ
VFB
1kΩ
RLED
GND
ZXSC410/ZXSC420/ZXSC440
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ZXSC410/ZXSC420/ZXSC440
Application Information (cont.)
Dimming Control
There are many types of dimming control that can be implemented for the ZXSC410/420/440.
30
Dimming Control Using the Shutdown Pin
To implement this method of brightness control on the ZXSC410/440,
a PWM signal with an amplitude between 0.7V and VCC at a
frequency of 120Hz or above (to eliminate LED flicker) should be
applied to the STDN pin. The LED current and hence LED brightness
is linearly proportional to the duty cycle ratio, so for brightness control
adjust the duty cycle ratio as necessary. For example, a 10% duty
cycle equates to 10% of full LED brightness.
4 White LEDs
VIN = VEN = 3.3V
OUTPUT CURRENT (A)
The first method uses the shutdown pin (only ZXSC410 and
ZXSC440). By injecting a PWM waveform on this pin and varying the
duty cycle, LED current and hence LED brightness can be adjusted.
20
10
0
100
40
60
20
DUTY CYCLE (%)
LED Current vs. Duty Cycle
80
0
Dimming Control Using a DC Voltage
For applications where a PWM signal is not available or for the ZXSC420 a DC voltage can be used to control dimming by modulating the V FB
pin.
By adding resistors R2 and R3 and applying a DC voltage, the LED
current can be adjusted from 100% to 0%. As the DC voltage
increases, the voltage drop across R2 increases and the voltage drop
across R1 decreases, thus reducing the current through the LEDs.
Selection of R2 and R3 should ensure that the current from the DC
voltage is much less than the LED current and much larger than the
feedback current. The component values in the diagram above
represent 0% to 100% dimming control from a 0 to 2V DC voltage.
VFB
VDC
R3
R2
67k
10k
R1
Dimming Control Using a Filtered PWM Signal
The filtered PWM signal can be considered as an adjustable
DC voltage by applying a RC filter (R4 and C1). The values
shown in the diagram below are configured to give 0% to
100% dimming for a 1kHz to 100kHz PWM signal with a 2V
amplitude. e.g. a 50% duty cycle will give 50% dimming.
VFB
R4
R3
R2
PWM
10k
C1 67k
10k
R1
0.1µF
ZXSC410/ZXSC420/ZXSC440
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ZXSC410/ZXSC420/ZXSC440
Application Information (cont.)
Dimming Control using a Logic Signal
For applications where the LED current needs to be adjusted in
discrete steps a logic signal can be applied as shown in the diagram
below.
When Q1 is ‘off’, R1 sets the minimum LED current. When Q1 is ‘on’,
R2 sets the LED current that will be added to the minimum LED
current. The formula for selecting values for R1 and R2 are given
below:
MOSFET ‘off’
ILED(MIN ) 
VFB
R2
LOGIC
SIGNAL
Q1
2N7002
R1
V FB I
R1
MOSFET ‘on’
ILED(MAX ) 
V FB  I
LED(MIN )
R2
Layout Issues
Layout is critical for the circuit to function in the most efficient manner in terms of electrical efficiency, thermal considerations and noise.
For ‘step-up converters’ there are four main current loops, the input loop, power-switch loop, rectifier loop and output loop. The supply charging
the input capacitor forms the input loop. The power-switch loop is defined when Q1 is ‘on’, current flows from the input through the inductor, Q1,
RSENSE and to ground. When Q1 is ‘off’, the energy stored in the inductor is transferred to the output capacitor and load via D1, forming the
rectifier loop. The output loop is formed by the output capacitor supplying the load when Q1 is switched back off.
To optimize for best performance, each of these loops is kept separate from one another and interconnected with short, thick traces, thus
minimizing parasitic inductance, capacitance and resistance. Also the R SENSE resistor should be connected with minimum trace length, between
emitter lead of Q1 and ground, (again minimizing stray parasitics).
ZXSC410/ZXSC420/ZXSC440
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Application Examples
ZXSC410 DC-DC Boost Voltage Regulators
VIN = 2.5V to 4.2V, VOUT = 5V; ILOAD = 100mA
22µH
VIN = 2.5V to 4.2V
ZHCS2000
ZXTN25012EFH
22µF
C3
100nF
R3
16kΩ
22µF
ZXSC410
100mΩ
100
90
VIN = 3.6V
EFFICIENCY (%)
100
EFFICIENCY (%)
1kΩ
VIN = 4.2V
80
ILOAD = 10mA
90
ILOAD = 100mA
80
ILOAD = 60mA
VIN = 3V
70
0
20
40
60
80
LOAD CURRENT (mA)
Load Current vs. Efficiency
70
2.5
100
Document number: DS33618 Rev. 6 - 2
3.5
4.0
INPUT VOLTAGE (V)
Input Voltage vs. Efficiency
Switching Waveform
ZXSC410/ZXSC420/ZXSC440
3.0
Output Ripple
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ZXSC410/ZXSC420/ZXSC440
Application Examples (continued)
Triple Output TFT Bias Generator
C7
1µF
C3
BAT54S
1µF
VIN
4.2V ~ 3V
BAT54S
U1
V CC
Q1 ZXTN
25012EFH
D1
BAT54
VDRIVE
R2
30kΩ
STDN ISENSE
C1
GND
10µF
ZXSC410
C8
1µF
C4
1µF
L1
22µH
VON
27V, 10mA
AVDD
9V, 180mA
C2
47µF
V FB
R3
1kΩ
R1
22mΩ
C6
1µF
BAT54S
C5
VOFF
-9V, 10mA
1µF
ZXSC410 as Triple Output TFT Bias
Sequencing AVDD and VON
By adding the circuit below to the LCD bias output (V ON) of
the converter, a 10ms delay can be achieved between AVDD
power up and VON power up. The circuit operates by a delay
in turning the PMOS transistor on, which transfers to a 10ms
delay between input and output of the circuit.
The delay is set by the RC time constant of R1 and C1. The
diode, D1, discharges the gate of the PMOS when the main
system supply is turned off, guaranteeing a delay every turn
on cycle.
ZXSC410/ZXSC420/ZXSC440
Document number: DS33618 Rev. 6 - 2
LCD Bias
Voltage
VON
Q1
ZXMP3A13F
C1
Sequenced Output
10ms Delay
0.1µF
System
Voltage
AVDD
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R1
470k
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ZXSC410/ZXSC420/ZXSC440
Application Examples (cont.)
Battery Powered Two 1W LED Lamp
This application shows the ZXSC410/420/440 driving 2 serial LEDs. The input voltage ranges from 2V to 3.6V with a maximum output current of
360mA from 2.6V input.
The wide input voltage range allows the use of different battery cell combinations. This could be dual alkaline cells with voltage starting from 3V
down to 2V or triple NiCad/NiMH cells with voltage starting from 3.6V down to 2.7V.
22µH
ZHCS2000
ZXTN25012EFH
100µF
22µF
ZXSC410
18mΩ
820mΩ
100
0.4
OUTPUT CURRENT (A)
EFFICIENCY (%)
90
80
70
0.2
60
50
3.6
3.4
3.2
3.0
2.8 2.6 2.4
INPUT VOLTAGE (V)
Efficiency vs. Input Voltage
ZXSC410/ZXSC420/ZXSC440
Document number: DS33618 Rev. 6 - 2
2.2
2.0
0.0
3.6
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3.4
3.2
3.0 2.8 2.6 2.4
INPUT VOLTAGE (V)
LED Current vs. Input Voltage
2.2
2.0
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ZXSC410/ZXSC420/ZXSC440
Application Examples (cont.)
High-Current LED Photoflash
The input voltage is 3V with a maximum pulsed output current of 1A for 2ms.
C3
1µF
L1
D1 BAT54
SW2
12µH
SW1
VBATT
Q1
ZXTN
25012
EFH
U1
V CC
V DRIVE
STDN ISENSE
GND
C1
1µF
C2
150µF
V FB
R3
22mΩ
ZXSC410
R4
100mΩ
Charging mode:
Discharging mode:
SW1 closed,
SW1 open,
R1
10kΩ
SW2 open
SW2 closed
Operation
In charging mode, with SW1 closed and SW2 open, the ZXSC410/420/440 is configured as a typical boost converter, charging capacitor C2 up
the regulated output voltage set by the ratio of R1 and R2. This is typically 16V. The peak current of the converter (current drawn from the
battery) is controlled by R3 plus R4, and is typically 280mA for this application. When C2 is charged to 16V the SW1 is opened and SW2 is
closed, converting the ZXSC400 to a step-down converter to provide a 1A constant current for 2ms to the photoflash LED. During step-down
operation, current flows from C2 through the photoflash LED, L1, U2 and is returned to C2 through R3. This means that the peak current is set at
a higher value than in charging mode, typically 1A. When the current reaches its peak value, U2 is switched off and current flows from L1
through the Schottky diode in U2, to the photoflash LED. This cyclic process is repeated until C2 is discharged.
ZXSC410/ZXSC420/ZXSC440
Document number: DS33618 Rev. 6 - 2
14 of 17
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August 2015
© Diodes Incorporated
ZXSC410/ZXSC420/ZXSC440
Ordering Information
Device
Part Mark
Package Code
Packaging
ZXSC410E6TA
ZXSC420E6TA
C410
C420
ZXSC
440
E6
E6
SOT26
SOT26
Quantity
3,000
3,000
X8
MSOP-8EP
1,000
ZXSC440X8TA
7” Tape & Reel
Part Number Suffix
TA
TA
TA
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
SOT26
D
E1
SOT26
Dim Min Max
Typ
A1 0.013 0.10
0.05
A2 1.00 1.30
1.10
A3 0.70 0.80
0.75
b
0.35 0.50
0.38
c
0.10 0.20
0.15
D
2.90 3.10
3.00
e
0.95
e1
1.90
E
2.70 3.00
2.80
E1 1.50 1.70
1.60
L
0.35 0.55
0.40
a
8°
a1
7°
All Dimensions in mm
E
b
a1
e1
A2
A3
A1
Seating Plane
e
L
c
a
MSOP-8
D
4x
10
°
0.25
E Gauge Plane
x
Seating Plane
a
y
4x10°
L
Detail C
1
b
E3
A3
A2
A
e
A1
ZXSC410/ZXSC420/ZXSC440
Document number: DS33618 Rev. 6 - 2
E1
c
See Detail C
15 of 17
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MSOP-8
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e
0.65
L 0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
August 2015
© Diodes Incorporated
ZXSC410/ZXSC420/ZXSC440
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
SOT26
C1
Y1
G
Dimensions Value (in mm)
C
2.40
C1
0.95
G
1.60
X
0.55
Y
0.80
Y1
3.20
C
Y
X
MSOP-8
X
C
Y
Dimensions Value (in mm)
C
0.650
X
0.450
Y
1.350
Y1
5.300
Y1
ZXSC410/ZXSC420/ZXSC440
Document number: DS33618 Rev. 6 - 2
16 of 17
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August 2015
© Diodes Incorporated
ZXSC410/ZXSC420/ZXSC440
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
ZXSC410/ZXSC420/ZXSC440
Document number: DS33618 Rev. 6 - 2
17 of 17
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August 2015
© Diodes Incorporated