Quad D Flip-Flop with Common Clock and Reset

MC74HC175A
Quad D Flip-Flop with
Common Clock and Reset
High−Performance Silicon−Gate CMOS
The MC74HC175A is identical in pinout to the LS175. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
This device consists of four D flip−flops with common Reset and
Clock inputs, and separate D inputs. Reset (active−low) is
asynchronous and occurs when a low level is applied to the Reset
input. Information at a D input is transferred to the corresponding Q
output on the next positive going edge of the Clock input.
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MARKING
DIAGRAMS
16
SOIC−16
D SUFFIX
CASE 751B
16
1
1
Features
•
•
•
•
•
•
•
•
•
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7 A
Chip Complexity 166 FETs or 41.5 Equivalent Gates
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
HC175AG
AWLYWW
16
TSSOP−16
DT SUFFIX
CASE 948F
16
1
HC
175A
ALYWG
G
1
A
L, WL
Y, YY
W, WW
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
November, 2014 − Rev. 6
1
Publication Order Number:
MC74HC175A/D
MC74HC175A
RESET
1
16
VCC
Q0
2
15
Q3
Q0
3
14
Q3
D0
4
13
D3
D1
5
12
D2
Q1
6
11
Q2
Q1
7
10
Q2
GND
8
9
CLOCK
9
D0
4
D1
5
DATA
INPUTS
2
3
7
6
10
11
15
14
D2 12
D3 13
RESET
CLOCK
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
INVERTING
AND
NONINVERTING
OUTPUTS
1
PIN 16 = VCC
PIN 8 = GND
Figure 1. Pin Assignment
Figure 2. Logic Diagram
FUNCTION TABLE
Inputs
Outputs
Reset
Clock
D
L
H
H
H
X
X
H
L
X
L
Q
Q
L
H
H
L
L
H
No Change
ORDERING INFORMATION
Package
Shipping†
MC74HC175ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC175ADR2G
SOIC−16
(Pb−Free)
2500 / Tape & Reel
MC74HC175ADTR2G
TSSOP−16
(Pb−Free)
2500 / Tape & Reel
NLV74HC175ADTR2G*
TSSOP−16
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
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2
MC74HC175A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
– 0.5 to + 7.0
V
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
VCC
DC Supply Voltage (Referenced to GND)
Vin
Vout
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air,
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
SOIC Package†
TSSOP Package†
_C
260
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
600
500
400
ns
Functional operation above the stresses listed in the Recommended Operating Ranges is not
implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may
affect device reliability.
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3
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HC175A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
– 55 to
25_C
v 85_C
v 125_C
Unit
VIH
Minimum High−Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
42
V
VIL
Maximum Low−Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout| v 20 mA
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.80
0.5
0.9
1.35
1.80
0.5
0.9
1.35
1.80
V
VOH
Minimum High−Level Output
Voltage
Vin = VIH or VIL
|Iout| v 20 mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Vin = VIH or VIL
VOL
Maximum Low−Level Output
Voltage
|Iout| v 2.4 mA
|Iout| v 4.0 mA
|Iout| v 5.2 mA
Vin = VIH or VIL
|Iout| v 20 mA
Vin = VIH or VIL
|Iout| v 2.4 mA
|Iout| v 4.0 mA
|Iout| v 5.2 mA
V
Iin
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
mA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 mA
6.0
4
40
160
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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4
MC74HC175A
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
– 55 to
25_C
v 85_C
v 125_C
Unit
fmax
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
3.0
4.5
6.0
6
10
30
35
4.8
8.0
24
28
4
6
20
24
MHz
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q or Q
(Figures 1 and 4)
2.0
3.0
4.5
6.0
150
75
26
22
190
90
32
28
225
110
38
33
ns
tPHL
Maximum Propagation Delay, Reset to Q or Q
(Figures 2 and 4)
2.0
3.0
4.5
6.0
125
70
22
19
155
85
27
24
190
110
34
30
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
16
110
36
22
19
ns
Maximum Input Capacitance
—
10
10
10
pF
Cin
Typical @ 25°C, VCC = 5.0 V
CPD
35
Power Dissipation Capacitance (Per Flip−Flop)*
* Used to determine the no−load dynamic power consumption: P D = CPD VCC
2f
pF
+ ICC VCC .
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
Parameter
VCC
V
– 55 to
25_C
v 85_C
v 125_C
Unit
tsu
Minimum Setup Time, Data to Clock
(Figure 3)
2.0
3.0
4.5
6.0
100
45
20
17
125
65
25
21
150
85
30
26
ns
th
Minimum Hold Time, Clock to Data
(Figure 3)
2.0
3.0
4.5
6.0
5
3
3
3
5
3
3
3
5
3
3
3
ns
trec
Minimum Recovery Time, Reset Inactive to Clock
(Figure 2)
2.0
3.0
4.5
6.0
100
45
20
17
125
65
25
21
150
85
30
26
ns
tw
Minimum Pulse Width, Clock
(Figure 1)
2.0
3.0
4.5
6.0
80
45
16
14
100
65
20
17
120
85
24
20
ns
tw
Minimum Pulse Width, Reset
(Figure 2)
2.0
3.0
4.5
6.0
80
45
16
14
100
65
20
17
120
85
24
20
ns
Maximum Input Rise and Fall Times
(Figure 1)
2.0
3.0
4.5
6.0
1000
800
500
400
1000
800
500
400
1000
800
500
400
ns
tr, tf
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5
MC74HC175A
SWITCHING WAVEFORMS
tw
tf
CLOCK
tPHL
VCC
90%
50%
10%
50%
Q
GND
tPLH
1/fmax
Q or Q
GND
tr
90%
50%
10%
tw
VCC
50%
RESET
tPLH
Q
50%
tPHL
trec
VCC
CLOCK
tTLH
50%
tTHL
GND
Figure 3.
Figure 4.
VALID
VCC
DATA
GND
tsu
th
VCC
CLOCK
50%
GND
Figure 5.
TEST CIRCUIT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
Figure 6.
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6
MC74HC175A
EXPANDED LOGIC DIAGRAM
D0
4
D
Q
2
Q0
3
Q0
7
Q1
6
Q1
10
Q2
11
Q2
15
Q3
14
Q3
C
CLOCK
D1
9
5
C
R
D
Q
C
C
D2
12
R
D
Q
C
C
D3
13
R
D
Q
C
C
RESET
R
1
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7
MC74HC175A
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F
ISSUE B
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
S
K
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
0.25 (0.010)
8
1
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
D
DETAIL E
G
SOLDERING FOOTPRINT*
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74HC175A
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
B
M
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
16 PL
0.25 (0.010)
M
T B
S
A
S
SOLDERING FOOTPRINT*
8X
6.40
16X
1
1.12
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MC74HC175A/D