MATERIAL DATA SHEET Material # CPDUR & CPDU series(0603) (Halogen Free) Product Line SOD-523F Date 2011/10/5 Rev. G COMPONENT DETAILS No. 1 2 3 4 5 Construction element FR-4 Board Wafer Material group Substrate/ Terminal Diode Al wire Conductor Silver paste Molding Compound Welding Outer Total weight Material weight (mg) 1.357 0.029 0.001 0.006 1.881 Material CAS if applicable Average mass (%) Copper 7440-50-8 29.34% Nickel 7440-02-0 4.762% Gold 7440-57-5 0.155% Continuous Filament Fiber Glass 65997-17-3 65.74% Silicon 7440-21-3 97.9480% Aluminum 7429-90-5 7429 90 5 2.0000% Titanium 7440-32-6 0.0010% Siliver 7440-57-5 0.0010% SiO2 14808-60-7 0.0500% Aluminum 7429-90-5 99.00% Silicon 7440-21-3 1.00% Modified Epoxy Resin 29690-82-2 5~25% Silver 7440-22-4 76~85% Imidazole 827-43-0 1~4% Amide 461-58-5 1~4% Silica 60676-86-0 70~90% Epoxy Resin 29690-82-2 6~16% Phenolic Resin 9003-35-4 5~15% Carbon Black 1333-86-4 0.1~1% 3.274 Comchip Technology CO., LTD. www.comchiptech.com TEL: +886-2-86776675 FAX: +886-2-86776672 Sum(%) Traces 41.45 0.89 0.03 8% 0.18 88% 57.45 6% 5% 0%