KEMET Product Soldering Capability Through Hole Surface Mount Soldering Capability Product Type Peak Temp Soldering Capability Type Peak Temp Type Ceramic Conformally Coated Axials and Radials 260°C Wave Ceramic Commercial Molded Axials and Radials 260°C Wave Tantalum Through Hole 260°C Wave Product Type Ceramic MLCC Chip 260°C Reflow Tantalum MnO2 260°C Reflow KO-CAP Conductive Polymer, T520, T530 260°C* Reflow AO CAP Aluminum, A700 PWC = 605, 260°C PWC < 605, 250°C Reflow KO-CAP Conductive Polymer, T525 250°C Reflow *Note • T520, T530 V-case product 260°C capable since print week code (PWC) 501. All other T520, T530 sizes 260°C capable since PWC 524. Capability of product produced prior to these dates is 250°C. PWC format is YWW (Y = 1 digit year, WW = 2 digit week, for example, 533 = 33rd week of 2005) and is printed on the component face.