ESD Protection Design Guide

ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
©2012 Littelfuse, Inc
1
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
This guide was developed to help electronics designers navigate
selection of appropriate TVS Diode Array circuit protection components
for equipment interfaces such USB, HDMI, Ethernet, and keypad.
This document includes consideration factors, example circuits,
applicable standards, and recommended components.
Table of Contents
Introduction: ............................................................................................................................................................................ 3
TVS Diode Array (SPATM) Series Descriptions ....................................................................................................................... 4
General Purpose ESD Protection .......................................................................................................................................... 4
Low Capacitance ESD Protection ......................................................................................................................................... 7
Lightning Surge Protection ................................................................................................................................................... 9
EMI Filter Arrays with ESD Protection .................................................................................................................................. 11
TVS Diode Array Ordering Guide ........................................................................................................................................... 12
Application Specific Device Selection .................................................................................................................................... 14
USB1.1 ................................................................................................................................................................................ 14
USB2.0 ................................................................................................................................................................................ 15
USB3.0 (Two Device Solution) .............................................................................................................................................. 16
USB3.0 (Fully Integrated Solution) ........................................................................................................................................ 17
HDMI ................................................................................................................................................................................... 18
HDMI (includes protection for Ethernet and 5V power) ......................................................................................................... 19
Display Port.......................................................................................................................................................................... 20
DVI....................................................................................................................................................................................... 21
10/100/1000 Ethernet, Intra-building Lightning Immunity (GR-1089) ...................................................................................... 22
10/100/1000 Ethernet, Inter-building Lightning Immunity (GR-1089)...................................................................................... 23
10/100/1000 Ethernet, Tertiary Only Lightning Immunity (General) ....................................................................................... 24
10/100/1000 Ethernet (ESD only) .......................................................................................................................................... 25
eSATA ................................................................................................................................................................................. 26
1394a/b ................................................................................................................................................................................ 27
LVDS (Low Voltage Differential Signaling)............................................................................................................................. 28
Audio (Speaker/Microphone) ................................................................................................................................................ 29
Analog Video ........................................................................................................................................................................ 30
Keypad/Push Buttons ........................................................................................................................................................... 31
SIM Socket .......................................................................................................................................................................... 32
RS-232 ................................................................................................................................................................................. 33
RS-485 ................................................................................................................................................................................. 34
CAN Bus .............................................................................................................................................................................. 35
LCD and Camera Interfaces (Mobile) .................................................................................................................................... 36
Appendix A ............................................................................................................................................................................. 37
SPA Package Outlines ........................................................................................................................................................ 37
©2012 Littelfuse, Inc
2
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Introduction:
Designers of today’s electronic devices have demanded more
functionality with greater flexibility and higher levels of user
interaction. These circumstances have helped in driving the
development of nanometer chipsets along with a multitude of
user interfaces or ports. The confluence of these two has made
electronic devices more susceptible to ESD and required the need
for a more robust solution.
ESD Standards:
MIL-STD-883, Method 3015
Historically, analog and digital designers have been required to
have ESD protection “on-chip” to protect the IC during
manufacturing. The most commonly used ESD standard in the
manufacturing environment is the MIL-STD-883, Method 3015
and it’s also referred to as the Human Body Model (HBM). This
model discharges a 100pF capacitor through a 1500Ω resistor into
the device under test. The table below points out the four test
levels as defined in the standard.
HBM Level
Contact Discharge (kV)
Peak Current (A)
1
±0.5
0.33
2
±1
0.67
3
±2
1.33
4
±4
2.67
Most all manufacturers require that their equipment pass Level 4,
or ±8kV, as a minimum, however, some are looking for increased
reliability and require that their devices pass a much higher level
like ±15kV or ±30kV.
Conclusions:
The system level ESD test defined by the IEC produces a
substantial increase in peak current compared to the military
standard. If an IC is rated for 0.5kV per the MIL-STD and the
equipment manufacturer tests this same IC at 8kV per the IEC
specification, the chip will see nearly a 100 fold increase in peak
current (i.e. 0.33A vs. 30A)!
Ultimately, hardware or board designers must add supplementary
ESD devices to protect these sensitive chipsets from the high
level ESD threats seen in the field.
Solutions:
Littelfuse TVS Diode Arrays (SPATM Family) are an ideal choice for
suppressing ESD as their speed and clamping levels are essential
to protect today’s integrated circuits unlike the previous MLV,
MOV, and polymer technologies. The SPATM portfolio offers a
wide range of devices to suit the majority of application needs
available in the market today, and this guide will steer the
designer toward the appropriate ESD device for the particular
application they’re trying to protect.
Some of the applications discussed in this guide are:
The maximum level required for a typical IC had been ±2kV up
until 2007, but today that level has been drastically reduced to
±0.5kV. Obviously, this has helped chip designers save valuable
silicon area for more functionality, but in turn, it has made the IC
much more susceptible to damage from ESD.
● USB1.1/2.0/3.0
● Analog Video
● HDMI
● SIM Sockets
● DisplayPort
● RS-232
● DVI
● RS-485
● 10/100/1000 Ethernet
● CAN Bus
IEC61000-4-2
● Esata
● Audio (Speaker/Microphone)
Conversely, equipment manufacturers have traditionally used an
ESD standard defined by the IEC (International Electrotechnical
Commission) for system or application level testing. This model
uses a 150pF capacitor which is discharged through a 330Ω
resistor. The table below displays the four test levels as defined
in the standard.
● 1394a/b
● Keypad/Push button
● LVDS
● LCD/Camera display interfaces
IEC Level
Contact Discharge (kV)
Peak Current (A)
Many of these applications can be found in electronic devices
such as:
● PC’s
● MP3/PMP’s
● Portable Medical Devices
● PDA’s
● Digital Cameras
1
±2
7.5
● Set Top Boxes
2
±4
15
● LCD/PDP TV’s
● SIM/SD Cards
3
±6
22.5
● Portable Navigation Devices
● External Storage
4
±8
30
● Keyboards/Mouse
● Switches/Routers
● Mobile Handsets
● Smart Phone
©2012 Littelfuse, Inc
3
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Array (SPATM) Series Descriptions
General Purpose ESD Protection
Series
SP05
Schematic (Example)
ESD Level
(Contact)
±30kV
I/O Cap
VR= 0V
(@ Bias)
50pF
(30pF @ 2.5V)
VRWM
5.5V
Lightning
(tP=8/20μs)
N/A
Number of
Channels
Package
Options
2
SOT23-3
SC70-3
3
SOT143
4
5
SP1001
SP1002
±15kV
±8kV
12pF
(8pF @ 2.5V)
6pF
(5pF @ 2.5V)
5.5V
6V
2A
SOT23-5
SC70-5
SOT23-6
SC70-6
6
MSOP-8
2
SC70-3
SOT553
4
SC70-5
SOT553
5
SC70-6
SOT563
1
SC70-3
2
SC70-5
2A
SP1003
±30kV
30pF
(17pF @ 2.5V)
5V
7A
1
SOD723
SOD882
SP1004
±8kV
6pF
(5pF @ 1.5V)
6V
2A
4
SOT953
©2012 Littelfuse, Inc
4
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Arrays (SPATM) Series Descriptions
General Purpose ESD Protection (continued)
ESD Level
(Contact)
I/O Cap
VR= 0V
(@ Bias)
VRWM
Lightning
(tP=8/20μs)
Number of
Channels
Package
Options
SP1005
±30kV
30pF
(23pF @ 2.5V)
6V
10A
1
0201
Flipchip
SP1006
±30kV
25pF
(15pF @ 2.5V)
6V
5A
1
0201
μDFN-2
0.6x0.3mm
SP1007
±8kV
5pF
(3.5pF @ 5V)
6V
2A
1
0201
Flipchip
SP1010
±8kV
6pF
(3.5pF @ 2.5V)
6V
1A
4
μDFN-6
1.25x1.0mm
SP1011
±15kV
12pF
(7pF @ 2.5V)
6V
2A
4
Series
©2012 Littelfuse, Inc
Schematic (Example)
μDFN-6
1.25x1.0mm
5
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Arrays (SPATM) Series Descriptions
General Purpose ESD Protection (continued)
ESD Level
(Contact)
I/O Cap
VRWM
Lightning
(tP=8/20μs)
Number of
Channels
Package
Options
SP720
±4kV
3pF
30V or
(±15V)
3A
14
SOIC-16
PDIP-16
SP721
±4kV
3pF
30V or
(±15V)
3A
6
SOIC-8
PDIP-8
SP723
±8kV
5pF
30V or
(±15V)
7A
6
SOIC-8
PDIP-8
SP724
±8kV
3pF
20V or
(±10V)
3A
4
SOT23-6
SP725
±8kV
5pF
30V or
(±15V)
14A
4
SOIC-8
Series
©2012 Littelfuse, Inc
Schematic (Example)
6
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Arrays (SPATM) Series Descriptions
Low Capacitance ESD Protection
Series
SP3001
SP3002
SP3003
SP3004
©2012 Littelfuse, Inc
Schematic (Example)
ESD Level
(Contact)
I/O Cap
VR= 1.65V
VRWM
Lightning
(tP=8/20μs)
Number of
Channels
Package
Options
±8kV
0.65pF
6V
2.5A
4
SC70-6
4
SC70-6
SOT23-6
μDFN-6
1.6x1.6mm
2
SC70-5
SOT553
4
SC70-6
SOT563
MSOP-10
8
MSOP-10
4
SOT563
±12kV
±8kV
±12kV
0.85pF
0.65pF
0.85pF
6V
6V
6V
4.5A
2.5A
4A
7
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Arrays (SPATM) Series Descriptions
Low Capacitance ESD Protection (continued)
ESD Level
(Contact)
I/O Cap
VR= 0V
VRWM
Lightning
(tP=8/20μs)
Number of
Channels
Package
Options
SP3010
±8kV
0.45pF
6V
3A
4
μDFN-10
2.5x1.0mm
SP3011
±8kV
0.40pF
6V
3A
6
μDFN-14
3.5x1.35mm
SP3012
±12kV
0.50pF
5V
4A
4
μDFN-10
2.5x1.0mm
SP3021
(2012
release)
±8kV
0.50pF
5V
1A
1
SOD882
SP3031
(2012
release)
±10kV
0.80pF
5V
5A
1
SOD882
Series
©2012 Littelfuse, Inc
Schematic (Example)
8
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Arrays (SPATM) Series Descriptions
Lightning Surge Protection
ESD Level
(Contact)
I/O Cap
VR= 0V
VRWM
Lightning
(tP=8/20μs)
Number of
Channels
Package
Options
SP03-3.3
±30kV
16pF
(8pF
I/O to I/O)
3.3V
150A
2
SOIC-8
SP03A-3.3
±30kV
9pF
(4.5pF
I/O to I/O)
3.3V
150A
2
SOIC-8
SP03-6
±30kV
16pF
(8pF
I/O to I/O)
6V
150A
2
SOIC-8
SPLV2.8
±30kV
2pF
2.8V
40A
1
SOT23-3
SPLV2.8-4
±30kV
2pF
2.8V
40A
4
SOIC-8
Series
©2012 Littelfuse, Inc
Schematic (Example)
9
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Arrays (SPATM) Series Descriptions
Lightning Surge Protection (continued)
ESD Level
(Contact)
I/O Cap
VR= 0V
VRWM
Lightning
(tP=8/20μs)
Number of
Channels
Package
Options
SP3050
±20kV
2.4pF
6V
10A
4
SOT23-6
SP4040
±30kV
5pF
(2.5pF
I/O to I/O)
3.3V
75A
2
SOIC-8
SP4060
±30kV
4.4pF
2.5V
20A
8
MSOP-10
SP4061
±30kV
3.5pF
2.5V
20A
4
µDFN-10
2.6x2.6mm
SP4062
±30kV
3.5pF
3.3V
20A
4
µDFN-10
2.6x2.6mm
Series
©2012 Littelfuse, Inc
Schematic (Example)
10
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Arrays (SPATM) Series Descriptions
EMI Filter Arrays with ESD Protection
Series
SP6001
SP6002
SP6003
(not yet
released)
©2012 Littelfuse, Inc
Schematic (Example)
ESD Level
(Contact)
±30kV
±30kV
±15kV
Line Cap
(VR=2.5V)
24pF
(CDIODE=12pF)
30pF
(CDIODE=15pF)
14pF
(CDIODE=7pF)
VRWM
6V
6V
6V
Attenuation
≥ -30dB @
1GHz
Number of
Channels
Package
Options
4
μDFN-8
1.7x1.35mm
6
μDFN-12
2.5x1.35mm
8
μDFN-16
3.3x1.35mm
4
μDFN-8
1.7x1.35mm
6
μDFN-12
2.5x1.35mm
4
μDFN-8
1.7x1.35mm
6
μDFN-12
2.5x1.35mm
≥ -30dB @
1GHz
≥ -20dB @
1GHz
11
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Array Ordering Guide
Series
Number of Channels
Package
Orderable Part Number
SOT23-3
SP0502BAHTG
SC70-3
SP0502BAJTG
SOT143
SP0503BAHTG
SOT23-5
SP0504BAHTG
SC70-5
SP0504BAJTG
SOT23-6
SP0505BAHTG
SC70-6
SP0505BAJTG
MSOP-8
SP0506BAATG
SC70-3
SP1001-02JTG
SOT553
SP1001-02XTG
SC70-5
SP1001-04JTG
SOT553
SP1001-04XTG
SC70-6
SP1001-05JTG
SOT56
SP1001-05XTG
1
SC70-3
SP1002-01JTG
2
SC70-5
SP1002-02JTG
SOD723
SP1003-01DTG
SOD882
SP1003-01ETG
2
3
SP05
4
5
6
2
SP1001
4
5
SP1002
SP1003
1
SP1004
4
SOT953
SP1004-04VTG
SP1005
1
0201 Flipchip
SP1005-01WTG
SP1006
1
0201 (μDFN-2,0.6x0.3mm)
SP1006-01UTG
SP1007
1
0201 Flipchip
SP1007-01WTG
SP1010
4
μDFN-6 (1.25x1.0mm)
SP1010-04UTG
SP1011
4
μDFN-6 (1.25x1.0mm)
SP1011-04UTG
SP3001
4
SC70-6
SP3001-04JTG
SOT23-6
SP3002-04HTG
SC70-6
SP3002-04JTG
μDFN-6 (1.6x1.6mm)
SP3002-04UTG
SC70-5
SP3003-02JTG
SOT553
SP3003-02XTG
SC70-6
SP3003-04JTG
SOT563
SP3003-04XTG
MSOP-10
SP3003-04ATG
8
MSOP-10
SP3003-08ATG
4
SOT563
SP3004-04XTG
SP3002
4
2
SP3003
SP3004
©2012 Littelfuse, Inc
4
12
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
TVS Diode Array Ordering Guide (continued)
Series
Number of Channels
Package
Orderable Part Number
SP3010
4
μDFN-10 (2.5x1.0mm)
SP3010-04UTG
SP3011
6
μDFN-14 (3.5x1.35mm)
SP3011-06UTG
SP3012
4
μDFN-10 (2.5x1.0mm)
SP3012-04UTG
SP3021
1
SOD882
SP3021-01ETG
SP3031
1
SOD882
SP3031-01ETG
SP3050
4
SOT23-6
SP3050-04HTG
SP4040
2
SOIC-8
SP4040-02BTG
SP4060
8
MSOP-10
SP4060-08ATG
SP4061
4
μDFN-10 (2.6x2.6mm)
SP4061-04UTG
SP4062
4
μDFN-10 (2.6x2.6mm)
SP4062-04UTG
SP03-3.3
2
SOIC-8
SP03-3.3BTG
SP03A-3.3
2
SOIC-8
SP03A-3.3BTG
SP03-6
2
SOIC-8
SP03-6BTG
SPLV2.8
1
SOT23-3
SPLV2.8HTG
SPLV2.8-4
4
SOIC-8
SPLV2.8-4BTG
4
μDFN-8 (1.7x1.35mm)
SP6001-04UTG-1
6
μDFN-12 (2.5x1.35mm)
SP6001-06UTG-1
8
μDFN-16 (3.3x1.35mm)
SP6001-08UTG-1
4
μDFN-8 (1.7x1.35mm)
SP6002-04UTG-1
6
μDFN-12 (2.5x1.35mm)
SP6002-06UTG-1
4
μDFN-8 (1.7x1.35mm)
SP6003-04UTG-1
6
μDFN-12 (2.5x1.35mm)
SP6003-06UTG-1
14
PDIP-16
SP720APP
14
SOIC-16
SP720AB*G
6
PDIP-8
SP721APP
6
SOIC-8
SP721AB*G
6
PDIP-8
SP723APP
6
SOIC-8
SP723AB*G
SP724
4
SOT23-6
SP724AHTG
SP725
4
SOIC-8
SP725AB*G
SP6001
SP6002
SP6003 (not
released)
SP720
SP721
SP723
*Add “T” for Tape and Reel, otherwise parts are packed in tubes
©2012 Littelfuse, Inc
13
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
USB1.1
Considerations:
● Each port operates at either 1.5Mbps or 12Mbps (low and full speed respectively)
• Parasitic capacitance should be taken into account although these relatively slow speeds can tolerate tens of picofarads
● Requires 2 channels of data line protection per port (i.e. D±)
• A 4 channel device can be useful if protecting a USB stack of 2 ports to make the ESD footprint as small as possible
• VBUS can be protected separately with a single channel device in an 0402 or 0201 form factor (0402 shown)
Application Schematic:
USB Controller
USB Port
VBUS
D+
D+
DSP0502
Outside
World
IC
SP1003
Case GND
Signal GND
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @ VR=2.5V
# of Channels
VRWM
Packaging
SP0502BAJTG
±30kV
30pF
2
5.5V
SC70-3
SP1001-02XTG
±15kV
8pF
2
5.5V
SOT553
SP1003-01ETG
±30kV
17pF
1
5.0V
0402 (SOD882)
SP1003-01DTG
±30kV
17pF
1
5.0V
0402 (SOD723)
SP1006-01UTG
±30kV
15pF
1
5.0V
0201 (µDFN-2)
©2012 Littelfuse, Inc
14
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
USB2.0
Considerations:
● Each port can operate up to 480Mbps
• The high data rate requires a low capacitance device to preserve signal integrity
● Requires 2 channels of data line protection per port (i.e. D±) which can be done via array or discretely
• A 4 channel device such as the SP3002-04 can be useful if protecting a USB stack of 2 ports to make the ESD footprint as small as possible
• VBUS can be protected by connecting it to the VCC pin on the diode array or by using a separate single channel device like the SP1003
Application Schematic:
USB Port
USB Controller
VBUS
D+
DOutside
World
Optional
IC
SP3003
NC
Case GND
Signal GND
USB Port
USB Controller
VBUS
D
DOutside
World
IC
SP3031 (x2)
*Package is shown as transparent
Case GND
Signal GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @
VR=1.65V
# of Channels
VRWM
Packaging
SP3003-02XTG
±8kV
0.65pF
2
6V
SOT553
SP3003-02JTG
±8kV
0.65pF
2
6V
SC70-5
SP3031-01ETG (2012 release)
±10kV
0.80pF
1
5V
SOD882
©2012 Littelfuse, Inc
15
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
USB3.0 (Two Device Solution)
Considerations:
● Each port depending upon what it’s connected to can operate:
• Up to 5Gbps over the new super-speed data pairs, SSTX± and SSRX±
• Up to 480Mbps on the legacy data pair, D±
● Requires 4 channels of ultra-low capacitance protection for the super-speed data pair (i.e. SSTX± and SSRX±)
● Requires 2 channels of protection for the legacy D± data pair
• VBUS can be protected by connecting it to the VCC pin on the SPA or by using a separate single channel device
Application Schematic:
USB Port
USB Controller
VBUS
D+
DSP3003
Optional
NC
Outside
World
IC
SSTX+
SSTXGND
SP3012
SSRX+
SSRX*Package is shown as transparent
Case GND
Signal GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @
VR=1.65V
# of Channels
VRWM
Packaging
SP3003-02XTG
±8kV
0.65pF
2
6V
SOT553
SP3012-04UTG
±12kV
0.50pF
4
5V
μDFN-10 (2.5x1.0mm)
©2012 Littelfuse, Inc
16
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
USB3.0 (Fully Integrated Solution)
Considerations:
● Each port depending upon what it’s connected to can operate:
• Up to 5Gbps over the new super-speed data pairs, SSTX± and SSRX±
• Up to 480Mbps on the legacy data pair, D±
● Requires 4 channels of ultra-low capacitance protection for the super-speed data pair (i.e. SSTX± and SSRX±) and 2 channels of protection
for the legacy D± data pair. The SP3011 shown below integrates all 6 channels of protection into a small form factor µDFN-14 package.
Application Schematic:
USB Port
USB Controller
VBUS
SSTX+
Outside
World
SSTXIC
SSRX+
SSRXGND
SP3011
D+
D*Package is shown as transparent
Case GND
Signal GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @ VR=0V
# of Channels
VRWM
Packaging
SP3011-06UTG
±8kV
0.40pF
6
6V
μDFN-14 (3.5x1.35mm)
©2012 Littelfuse, Inc
17
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
HDMI
Considerations:
● Each port has 3 differential pairs of data (i.e. D0±, D1±, D2±) plus a clock (CLK±)
• For HDMI 1.1-1.2 the throughput is a total of 4.95Gbps (1.65Gbps per lane)
• For HDMI 1.3-1.4 the throughput is a total of 10.2Gbps (3.4Gbps per lane)
● To maintain the differential impedance per the HDMI Compliance Test Specification (and consequently signal integrity) a very low
capacitance device must be used
● To maintain the differential impedance the designer should avoid using 90º angles and vias
• This can be accomplished by the use of an ESD device that offers a “straight-through” routing scheme
● Requires 12 channels of protection : 8 TMDS data pairs, SDA, SCL, CEC, and HPD
Application Schematic:
HDMI Port
*Package is shown as transparent
Chipset
D2+
GND
D2D1+
SP3010
GND
D1D0+
GND
Outside
World
D0CLK+
IC
SP3010
GND
CLKSDA
SCL
SP3010
CEC
HPD
Signal
GND
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @
VR=1.65V
# of Channels
VRWM
Packaging
SP3010-04UTG
±8kV
0.45pF
4
6V
μDFN-10 (2.5x1.0mm)
SP3012-04UTG)
±12kV
0.50pF
4
5V
μDFN-10 (2.5x1.0mm)
©2012 Littelfuse, Inc
18
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
HDMI (includes protection for Ethernet and 5V power)
Considerations:
● Same as noted on previous page except the protection scheme below includes options for protecting additional Ethernet and 5V power pins.
● Other combinations exist such as using 2, 6 channel SP3011 devices along with 2, single channel discrete
Application Schematic:
HDMI Port
*Package is shown as transparent
Chipset
D2+
GND
D2D1+
SP3010
GND
D1D0+
GND
D0Outside
World
CLK+
IC
SP3010
GND
CLKSDA
SCL
SP3010
CEC
HPD
SP3021
ENET
PWR
SP1003
Case GND
Signal GND
Recommended SPA Devices:
Ordering Number
ESD Level (Contact)
I/O Capacitance @ VR=2.5V
# of Channels
VRWM
Packaging
SP3010-04UTG
±8kV
0.45pF
4
6V
μDFN-10 (2.5x1.0mm)
SP3012-04UTG)
±12kV
0.50pF
4
5V
μDFN-10 (2.5x1.0mm)
SP3021-01ETG (2012 release)
±8kV
0.50pF
1
5V
0402 (SOD882)
SP1003-01ETG (SP1003)
±30kV
17pF
1
6V
0402 (SOD882)
©2012 Littelfuse, Inc
19
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
Display Port
Considerations:
● Each port has a main link which contains 4 differential pairs or lanes (i.e. ML0±, ML1±, ML2±, and ML3±)
• The total throughput is 10.8Gbps or 2.7Gbps per lane
• The clock signal is embedded in the lanes and does not exist separately as in HDMI
• There is also an auxiliary channel (AUX±), hot plug detect (HPD), and power pin (PWR) as well.
● To maintain the differential impedance (and consequently signal integrity) a very low capacitance device must be used
• To maintain the differential impedance the designer should avoid using 90º angles and vias
• This can be accomplished by the use of an ESD device that offers a “straight-through” routing scheme
● Requires 12 channels of protection per port (ML0±, ML1±, ML2±, ML3±, AUX±, HPD, and PWR)
Application Schematic:
Display Port
ML0+
Chipset
*Package is shown as transparent
GND
ML0ML1+
SP3010
GND
ML1ML2+
GND
Outside
World
ML2ML3+
IC
SP3010
GND
ML3AUXGND
AUX+
SP3010
HPD
PWR
Signal
GND
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @
VR=1.65V
# of Channels
VRWM
Packaging
SP3010-04UTG
±8kV
0.45pF
4
6V
μDFN-10 (2.5x1.0mm)
SP3012-04UTG
±12kV
0.50pF
4
5V
μDFN-10 (2.5x1.0mm)
©2012 Littelfuse, Inc
20
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
DVI
Considerations:
● A DVI port may have single or dual link capability
• Each link has 3 differential lanes of data (i.e. D0±, D1±, D2±) plus a clock (CLK±)
• For single link, the maximum throughput can approach a total of 4.95Gbps or 1.65Gbps per lane
• For dual link, the maximum throughput can approach a total of 8Gbps or 2.67Gbps per lane
● To maintain signal integrity a very low capacitance device must be used
● To maintain the differential impedance the designer should avoid using 90º angles and vias
• This can be accomplished by the use of an ESD device that offers a “straight-through” routing scheme
● Requires 8 channels of protection per port (D0±, D1±, D2±, CLK±)
Application Schematic:
*Package is shown as
transparent
DVI Port
D2+
DVI Chipset
SP3003
GND
D2D1+
VCC/NC
GND
Outside
World
D1-
IC
SP3003
D0+
GND
D0CLK+
VCC/NC
GND
CLKCase GND
Case GND
Signal GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @
VR=1.65V
# of Channels
VRWM
Packaging
SP3003-04ATG
±8kV
0.65pF
4
6V
MSOP-10
SP3010-04UTG
±8kV
0.45pF
4
6V
μDFN-10 (2.5x1.0mm)
©2012 Littelfuse, Inc
21
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
10/100/1000 Ethernet, Intra-building Lightning Immunity (GR-1089)
Considerations:
● 10/100/1000 relates to the data rate in Mbps (i.e. 10Mbps, 100Mbps, and 1000Mbps)
• For 10 Base-T, data is transmitted over 2 UTP (unshielded twisted pairs) using a 10MHz clock
• For 100 Base-TX, data is transmitted over 2 UTP using a 125MHz clock
• For 1000 Base-T data is transmitted over 4 UTP using a 125MHz clock
• For these data rates the parasitic capacitance needs to be taken into account to preserve signal integrity
● The 4 data lines below (Tx± and Rx±) are being protected against intra-building (i.e. 100A, tP=2/10µs) lightning transients by a two-stage
protection scheme
● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme should be replicated for the
remaining 2 data pair
Application Schematic:
RJ-45
Connector
Ethernet PHY
F1
J1
Tx+
F2
TxOutside
World
Rx+
F3
J8
RxF4
SP03A (x2)
F1:F4 = 0461 1.25 TeleLink Fuse
PHY GND
SP3050
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @
VR=0V
# of Channels
VRWM
Packaging
SP03A-xBTG
±30kV
150A
4.5pF (I/O to I/O)
2
3.3V
SOIC-8
SP03-3.3BTG
±30kV
150A
8pF (I/O to I/O)
2
3.3V,6V
SOIC-8
SP3050-04HTG
±20kV
10A
2.4pF
4
6V
SOT23-6
©2012 Littelfuse, Inc
22
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
10/100/1000 Ethernet, Inter-building Lightning Immunity (GR-1089)
Considerations:
● 10/100/1000 relates to the data rate in Mbps (i.e. 10Mbps, 100Mbps, and 1000Mbps)
• For 10 Base-T, data is transmitted over 2 UTP (unshielded twisted pairs) using a 10MHz clock
• For 100 Base-TX, data is transmitted over 2 UTP using a 125MHz clock
• For 1000 Base-T data is transmitted over 4 UTP using a 125MHz clock
• For these data rates the parasitic capacitance needs to be taken into account to preserve signal integrity
● The 4 data lines below are being protected against inter-building (i.e. 500A, tP=2/10µs) lightning transients by a two-stage protection scheme.
The 4 channel, SP4061 or SP4062 should be selected based on the operating voltage of the PHY.
● The standoff voltage of the SEP Series device will be dictated by the use of PoE. If PoE is present the SEP0640 should be used; otherwise,
the SEP0080 is ok for non-PoE applications. Note: Higher voltage options are available for atypical PoE voltages.
● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme should be replicated for the
remaining 2 data pair
Application Schematic:
RJ-45
Connector
F1
*Package is shown as transparent
Ethernet PHY
J1
Tx+
Tx-
F2
Outside
World
SP4062
PHY
GND
F3
J8
Rx+
Rx-
F4
Case GND
SEP0xx (x2)
F1:F4 = 0461 1.25 TeleLink Fuse
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @
VR=0V
# of Channels
VRWM
Packaging
SEP0080Q38CB
±30kV
400A
See datasheet
2
6V
QFN
SEP0640Q38CB
±30kV
400A
See datasheet
2
58V
QFN
SP4061-04UTG
±30kV
20A
3.5pF
4
2.5V
µDFN-10 (2.6x2.6mm)
SP4062-04UTG
±30kV
20A
3.5pF
4
3.3V
µDFN-10 (2.6x2.6mm)
©2012 Littelfuse, Inc
23
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
10/100/1000 Ethernet, Tertiary Only Lightning Immunity (General)
Considerations:
● 10/100/1000 relates to the data rate in Mbps (i.e. 10Mbps, 100Mbps, and 1000Mbps)
• For 10 Base-T, data is transmitted over 2 UTP (unshielded twisted pairs) using a 10MHz clock
• For 100 Base-TX, data is transmitted over 2 UTP using a 125MHz clock
• For 1000 Base-T data is transmitted over 4 UTP using a 125MHz clock
• For these data rates the parasitic capacitance needs to be taken into account to preserve signal integrity
● Some designers choose to use a robust transformer in their design to act as the first line of protection against an incoming surge event.
This is usually done to minimize the parasitic capacitance on the data line and to save on the cost of the primary protector
● Using such a technique will require a robust PHY side protection device and one such option is the SPLV2.8-4 shown below. It should be
noted that this device will only provide differential protection between the data pairs.
● If longitudinal and differential protection are required, the SP3050-04HTG (with 2 I/O’s tied per line) or SP4060/SP4061/SP4062 can be
considered as alternatives
● Protection for 100Mbps Ethernet (or Fast Ethernet) is shown below. For 1000Mbps (or 1GbE) interfaces two, SPLV2.8-4BTG are required
Application Schematic:
RJ-45
Connector
Ethernet PHY
J1
Tx+
TxRx+
Rx-
Outside
World
Ethernet
PHY
SPLV2.8-4
J8
*Package is shown as transparent
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @
VR=0V
# of Channels
VRWM
Packaging
SPLV2.8-4BTG
±30kV
40A
2.0pF
4
2.8V
SOIC-8
SP3050-04HTG
±20kV
10A
2.4pF
4
6V
SOT23-6
SP4060-08ATG
±30kV
20A
4.4pF
8
2.5V
SP4061-04UTG
±30kV
20A
3.5pF
4
2.5V
SP4062-04UTG
±30kV
20A
3.5pF
4
3.3V
©2012 Littelfuse, Inc
MSOP-8
µDFN-10
(2.6x2.6mm)
µDFN-10
(2.6x2.6mm)
24
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
10/100/1000 Ethernet (ESD only)
Considerations:
● Some Ethernet ports only need be protected for ESD and not for lightning induced transients
• These are sometimes referred to as “2M” ports or 2 Meter ports that have very short CAT5 cable installations
● Parasitic capacitance should be taken into account especially for 1GbE
● The 4 data lines below (Tx± and Rx±) are being protected against ESD by a low capacitance SP3002 which is suitable for all
Ethernet data rates
• In fact, any low capacitance SP30xx device is suitable for any “ESD only” Ethernet application
● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme can be replicated or the 8
channel SP3003-08ATG can be used.
Application Schematic:
RJ-45
Connector
Ethernet PHY
J1
Tx+
TxOutside
World
Rx+
J8
Rx-
NC
Case GND
Case GND
SP3002
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @
VR=1.65V
# of Channels
VRWM
Packaging
SP3002-04JTG
±12kV
4.5A
0.85pF
4
6V
SC70-6
SP3003-04XTG
±8kV
2.5A
0.65pF
4
6V
SOT563
SP3004-04XTG
±12kV
4A
0.85pF
4
6V
SOT563
SP3003-08ATG
±8kV
2.5A
0.65pF
8
6V
MSOP-10
©2012 Littelfuse, Inc
25
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
eSATA
Considerations:
● eSATA is a subset of the SATA protocol that uses 2 differential pairs for communication
• Four lines need to be protected per port (i.e. TX± and RX±)
• Currently eSATA is capable of running raw data rates of 1.5Gbps (Gen 1) and 3.0Gbps (Gen 2)
● These high bus speeds require very low capacitance devices to prevent signal degradation
● To maintain the line impedance the designer should avoid using 90º angles and vias
Application Schematic:
eSATA Port
GND
eSATA Interface
TX+
*Package is shown as transparent
TX-
Outside
World
IC
GND
RX-
SP3012
RX+
GND
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @ VR=1.65V
# of Channels
VRWM
Packaging
SP3012-04UTG
±12kV
0.50pF
4
5V
μDFN-10 (2.5x1.0mm)
SP3010-04UTG
±8kV
0.45pF
4
6V
μDFN-10 (2.5x1.0mm)
SP3003-02XTG
±8kV
0.65pF
2
6V
SOT553
SP3003-04JTG
±8kV
0.65pF
4
6V
SC70-6
©2012 Littelfuse, Inc
26
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
1394a/b
Considerations:
● 1394a (FireWire 400 or S400) was the original (1st generation) implementation
• Allowed for two connectors, powered (6 pin) and unpowered (4 pin)
• Data rates up to 400Mbps using 2 differential pair
● 1394b (FireWire 800 or S800) was the 2nd generation
• Required a new 9 pin connector but was backwards compatible to S400
• Data rates up to 800Mbps using 2 differential pair
● 1394b also had provisions for 1600Mbps and 3200Mbps (or S1600 and S3200)
• Uses same 9 pin connector as S800
● S800, S1600, and S3200 require very low capacitance devices for the high speed data rates
• Protection of 4 data lines is needed (i.e. TPB± and TPA±) and can be done with an array or with discrete low capacitance devices
Application Schematic:
*Package is shown as transparent
1394b Port
1394 Interface
SP3003
TPBTPB+
TPATPA+
Outside
World
GNDS
IC
TPA Shield GND
GND
NC
PWR
GNDS
Case GND
TPB Shield GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
I/O Capacitance @ VR=1.65V
# of Channels
VRWM
Packaging
SP3003-04ATG
±8kV
0.65pF
4
6V
MSOP-10
SP3010-04UTG
±8kV
0.45pF
4
6V
μDFN-10
SP3012-04UTG
±12kV
0.50pF
4
5V
μDFN-10 (2.5x1.0mm)
SP3021-01ETG (2012 release)
±8kV
0.50pF
1
5V
SOD882
©2012 Littelfuse, Inc
27
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
LVDS (Low Voltage Differential Signaling)
Considerations:
● LVDS is a low noise, low-voltage signal scheme that uses a small current (typically 3.5mA) to generate a voltage drop across a 100Ω resistor
to convey information or data
• Data rates can vary per application but the ANSI/TIA/EIA-644-A standard recommends a maximum of 655Mbps
● The medium/high speed bus requires a low capacitance device in 1-6pF range (typically)
• LVDS schemes will vary in terms of the total number of channels used
• Protection of 8 data lines is shown below (i.e. CLK± and Ax±)
Application Schematic:
LVDS Controller
LVDS Interface
CLK+
CLKA0+
A0-
Outside
World
IC
A1+
A1A2+
A2-
Signal GND
Case GND
SP4060
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @ VR=0V
# of Channels
VRWM
Packaging
SP4060-08ATG
±30kV
20A
4.4pF
8
2.5V
MSOP-10
SP3050-04HTG
±20kV
10A
2.4pF
4
6V
SOT23-6
SP4061-04UTG
±30kV
20A
3.5pF
4
2.5V
µDFN-10 (2.6x2.6mm)
©2012 Littelfuse, Inc
28
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
Audio (Speaker/Microphone)
Considerations:
● Audio ports typically have signals that swing above and below GND (i.e. ±2.5V)
• If no DC bias is applied, a bidirectional protection device should be used as these devices will not clip the analog signal
• Protection of 2 data lines is shown below (i.e. Left and Right) with an array and with discrete 0201s
● Some audio ports will bias the data bus so that the signal never swings below GND (i.e. 0-5V)
• If a bias is applied, a unidirectional OR bidirectional protection device could be used as neither device would clip the analog signal
• The SP1001-02XTG is a good option in this case (not shown for Left and Right but is listed below)
Application Schematic:
Audio Codec
Audio Port
Left
Right
Outside
World
IC
Case GND
SP1002-02
Audio Codec
Audio Port
Left
Right
Outside
World
IC
Case GND
SP1005 (x2)
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @ VR=2.5V
# of Channels
VRWM
Packaging
SP1002-02JTG
±8kV
2A
5pF
2
6V
SC70-5
SP1005-01WTG
±30kV
10A
23pF
1
6V
0201 Flipchip
SP1001-02XTG
±15kV
2A
8pF
2
5.5V
SOT553
©2012 Littelfuse, Inc
29
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
Analog Video
Considerations:
● Analog video ports typically have signals that swing above and below GND (i.e. ±2V)
• A bidirectional protection device should be used as these devices will not clip the analog signal
● S-Video, Composite, and RF/Coaxial are a few of the common low-speed analog video signals in use today
• Typical bus speeds will not exceed 5MHz so capacitance is not much of a concern
• Protection of the three are shown below (Y, C, Video, and RF)
Application Schematic:
Video ADC
Video Port
Y
Luminance
C
Chrominance
Video
Outside
World
Composite
RF
Coaxial
IC
SP1004
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @ VR=2.5V
# of Channels
VRWM
Packaging
SP1004-04VTG
±8kV
2A
4.5pF
4
6V
SOT953
SP1002-02JTG
±8kV
2A
5pF
2
6V
SC70-5
SP1005-01WTG
±30kV
10A
23pF
1
6V
0201 Flipchip
SP1007-01WTG
±8kV
2A
3.5pF
1
6V
0201 Flipchip
©2012 Littelfuse, Inc
30
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
Keypad/Push Buttons
Considerations:
● Keypads and push buttons on electronic devices are particularly susceptible to ESD due to constant human interaction
• Most are DC switches that operate at less than 5V, and for most applications capacitance will not be a concern
● The number of ports will vary with the particular application, but as an example, 4 data lines are shown below (i.e.Px)
● For space constrained applications the SP1003 or SP1005 may be considered as they are 0402 and 0201 footprints, respectively
Application Schematics:
Keypads
P1
P2
P3
Outside
World
IC
P4
SP1006 (x4)
Case GND
Keypads
I/O Controller
P1
P2
Outside
World
P3
IC
P4
SP1001
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @ VR=2.5V
# of Channels
VRWM
Packaging
SP1001-04XTG
±15kV
2A
8pF
4
6V
SOT553
SP1003-01ETG
±30kV
7A
17pF
1
5V
0402 (SOD882)
SP1005-01WTG
±30kV
10A
23pF
1
6V
0201 Flipchip
SP1006-01UTG
±30kV
5A
15pF
1
6V
0201 (µDFN-2)
©2012 Littelfuse, Inc
31
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
SIM Socket
Considerations:
● The SIM (Subscriber Identification Module) card has 3 data lines that are low-speed and low-voltage
• Given the low speed of the signals, the capacitance will not be a concern
● The low-voltage signal lines are best protected by a device which has a low standoff voltage or VRWM
● Protection of the 3 data lines is shown below (i.e. CLK, DATA, and RESET)
Application Schematics:
SIM Controller
SIM Socket
VBUS
DATA
CLK
Outside
World
RESET
IC
SP3002
Case GND
GND
Case GND
Signal GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @
VR=1.65V
# of
Channels
VRWM
Packaging
SP3002-04UTG
±12kV
4.5A
0.85pF
4
6V
μDFN-6 (1.6x1.6mm)
SP1011-04UTG
±15kV
2A
7pF
4
6V
μDFN-6 (1.25x1.0mm)
SP1005-01WTG
±30kV
10A
23pF
1
6V
0201 Flipchip
SP1006-01UTG
±30kV
5A
15pF
1
6V
0201 (µDFN-2)
©2012 Littelfuse, Inc
32
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
RS-232
Considerations:
● There are numerous implementations of RS-232
• Most involve 6 wires (as shown below) though some may only include 2, 3, or 5 wires
• The maximum data rate is 20kbps
• Typically bus voltages are bipolar and can swing as high as ±24V though most installations are limited to ±12V or even lower
• For ±12V systems the SP72x Series is recommended and shown below
● Some implementations are a unipolar (i.e. 0-3.3V or 0-5V) or use bus voltages generally below 6V
• In this event the SP1001 Series can be used for ESD protection or the SP03 Series could be used if lightning is the primary threat
● Every application should be evaluated thoroughly before using the recommended devices below
Application Schematics:
Controller
RS-232 Port
RD
TD
RTS
Outside
World
IC
CTS
DSR
DTR
VBUS
SP723
Case GND
Case GND
-V
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @
VR=1.65V
# of Channels
VRWM
Packaging
SP721ABTG
±4kV
3A
3pF
6
30V
SOIC-8
SP723ABTG
(±8kV
7A
5pF
6
30V
SOIC-8
SP724AHTG
±8kV
3A
3pF
4
20V
SOT23-6
SP725ABTG
±8kV
14A
5pF
4
30V
SOIC-8
©2012 Littelfuse, Inc
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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
RS-485
Considerations:
● There are numerous implementations and applications of RS-485
• Most applications involve two wires (i.e. A and B) while a few are four wire (i.e. full duplex)
• Depending on cable length, data rates can vary from 100kbps-10Mbps
• Bus voltages can be unipolar (i.e. 0-6V) or bipolar (i.e. ±3V) and every application should be evaluated thoroughly before using the
recommended devices below
● For a unipolar bus with a voltage ≤ 6V (MAX):
• The SP1001 Series is shown for ESD protection only
• The SP03 Series is shown for lightning/surge protection
● For differential protection between A and B, the GND connection can be removed from the schematics below
● For a bipolar bus with a maximum voltage swing of ±3V:
• The SP1002 or SP1004 Series can be used ESD protection only
• The SP03 Series (x2) can still be used for lightning/surge protection with one I/O tied to GND
Application Schematic:
RS-485 Port
Receiver
A
Outside
World
B
IC
SP1001
Case GND
RS-485 Port
Receiver
A
Outside
World
IC
B
Case GND
SP03
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @
VR=2.5V/0V
# of Channels
VRWM
Packaging
SP1001-02JTG
±15kV
2A
8pF
2
6V
SC70-3
SP03-xBTG
±30kV
150A
8pF (I/O to I/O)
2
3.3V, 6V
SOIC-8
SP03A-3.3BTG
±30kV
150A
4.5pF (I/O to I/O)
2
3.3V
SOIC-8
©2012 Littelfuse, Inc
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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
CAN Bus
Considerations:
● There are numerous implementations and applications of a CAN bus
• Most applications involve two wires (i.e. CANH and CANL)
• Depending on cable length, data rates can vary from 10kbps-1Mbps
• Most applications do not exceed 0-5V to transmit a Low/High signal, however, every application should be evaluated thoroughly before
using the recommended devices below
● For the described application of unipolar bus with voltages between 0 and 5V:
• The SP1001 Series is shown for ESD protection only
• The SP03 Series is shown for lightning/surge protection
● For differential protection between CANH and CANL, the GND connection can be removed from the schematics below
Application Schematic:
CAN Port
Transceiver
CANH
CANL
Outside
World
IC
SP1001
Case GND
Transceiver
CAN Port
CANH
Outside
World
IC
CANL
SP03
Case GND
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Lightning
(tP=8/20μs)
I/O Capacitance @
VR=2.5V/0V
# of Channels
VRWM
Packaging
SP1001-02JTG
±15kV
2A
8pF
2
6V
SC70-3
SP03-xBTG
±30kV
150A
8pF (I/O to I/O)
2
3.3V, 6V
SOIC-8
SP03A-3.3BTG
±30kV
150A
4.5pF (I/O to I/O)
2
3.3V
SOIC-8
©2012 Littelfuse, Inc
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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Application Specific Device Selection
LCD and Camera Interfaces (Mobile)
Considerations:
● LCD and camera interfaces in mobile devices are vulnerable to EMI from the cellular band
• Frequencies between 800-3000MHz should be attenuated to prevent distortion on the display
● The pixel clocks vary depending upon the display size but the frequency will typically fall between 5-65MHz
• This corresponds to data rates between 10-60Mbps and with these speeds line capacitances need to be considered
• In the majority of applications line capacitances of 20-40pF will not cause signal integrity issues
● The protection schemes below for data lines Dx are only examples and will vary with the particular application
Application Schematic:
PCB Connector
for LCD Display
*Packages are shown as transparent
Baseband
SP6002-04
D1
D2
IC
D3
D4
Camera Module
Baseband
SP6001-06
D1
D2
D3
IC
D4
D5
D6
Recommended SPA Devices:
Ordering Number
ESD Level
(Contact)
Cut-off Frequency
Line Capacitance
@ VR=2.5V
# of Channels
VRWM
Packaging
SP6001-0xUTG-1
±30kV
115MHz
24pF
4/6/8
6V
μDFN-8/12/16
SP6002-0xUTG-1
±30kV
100MHz
30pF
4/6
6V
μDFN-8/12
SP6003-0xUTG-1 (not released yet)
±15kV
175MHz
14pF
4/6
6V
μDFN-8/12
©2012 Littelfuse, Inc
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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Appendix A
SPA Package Outlines
PDIP-8
PDIP-16
SOIC-8
©2012 Littelfuse, Inc
37
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
SPA Package Outlines (continued)
SOIC-16
MSOP-8
MSOP-10
©2012 Littelfuse, Inc
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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
SPA Package Outlines (continued)
SOT23-3
SOT143
SOT23-5
©2012 Littelfuse, Inc
39
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
SPA Package Outlines (continued)
SOT23-6
SC70-3
SC70-5
©2012 Littelfuse, Inc
40
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
SPA Package Outlines (continued)
SC70-6
SOT553
SOT563
©2012 Littelfuse, Inc
41
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
SPA Package Outlines (continued)
SOT953
SOD723
SOD882
©2012 Littelfuse, Inc
42
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
SPA Package Outlines (continued)
0201
Flip chip
(0.62x0.32)
0201
µDFN-2
(0.60x0.30)
μDFN-6
(1.25x1.0)
©2012 Littelfuse, Inc
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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
SPA Package Outlines (continued)
μDFN-6
(1.6x1.6)
μDFN-8
(1.7x1.35)
μDFN-10
(2.5x1.0)
©2012 Littelfuse, Inc
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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
SPA Package Outlines (continued)
μDFN-10
(2.6x2.6)
μDFN-12
(2.5x1.35)
μDFN-14
(3.5x1.35)
©2012 Littelfuse, Inc
45
ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
Littelfuse, Inc.
8755 West Higgins Road
O’Hare Plaza, Suite 500
Chicago, IL 60631 USA
Phone: (773) 628-1000
spa@littelfuse.com
Authored by:
Chad Marak
Technical Marketing Manager
Semiconductor Business Unit
©2012 Littelfuse, Inc
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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
©2012 Littelfuse, Inc
47