TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP724 Series SP724 Series 3pF 8kV Diode Array RoHS Pb GREEN Description The SP724 is a quad array of transient voltage clamping circuits designed to suppress ESD and other transient overvoltage events. The SP724 is used to help protect sensitive digital or analog input circuits on data, signal, or control lines operating on power supplies up to 20VDC. The SP724 is comprised of bipolar SCR/diode structures to protect up to four independent lines by clamping transients of either polarity to the power supply rails. The SP724 offers very low leakage (1nA Typical) and low input capacitance (3pF Typical). Additionally, the SP724 is rated to withstand the IEC 61000-4-2 ESD specification for both contact and air discharge methods to level 4. Pinout I/O V+ I/O 6 5 4 SP724 (SOT-23) TOP VIEW 1 2 3 I/O V– I/O • ESD Capability per HBM Standards V+ 5 3, 4 AND 6 1 Features • An Array of 4 SCR/Diode Pairs in 6-Lead SOT-23 Functional Block Diagram IN The SP724 is connected to the sensitive input line and its associated power supply lines. Clamping action occurs during the transient pulse, turning on the diode and fast triggering SCR structures when the voltage on the input line exceeds one VBE threshold above the V+ supply (or one VBE threshold below the V- supply). Therefore, the SP724P operation is unaffected by poor power supply regulation or voltage fluctuations within its operating range. IN - IEC 61000-4-2, Direct Discharge........... 8kV (Level 4) - IEC 61000-4-2, Air Discharge................15kV (Level 4) - MIL STD 3015.7................................................. >8kV • Input Protection for Applications with Power Supplies Up to +20V (Single-Ended Voltage), and ±10V (Differential Voltage) • Peak Current Capability V- 2 Notes: NOTES: 1. The design of the SP724 SCR/Diode ESD Protection Arrays are covered by Littelfuse patent 4567500. 1. The design of the SP724 SCR/Diode ESD Protection Arrays are 2. The full ESD capability of the SP724 is achieved when wired in a circuit that includes covered by Littelfuse patent 4567500. connection to both the V+ and V- pins. When handling individual devices, follow proper 2. The full ESD capability of the SP724 is achieved when wired in a procedures for electrostatic discharge. circuit that includes connection to both the V+ and V- pins. When handling individual devices, follow proper procedures for electrostatic discharge. - IEC 61000-4-5 (8/20µs)........................................ ±3A - Single Pulse, 100µs Pulse Width...................... ±2.2A • Low Input Leakage........................................... 1nA Typical • Low Input Capacitance......................................3pF Typical • Operating Temperature Range....................-40ºC to 105ºC Applications •Microprocessor/Logic Input Protection • Analog Device Input Protection • Data Bus Protection • Voltage Clamp Additional Information Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/24/13 Datasheet Resources Samples TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP724 Series Thermal Information Absolute Maximum Ratings Parameter Continuous Supply Voltage, (V+) - (V-) Forward Peak Current, IIN to VCC , GND (Refer to Figure 5) Rating +20 Units V ±2.2, 100µs A Parameter Thermal Resistance (Typical, Note 3) SOT Package Maximum Junction Temperature Maximum Lead Temperature (Soldering 20-40s) (SOT - Lead Tips Only) C/W o C -65 to 150 o 150 o 260 o C C Note: 3. θJA is measured with the component mounted on an evaluation PC board in free air. ESD Ratings and Capability - See Figure 1, Table 1 Electrical Characteristics Units oC/W 220 Maximum Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Note: Rating θJA TA = -40oC to 105oC, VIN = 0.5VCC , Unless Otherwise Specified Parameter Symbol Operating Voltage Range, VSUPPLY = [(V+) - (V-)] (Notes 4, 5) Test Conditions Min Typ Max Units 1 - 20 V - 2 - V VFWDH - 2 - V IIN -10 1 10 nA V+ = 20V, V- = GND - - 100 nA (Note 6) - 1.1 - V VFWD/IFWD (Note 6) - 1.0 - Ω - 3 - pF VSUPPLY Forward Voltage Drop Forward Voltage Drop IN to V- VFWDL IN to V+ Input Leakage Current Quiescent Supply Current IIN = 1A (Peak Pulse) IQUIESCENT Equivalent SCR ON Threshold Equivalent SCR ON Resistance Input Capacitance CIN Notes: 4. In automotive and other battery charging systems, the SP724 power supply lines should be externally protected for load dump and reverse battery. When the V+ and V- Pins are connected to the same supply voltage source as the device or control line under protection, a current limiting resistor should be connected in series between the external supply and the SP724 supply pins to limit reverse battery current to within the rated maximum limits. 5. Bypass capacitors of typically 0.01µF or larger should be connected closely between the V+ and V- Pins for all applications. 6. Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance”. These characteristics are given here for information to determine peak current and dissipation under EOS conditions. Typical Application of the SP724 Application as an Input Clamp for Over-voltage, Greater than 1VBE Above V+ or less than -1VBE below V-) +VCC +VCC INPUT DRIVERS OR SIGNAL SOURCES LINEAR OR DIGITAL IC INTERFACE IN 1, 3, 4 AND 6 TO +VCC V+ 0.001µF SP724 V- SP724 INPUT PROTECTION CIRCUIT (1 OF 4 SHO WN) FIGURE 4. TYPICAL APPLICATION OF THE SP724 AS AN INPUT CLAMP FOR OVER-VOLTAGE, GREATER THAN 1VBE ABOVE V+ OR LESS THAN -1V BE BELOW V- © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/24/13 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP724 Series ESD Capability ESD rating is dependent on the defined test standard. The evaluation results for various test standards and methods based on Figure 1 are shown in Table 1.3 Figure 1: Electrostatic Discharge Test R1 The SP724 has a Level 4 rating when tested to the IEC 61000-4-2 Human Body Model (HBM) standard and connected in a circuit in which the V+ and V- pins have a return path to ground. Level 4 specifies a required capability greater than 8kV for direct discharge and greater than 15kV for air discharge. RD CHARGE SWITCH DISCHARGE SWITCH CD H.V. SUPPLY VD IN DUT IEC 1000-4-2: R 1 50 to 100M MIL STD 3015.7: R 1 1 to 10M The “Modified” MIL-STD-3015.7 condition is defined as an “in-circuit” method of ESD testing, the V+ and V- pins have a return path to ground.The SP724 ESD capability is greater than 8kV with 100pF discharged through 1.5kΩ. By strict definition of the standard MIL-STD-3015.7 method using “pin-to-pin” device testing, the ESD voltage capability is greater than 2kV. FIGURE 1. ELECTR OSTATIC DISCHARGE TEST Table 1: ESD Test Conditions Standard Type/Mode RD CD ±VD 330 Ω 150pF 15kV HBM, Direct Discharge 330 Ω Modified HBM 1.5k Ω Standard HBM 1.5k Ω 150pF 100pF 100pF 8kV 8kV † 2kV EIAJ IC121 Machine Model 0k Ω 200pF 400V US ESD DS 5.3 Charged Device Model 0k Ω NA 3kV HBM, Air Discharge IEC 61000-4-2 (Level 4) For the SP724 EIAJ IC121 Machine Model (MM) standard, the ESD capability is typically greater than 1.8kV with 200pF discharged through 0kΩ. MIL-STD-3015.7 The Charged Device model is based upon the selfcapacitance of the SOT-23 package through 0kΩ. †Upper limit of laboratory test set. Figure 2: Low Current SCR Forward Voltage Drop Curve TA = 25°C 200 80 40 SINGLE PULSE FORWARD SCR CURRENT (A) 120 FORWARD SCR CURRENT (mA) FORWARD SCR CURRENT (mA) SINGLE PULSE 160 5 TA = 25°C 160 120 80 40 0 0 600 600 5 TA = 25°C TA = 25°C SINGLE PULSE SINGLE PULSE FORWARD SCR CURRENT (A) 200 Figure 3: High Current SCR Forward Voltage Drop Curve 4 3 2 800 1000 1000 1200 FORWARD SCRFORWARD VOLTAGE DROP SCR VOLTAGE (mV) DROP (mV) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/24/13 3 2 EQUIV. SAT. ON EQUIV. SAT. ON THRESHOLD ~ 1.1VTHRESHOLD ~ 1.1V 1 1 0 800 4 0 0 1200 0 1 1 2 2 FORWARD SCR FORWARD VOLTAGE DROP SCR VOLTAGE (V) DROP (V) 3 3 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP724 Series Peak Transient Current Capability for Long Duration Surges The peak transient current capability is inversely proportional to the width of the current pulse. Testing was done to fully evaluate the SP724’s ability to withstand long duration current pulses using the circuit of Figure 4. Figure 5 shows the point of overstress as defined by increased leakage in excess of the data sheet published limits. The safe operating range of the transient peak current should be limited to no more than 75% of the measured overstress level for any given pulse width as shown in the curve of Figure 5. Figure 4: T ypical SP724 Peak Current Test Circuit with a Variable Pulse Width Input + VX CURRENT SENSE - (-) (+) SP724 + - 5 2 4 3 R 1 ~ 10 TYPICAL VX ADJ. 10V/ATYPICAL C1 ~ 100 µF 6 1 The test circuit of Figure 4 is shown with a positive pulse input. For a negative pulse input, the (-) current pulse input goes to an SP724 ‘IN’ input pin and the (+) current pulse input goes to the SP724 V- pin. The V+ to V- supply of the SP724 must be allowed to float. (i.e., It is not tied to the ground reference of the current pulse generator.) VOLTAGE PROBE C1 TYPICALNonrepetitive SP724 PEAK CURRENT CIRCUIT Figure 5: FIGURE S P7245.Typical PeakTEST Current WITH A VARIABLE PULSE WIDTH INPUT Pulse Capability Showing the Measured Point of Overstress in Amperes vs pulse width time in milliseconds 8 NOTE: TO ENSURE SAFE OPERATION LIMIT THE MAXIMUM PEAK CURRENT FOR A GIVEN PULSE WIDTH TO BE NO GREATER THAN 75% OF THE VALUES SHOWN. TA = 25ºC V+ TO V-SUPPLY = 15V 7 PEAK CURRENT (A) Note that two input pins of the SP724 may be paralleled to improve current (and ESD) capability. The sustained peak current capability is increased to nearly twice that of a single pin. VARIABLE TIME DURATION CURRENT PULSE GENERATOR R1 6 5 4 3 2 1 0 0.001 0.01 0.1 1 10 SQUARE WAVE PULSE WIDTH (ms) 100 1000 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/24/13 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP724 Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 5°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Package Dimensions — Small Outline Transistor Plastic Packages (SOT23-6) Package SOT23-6 Pins 6 JEDEC MO-178 Millimeters Min M Min Max Notes A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref e1 1.9 Ref 0.0748 Ref L Recommended Solder Pad Layout Max Inches 0.100 0.004 10º 0º 6 N a 0.600 0º - 0.023 6 4,5 6 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - Notes: 1. Dimensioning and tolerances per ANSI 14.5M-1982. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. P 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. R O © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/24/13 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP724 Series Part Numbering System Product Characteristics SP 724 AH T G TVS Diode Arrays (SPA® Diodes) Lead Plating Matte Tin Lead Material Copper Alloy Tape and Reel Lead Coplanarity 0.004 inches (0.102mm) Package Type AH: SOT-23 Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 “Green” RoHS Compliant Series Ordering Information Part Number Temp. Range (ºC) Package Marking Min. Order Qty. SP724AHTG -40 to 105 Tape and Reel 724G 3000 Notes: 1. All dimensions are in millimeters. 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 1.5mm DIA. HOLE ACCESS HOLE 14.4mm 4.0mm 1.75mm 2.0mm CL 8mm 4.0mm 13mm 180mm GENERAL INFORMATION SOT-23 (8mm POCKET PITCH) 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 60mm 8.4mm USER DIRECTION OF FEED PIN 1 COVER TAPE © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/24/13