AOS Semiconductor Product Reliability Report AOZ8000, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOZ8000. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOZ8000 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be routine monitored for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Reliability Stress Test Summary and Results Reliability Evaluation I. Product Description: The AOZ8000 is a transient voltage suppressor array designed to protect high speed data lines from ESD and lightning. This device incorporates eight surge rated, low capacitance steering diodes and a TVS in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. Detailed information refers to the datasheet on website. . II. Package and Die Information: AOZ8000CIL Product ID Package Type SOT23 6L Lead Frame Cu Die attach material Ag Epoxy Bonding Au wire MSL(moisture sensitive level) Up to Level 1 2 III. Reliability Stress Test Summary and Results: Test Condition Test Point Total Sample size Number of Failures Standard HTRB Vdd= 80% Vbrmax. Temp = 150°C 168 / 500 1000 hours 924 pcs 0 JESD22-A108 MSL Precondition 168hr 85°C / 85%RH + 3 cycle reflow@260°C (MSL 1) - 3465 pcs 0 JESD22-A113 Temperature Cycle -65 °C to +150 °C, air to air 250 / 500 cycles 924 pcs 0 JESD22-A104 Autoclave 121°C, 29.7psi, RH= 100% 96 hours 924 pcs 0 JESD22-A102 HAST 130°C, 85%RH, 33.3 psi, Vdd= 80% Vbrmax. 96 hours 924 pcs 0 JESD22-A110 HTSL Temp = 150°C 1000 hrs 693 pcs 0 JESD22-A103 Test Item Note: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 7.63 MTTF = 14960 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion device hours. Failure Rate = 7.63 MTTF = 14960 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from burn-in tests H = Duration of burn-in testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3 130 deg C 150 deg C 2.59 1