Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > AUML Series AUML Varistor Series RoHS Description The AUML Series of Multilayer Transient Surge Suppressors was specifically designed to suppress the destructive transient voltages found in an automobile. The most common transient condition results from large inductive energy discharges. The electronic systems in the automobile, e.g. antilock brake systems, direct ignition systems, engine control, airbag control systems, wiper motor controls, etc., are susceptible to damage from these voltage transients and thus require protection. The AUML transient suppressors have temperature independent suppression characteristics affording protection from -55ºC to 125ºC. Size Table Metric EIA 3216 1206 3225 1210 4532 1812 5650 2220 The AUML suppressor is manufactured from semiconducting ceramics which offer rugged protection and excellent transient energy absorption in a small package. The devices are available in ceramic leadless chip form, eliminating lead inductance and assuring fast speed of response to transient surges. These Suppressors require significantly smaller space and land pads than Silicon TVS diodes, offering greater circuit board layout flexibility for the designer. Also see the Littelfuse ML, MLN and MLE Series of Multilayer Suppressors. Features Applications • Suppression of inductive switching or other transient events such as EFT and surge voltage at the circuit board level • ESD protection for components sensitive to IEC 61000-4-2 (Level 4), MIL-STD883C, Method 3015.7, and other industry specifications (See Also the MLE or MLN Series) • AEC - Q200 compliant • Provides on-board transient voltage protection for ICs and transistors • RoHS Compliant • Used to help achieve electromagnetic compliance of end products • Leadless, surface mount chip form • Replace larger surface mount TVS Zeners in many applications • Load Dump energy rated per SAE Specification J1113 • “Zero” Lead Inductance • High peak surge current capability • Low Profile, compact industry standard chip size; (1206, 1210, 1812 and 2220 Sizes) • Inherent bidirectional clamping • No Plastic or epoxy packaging assures better than 94V-0 • No temperature derating flammability rating up to 125ºC ambient • Variety of energy ratings available Absolute Maximum Ratings • For ratings of individual members of a series, see Device Ratings and Specifications chart. Continuous AUML Series Units 18, 24, 48 V 1.5 to 25 48 -55 to +125 -55 to +150 <0.01 J V O C O C %/OC Steady State Applied Voltage: DC Voltage Range (VM(DC)) Transient: Load Dump Energy, (WLD) Jump Start Capability (5 minutes), (VJUMP) Operating Ambient Temperature Range (TA) Storage Temperature Range (TSTG) Temperature Coefficient (αV) of Clamping Voltage (VC) at Specified Test Current CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/15 Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > AUML Series Device Ratings and Specifications Maximum Ratings (125ºC) Maximum Jump Start Load Dump Continuous Voltage Energy DC Voltage (5 Min) (10 Pulses) VM(DC) VJUMP WLD Part Number (V) 18 V18AUMLA1206 (V) 24.5 (J) 1.5 Specifications (25ºC) Nominal Varistor Voltage Maximum at 10mA Standby Leakage DC Test Current (at 13V DC) VN(DC) Min VN(DC) Max IL (V) 23 (V) 32 Maximum Clamping Voltage (VC) at Test Current (8/20µs) VC IP (µA) 50 (V) 40 (A) 1.5 V18AUMLA1210 18 24.5 3.0 23 32 50 40 1.5 V18AUMLA1812 18 24.5 6.0 23 32 100 40 5.0 V18AUMLA2220 V24AUMLA2220 V48AUMLA2220 18 24 48 24.5 24.5 24.5 25 25 25 23 32 54.5 32 39 66.5 200 200 200 40 60 105 10.0 10.0 10.0 NOTES: 1. Average power dissipation of transients not to exceed 0.1W, 0.15W, 0.3W and 1W for model sizes 1206, 1210, 1812 and 2220 respectively. 2.Load dump :min. time of energy input 40ms, interval 60sec(the load dump time constant Td differs from the time constant of energy input; load dump rating for ISO 7637-2 pulse 5a, please contact littelfuse. 3.Thermal shock capability per Mil-Std-750, Method 1051: -55ºC to 125ºC, 5 minutes at 25ºC, 25 Cycles: 15 minutes at each extreme. 4.For application specific requirements, please contact Littelfuse. Current, Energy and Power Derating Curve Peak Pulse Current Test Waveform for Clamping Voltage 100 50 0 T O1 90 PERCENT OF RATED VALUE 100 PERCENT OF PEAK VALUE When transients occur in rapid succession, the average power dissipation is the energy (watt-seconds) per pulse times the number of pulses per second. The power so developed must be within the specifications shown on the Device Ratings and Characteristics Table for the specific device. Certain parameter ratings must be derated at high temperatures as shown below. TIME T1 80 70 MAXIMUM LEAKAGE Figure 2 100 60 50 40 VOLTAGE 30 20 10 0 -55 50 60 70 80 90 100 110 120 130 10 140 150 AMBIENT TEMPERATURE (oC) Figure 1 T2 MAXIMUM CLAMPING VOLTAGE 1210/1206 1812 01 = Virtual Origin of Wave T = Time from 10% to 90% of Peak 1210/1206 T1 = Rise Time = 1.25 xCURRENT T FIGURE 2. PEAK PULSE TEST WAVEFORM FOR CLAMPING VOLTAGE T1812 = Decay Time 2 2220 Example - For an 8/20 µs Current Waveform: O1 = VIRTUAL ORIGIN OF WAVE 8µs = T = Rise Time t = TIME FROM1 10% TO 90% OF PEAK 20µs =FRONT T2 = Decay Time t = VIRTUAL TIME = 1.25 xt 2220 1 1 FIGURE 1. CURRENT, ENERGY AND POWER DERATING CURVE Maximum Leakage Current/Clamping Voltage Curve for AUML Series at 25ºC t2 = VIRTUAL TIME TO HALF VALUE 1mA 10µA 100µA 10mA (IMPULSE DURATION) 100mA CURRENT 1A 10A 100A TypicalEXAMPLE: V-I Characteristics of the V18AUMLA2220 at -40ºC, MAXIMUM LEAKAGE CURRENT/CLAMPING VOLTAGE CURVE FOR AUML SERIES AT 25 C 25ºC, FIGURE 85ºC and FOR2.AN 8/20125ºC s CURRENT WAVEFORM o 8 s = t1 = VIRTUAL FRONT TIME MAXIMUM LEAKAGE 100 MAXIMUM CLAMPING VOLTAGE 20 s = t2 = VIRTUAL TIME TO HALF VALUE 100 1210/1206 1812 1210/1206 10 VOLTAGE VOLTAGE 2220 1812 2220 -40oC 10 25oC 85oC 125 oC 1 1 10µA Figure 3 100µA 1mA 100mA 10mA CURRENT 1A 10A 100A FIGURE 2. MAXIMUM LEAKAGE CURRENT/CLAMPING VOLTAGE CURVE FOR AUML SERIES AT 25 oC 1µA Figure 4 10µA 100µA 1mA 10mA 100mA 1A 10A 100A 1000A CURRENT FIGURE 3. TYPICAL V-I CHARACTERISTICS OF THE V18AUMLA2220 at -40 oC, 25oC, 85oC AND 125 oC © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/15 100 Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > AUML Series Temperature Effects Speed of Response In the leakage region of the AUML suppressor, the device characteristics approaches a linear (ohmic) relationship and shows a temperature dependent affect. In this region the suppressor is in a high resistance mode (approaching 106Ω) and appears as a near open-circuit. Leakage currents at maximum rated voltage are in the microamp range. The clamping action of the AUML suppressor depends on a conduction mechanism similar to that of other semiconductor devices (i.e. P-N Junctions). The apparent slow response time often associated with transient voltage suppressors (Zeners, MOVs) is often due to parasitic inductance in the package and leads of the device and less dependent of the basic material (Silicon, ZNO). Thus, the single most critical element affecting the response time of any suppressor is its lead induc-tance. The AUML suppressor is a surface mount device, with no leads or external packaging, and thus, it has virtually zero inductance. The actual response time of a AUML surge suppressor is in the 1 to 5 ns range, more than sufficient for the transients which are likely to be encountered in an automotive environment. Load Dump Energy Capability A Load Dump transient occurs when the alternator load in the automobile is abruptly reduced. The worst case scenario of this transient occurs when the battery is disconnected while operating at full rated load. There are a number of different Load Dump specifications in existence in the automotive industry, with the most common one being that recommended by the Society of Automotive Engineers, specification #SAE J1113. Because of the diversity of these Load Dump specifications Littelfuse defines the Load Dump energy capability of the AUML suppressor range as that energy dissipated by the device itself, independent of the test circuit setup. The resultant Load Dump energy handling capability serves as an excellent figure of merit for the AUML suppressor. Standard Load Dump specifications require a device capability of 10 pulses at rated energy, across a temperature range of -40ºC to +125ºC. This capability requirement is well within the ratings of all of the AUML Series (Figure 6 on next page). The very high energy absorption capability of the AUML suppressor is achieved by means of a highly controlled manufacturing process. This technology ensures that a large volume of suppressor material, with an interdigitated layer construction, is available for energy absorption in an extremely small package. Unlike equivalent rated Silicon TVS diodes, the entire AUML device volume is available to dissipate the Load Dump energy. Hence, the peak temperatures generated by the Load Dump transient are significantly lower and evenly dissipated throughout the complete device (Figure 5 below). This even energy dissipation ensures that there are lower peak temperatures generated at the P-N grain boundaries of the AUML suppressor. Multilayer Internal Construction Figure 5 AUML Load Dump Pulsing over a Temperature Range of -55ºC to +125ºC V(10mA) 35 2220 = 25J 1812 = 6J 1210 = 3J 30 25 VOLTAGE When clamping transients at higher currents (at and above the 10mA range), the AUML suppressor approaches a 1-10 characteristic. In this region the characteristics of the AUML are virtually temperature independent. Figure 3 shows the typical effect of temperature on the V-I characteristics of the AUML suppressor. 20 15 10 5 0 0 1 2 3 4 5 6 7 8 10 11 12 Figure 6 FIGURE 5. AUML LOAD DUMP PULSING OVER A TEMPERATURE RANGE OF -55˚C TO 125˚C There are a number of different size devices available in the AUML Series, each one with a load dump energy rating, which is size dependent. V(10mA) 35 2220 = 25J 30 VOLTAGE 1812 = 6J 1210 = 3J 25 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/15 9 # OF LOAD DUMPS 20 15 10 5 0 0 50 100 150 200 250 300 # OF LOAD DUMPS 350 1,000 2,000 Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > AUML Series Explanation of Terms Maximum Continuous DC Working Voltage (VM*(DC)++) This is the maximum continuous DC voltage which may be applied, up to the maximum operating temperature (125ºC), to the ML suppressor. This voltage is used as the reference test point for leakage current and is always less than the breakdown voltage of the device. Load Dump Energy Rating WLD+ This is the actual energy the part is rated to dissipate under Load Dump conditions (not to be confused with the "source energy" of a Load Dump test specification). Maximum Clamping Voltage VC+ This is the peak voltage appearing across the suppressor when measured at conditions of specified pulse current and specified waveform (8/20µs). It is important to note that the peak current and peak voltage may not necessarily be coincidental in time. Leakage Current IL+ In the nonconducting mode, the device is at a very high impedance (approaching 106Ω at its rated working voltage) and appears as an almost open circuit in the system. The leakage current drawn at this level is very low (<25µA at ambient temperature) and, unlike the Zener diode, the multilayer TVS has the added advantage that, when operated up to its maximum temperature, its leakage current will not increase above 500µA. Nominal Voltage VNDC++ This is the voltage at which the AUML enters its conduction state and begins to suppress transients. In the automotive environment this voltage is defined at the 10mA point and has a minimum (VN(DC) MIN) and maximum (VN(DC) MAX) voltage specified. Additional Information Datasheet Resources Samples © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/15 Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > AUML Series Lead (Pb) Soldering Recommendations The principal techniques used for the soldering of components in surface mount technology are IR Re-flow and Wave soldering. Typical profiles are shown on the right. Reflow Solder Profile The termination option available for each solder technique is: 230 Reflow 1. Nickel Barrier (preferred) 2. Silver/Platinum Wave 1. Nickel Barrier (preferred) 230 The recommended solder for the AUML suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to cool gradually to less than 50ºC before cleaning. FIGURE 8. REFLOW SOLDER PROFILE FIGURE 8. Wave Solder Profile REFLOW SOLDER PROFILE 300 MAXIMUM WAVE 260 oC 300 250 o TEMPERATURE TEMPERATURE ( oC) ( C) When using a reflow process, care should be taken to ensure that the AUML chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. Figure 9 TEMPERATURE ( oC) Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. 230 MAXIMUM WAVE 260 oC 250 200 FIGURE 8. REFLOW SOLDER PROFILE 200 150 SECOND PREHEAT 150 100 300 Figure 10 SECOND PREHEAT FIRST PREHEAT MAXIMUM WAVE 260 oC 100 50 250 FIRST PREHEAT 50 0 2000.0 0.5 1.0 1.5 4.0 4.5 0 150 0.0 0.5 1.0 1.5 4.0 4.5 4.0 4.5 100 2.0 2.5 3.0 3.5 TIME (MINUTES) 2.0 2.5 3.0 3.5 TIMESOLDER (MINUTES) SECONDPROFILE PREHEAT FIGURE 9. WAVE FIGURE 9. WAVE SOLDER PROFILE FIRST PREHEAT 50 0 0.0 Lead–free (Pb-free) Soldering Recommendations Littelfuse offers the Nickel Barrier Termination finish for the optimum Lead–free solder performance. Lead–free Re-flow Solder Profile PREHEAT ZONE MAXIMUM TEMPERATURE 260˚C 20PREHEAT - 40 SECONDS ZONEWITHIN 5˚C RAMP RATE <3˚C/s The reflow profile must be constrained by the maximums in the Lead–free Reflow Profile. For Lead–free Wave soldering, the Wave Solder Profile still applies. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/15 3.5 20 - 40 SECONDS WITHIN 5˚C RAMP RATE <3˚C/s 60 - 150 SEC FIGURE 9. WAVE SOLDER PROFILE > 217˚C RAMP RATE <3˚C/s 60 - 150 SEC > 217˚C The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but there is a wide selection of pastes and fluxes available with which the Nickel Barrier parts should be compatible. Note: the Lead–free paste, flux and profile were used for evaluation purposes by Littelfuse, based upon industry standards and practices. There are multiple choices of all three available, it is advised that the customer explores the optimum combination for their process as processes vary considerably from site to site. MAXIMUM TEMPERATURE 260˚C 0.520 - 40 1.0 SECONDS 1.5 2.0 2.5 WITHIN 5˚C 3.0 TIME (MINUTES) MAXIMUM TEMPERATURE 260˚C 60 - 1506.0 SEC 5.0 > 217˚C 7.0 5.0 7.0 6.0 FIGURE 10. LEAD-FREE RE-FLOW SOLDER PROFILE FIGURE PREHEAT 10. LEAD-FREE ZONE RE-FLOW SOLDER PROFILE 5.0 6.0 7.0 Figure 11 FIGURE 10. LEAD-FREE RE-FLOW SOLDER PROFILE Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > AUML Series Product Dimensions (mm) PAD LAYOUT DIMENSIONS CHIP LAYOUT DIMENSIONS E Note: Avoid metal runs in this area, parts are not recommended for use in applications using silver (Ag) expoxy paste. L D W Note: Avoid metal runs in this area, parts are not recommended for use in applications using Silver (Ag) epoxy paste. 1206 Size SYMBOL IN 1210 Size MM IN 1812 Size MM IN 2220 Size MM IN MM A 0.203 5.150 0.219 5.510 0.272 6.910 0.315 8.000 B 0.103 2.620 0.147 3.730 0.172 4.360 0.240 6.190 C 0.065 1.650 0.073 1.850 0.073 1.850 0.073 1.850 D (max.) 0.071 1.80 0.070 1.80 0.07 0.118 3.00 E 0.020 -/+ 0.010 0.50 -/+0.25 0.030 -/+ 0.010 0.75 -/+ 0.25 L 0.125 -/+ 0.012 3.20 -/+ 0.03 0.125 -/+ 0.012 3.20 -/+ 0.30 0.180 -/+ 0.014 0.225 -/+ 0.016 5.70 -/+ 0.40 W 0.060 -/+ 0.011 0.100 -/+ 0.012 2.54 -/+ 0.30 0.125 -/+ 0.012 1.80 0.50 -/+ 0.25 4.50 -/+ 0.35 3.20 -/+ 0.30 0.197 -/+ 0.016 5.00 -/+ 0.40 1.60 -/+ 0.28 0.020 -/+ 0.010 0.50 -/+ 0.25 0.020 -/+ 0.010 Part Numbering System V 18 AUML A 2220 X X PACKING OPTIONS A: Bulk Pack, 2500 pieces H: 7in (178mm) Diameter Reel* T: 13in (330mm) Diameter Reel* * See quanttities in Packaging table below DEVICE FAMILY TVSS Device MAXIMUM DC WORKING VOLTAGE END TERMINATION OPTION N or No Letter: Nickel Barrier AUTOMOTIVE MULTILAYER DESIGNATOR LOAD DUMP ENERGY RATING INDICATOR DEVICE SIZE i.e., 220 mil x 200 mil Packaging* Quantity Device Size 13” Inch Reel ('T' Option) 7” Inch Reel ('H' Option) Bulk Pack ('A' Option) 1206 1210 1812 2220 10,000 8,000 4,000 4,000 2,500 2,000 1,000 1,000 2,500 2,000 1,000 1,000 *(Packaging) It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/15 Metal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > AUML Series Tape and Reel Specifications Symbol Description Dimensions in Millimeters A0 Width of Cavity Dependent on Chip Size to Minimize Rotation. B0 Length of Cavity Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. K0 Depth of Cavity W Width of Tape 8 -/+ 0.2 12 -/+ 0.2 F Distance Between Drive Hole Centers and Cavity Centers 3.5 -/+ 0.5 5.4 -/+ 0.5 E Distance Between Drive Hole Centers and Tape Edge 1.75 -/+ 0.1 1.75 -/+ 0.1 P1 Distance Between Cavity Center 4 -/+ 0.1 8-/+ 0.1 P2 Axial Distance Between Drive Hole Centers and Cavity Centers 2 -/+ 0.1 2 -/+ 0.1 P0 Axial Distance Between Drive Hole Centers 8 -/+ 0.1 8 -/+ 0.1 D0 Drive Hole Diameter 1.55 -/+ 0.05 1.55 -/+ 0.05 D1 Diameter of Cavity Piercing 1.05 -/+ 0.05 1.55 -/+ 0.05 T1 Embossed Tape Thickness 0.3 Max 0.4 Max T2 Top Tape Thickness 0.1 Max 0.1 Max NOTE: Dimensions in millimeters. • Conforms to EIA-481-1, Revision A • Can be supplied to IEC publication 286-3 Tape Chip Size 8mm Wide Tape 1206 1210 12mm Wide Tape 1812 2220 Standard Packaging Special Packaging Tape and reel is the standard packaging method of the AUML Series. The standard 300 millimeter (13–inch) reel utilized contains 4000 pieces for the 2200 and 1812 chips, 8000 pieces for the 1210 chip and 10,000 pieces for the 1206 size. Option1: To order: add 'T' to the standard part number, e.g.V18AUMLA222OT. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/15 178 millimeter (7–inch) reels containing 1000 (2220, 1812), 2000 (1210), 2500 (1206), pieces are available. To order add 'H' to the standard part number, e.g. V18AUMLA2220H. Option 2 For small sample quantities (less than 100 pieces) the units are shipped bulk pack. To order add 'A' to the standard part number, e.g. V18AUMLA2220A.