Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR LCC 20−28 LEAD Stress Sample Size Device Hr./Cyc Condition Total Fails Fail Percentage 85/85 3,086 2,570,580 85_C, 85%RH 0 0.00 BOND INT 1,130 763,750 200_C + N2 0 0.00 HAST 6,351 658,040 130_C, 85%RH 0 0.00 HIGH TEMP STORAGE 125 124,500 200_C 0 0.00 Pressure Pot 17,744 1,471,166 121_, 15 PSIG 0 0.00 Salt Atmosphere 800 21,720 883 M1009 0 0.00 Solder DUNK 20 60 260_C, 10SEC 0 0.00 Solderability 2,016 16,888 883 M2003 0 0.00 Temp Cycle 4,822 4,058,950 - 65_C - 150_C 0 0.00 Thermal Shock 9,731 1,141,740 - 60_C - 150_C 0 0.00 Document Number: 72549 30-Sep-03 www.vishay.com 1