Package Reliability www.vishay.com Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR SOT-23 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS HAST 646 64 600 130 °C, 85 % RH 0 0 Pressure Pot 1046 100 416 121°, 15 PSIG 0 0 Solder DUNK 270 810 260 °C, 10 s 0 0 Solderability 150 870 883 M2003 0 0 Temp. Cycle 3564 1 304 000 -55 °C to 150 °C 0 0 Revision: 22-Dec-15 FAIL PERCENTAGE Document Number: 72466 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000