AOS Semiconductor Product Reliability Report AOD609, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD609. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD609 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOD609 uses advanced trench technology MOSFETs to provide excellent RDS(ON) and low gate charge. The complementary MOSFETs may be used in H-bridge, Inverters and other applications. -RoHS Compliant -Halogen Free* 2 II. Die / Package Information: AOD609 Standard sub-micron Low voltage N+P channel process Package Type 3 leads TO252 Lead Frame Cu, S/pad, Ag spot Die Attach Ag epoxy Bond wire G:1.3 mils Au; S: 2mils Cu Mold Material Epoxy resin with silica filler Flammability Rating UL-94 V-0 Backside Metallization Ti / Ni / Ag Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process III. Result of Reliability Stress for AOD609 Test Item Test Condition Time Point Solder Reflow Precondition HTGB 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - HTRB HAST Pressure Pot Temperature Cycle Temp = 150°c , Vds=80% of Vdsmax 130 +/- 2°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°c , 29.7psi, RH=100% -65°c to 150°c , air to air, Lot Attribution Total Sample size 9 lots 1210pcs 0 82pcs 0 168 / 500 hrs 1 lot 1000 hrs (Note A*) 168 / 500 hrs 1 lot 1000 hrs (Note A*) 100 hrs 9 lots 96 hrs 250 / 500 cycles Number of Failures 77+5 pcs / lot 82pcs 0 77+5 pcs / lot 495pcs 0 (Note B**) 5 lots 50+5 pcs / lot 275pcs 0 (Note B**) 8 lots 50+5 pcs / lot 440pcs 0 (Note B**) 50+5 pcs / lot 3 III. Result of Reliability Stress for AOD609 Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°c bake 150°c bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 245°c 5 sec 15 15 leads 0 Solder dunk 260°°c 10secs 3 cycles 1 30 units 0 Note A: The HTGB and HTRB reliability data presents total of available AOD609 burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AOD609 comes from the AOS generic package qualification data. IV. Reliability Evaluation FIT rate (per billion): 64 MTTF = 1780 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD609). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 MTTF = 109 / FIT = 1.56 x 107hrs = 1780 years / [2 (164) (500) (258)] = 64 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 4