LEAD-FREE AND HALOGEN-FREE PACKAGING FROM LATTICE TM RoHS Compliant Packaging Lattice Semiconductor is committed to conducting business in a manner consistent with the efficient use of resources and materials, and the preservation of the natural environment. Lattice Corporate Commitment Due to increased worldwide environmental concerns, the need for lead-free and halogen-free solutions in electronic components and systems is receiving increased attention within the semiconductor and electronics industries. Lattice is fully supportive of the various industry efforts throughout the world to phase out the use of lead and other undesirable elements from electronic equipment materials and manufacturing processes. Lattice remains committed to continually reducing its impact on the world’s natural environment and works closely with its customers and suppliers to identify and rapidly eliminate hazardous substances from its products. Resource Conservation Environmental protection is more than just meeting standards. All corporate activities must be implemented with the environment in mind. Lattice’s goal is to develop all new products such that they reduce space, materials and power consumption for an equivalent electrical function. In turn, this allows our customers to continually reduce their impact on the environment. ISO14001 ISO14001 is an international standard for environmental management systems. Companies that are ISO14001 registered have demonstrated an internal program for the management of hazardous waste and implementation of recycling programs. This recognition certifies a company’s commitment to preserving the natural environment. All Lattice subcontract manufacturers are ISO14001 registered, and are routinely reviewed to ensure continued compliance. Green Packaging Solutions Lattice has qualified a wide variety of package types in lead-free and halogen-free configurations. These include the Plastic Leaded Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Chip Array BGA (caBGA), Chip Scale BGA (csBGA), Ultra Chip Scale BGA (ucBGA), Flip Chip BGA (fcBGA), Quad Flat-Pack No Lead Saw-Singulated (QFNS) and Wafer Level Chip Scale Packaging (WLCSP). To better facilitate the industry transition to lead-free and halogen-free PLDs, Lattice offers the following leadfree and halogen-free product families. Optimized FPGA Architecture with High-Performance DSP • LatticeECP3™ (1.2V) • LatticeECP2M™ (1.2V) • LatticeECP2™ (1.2V) • LatticeECP-DSP™ (1.2V) • LatticeEC™ (1.2V) LatticeSC™ FPGA for Extreme Performance • LatticeSC (1.2V/1.0V) • LatticeSCM™ (1.2V/1.0V) MachXO2™ “Do-it-All” Programmable Logic Devices • MachXO2-ZE (1.2V) • MachXO2-HC (3.3V/2.5V) • MachXO2-HE (1.2V) MachXO™ Most Versatile Programmable Logic Devices • MachXO (3.3V/2.5V/1.8V/1.2V) • AEC-Q100 Qualified LA-MachXO (3.3V/2.5V/1.8V/1.2V) Optimized FPGA Architecture with Non-Volatile Reconfiguration and TransFR™ Technology • LatticeXP2™ (1.2V) • AEC-Q100 Qualified LA-LatticeXP2 (1.2V) • LatticeXP™ (3.3V/2.5V/1.8V/1.2V) Ultra Low Power CPLDs • ispMACH® 4000ZE (1.8V) Zero-Power CPLDs • ispMACH 4000Z (1.8V) Low-Power CPLDs • ispMACH 4000V/B/C (3.3V/2.5V/1.8V) • AEC-Q100 Qualified LA-ispMACH 4000V (3.3V) Platform Manager™ Mixed-Signal Devices • LPTM10-1247 • LPTM10-12107 Power Manager II Mixed-Signal Devices • ProcessorPM™-POWR605 • ispPAC®-POWR607 • ispPAC-POWR1014/A • AEC-Q100 Qualified LA-ispPAC-POWR1014/A • ispPAC-POWR1220AT8 • ispPAC-POWR6AT6 Programmable Clock Generator • ispClock™5600/A • ispClock5400D • ispClock5300S LATTICESEMI.COM/ROHS TM Lattice Semiconductor is a leader in the development of green packaging solutions. Lattice offers an extensive list of standard products in lead-free and halogen-free packaging. Lattice’s lead-free and halogen-free products are fully RoHS compliant, meeting the European Parliament Directive entitled “Restrictions on the use Of Hazardous Substances” (RoHS). This directive prohibits the use of the following elements in electrical/ electronic equipment sold after 7/1/2006: cadmium (Cd), lead (Pb), mercury (Hg), hexavalent chromium (Cr+6), polybrominated biphenyls (PBBs) and polybrominated diphenylethers (PBDEs). Backward Compatible Packages All Lattice RoHS compliant TQFP, PLCC, PQFP and QFNS packages are “backward compatible” with conventional leaded manufacturing methodologies. This backward compatibility allows users to surface mount lead-free and halogen-free packages onto lead-based PCBs and/or use lead-free and halogen-free packaging with lead-containing solders. Users can now procure a single, leadfree or halogen-free component from Lattice and use it in either a leaded or lead-free manufacturing environment without any issues. This capability greatly simplifies the inventory management challenges associated with migration from conventional leadbased to lead-free manufacturing. Lead-Free & Halogen-Free Reflow Profile Lattice’s RoHS compliant packages are qualified to Level 1, 3 or 4 moisture resistance, depending on the package type, with peak reflow temperatures of either 260°C, 250°C or 245°C, consistent with IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. Reliability tests include high temperature operating life (HTOL), surface mount preconditioning testing, temperature cycling, moisture resistance testing, biased highly accelerated stress test (HAST) and unbiased HAST. Lattice’s lead-free products are qualified to the reflow profiles described in the product bulletin Reflow Profile for Lattice Lead-Free, Halogen-Free, RoHS Compliant Products, available on the Lattice web site at www.latticesemi.com. Typical Conditions for Lead-Free and Halogen-Free Reflow Soldering 300 Peak Temp. (260C) (250C) (245C) Temperature (C) Lead-Free & Halogen-Free Packaging Initiative 200 100 0 Lead-Free & Halogen-Free Peak Reflow Temp. 260 + 0/-5°C 250 + 0/-5°C 245 + 0/-5°C Time (Seconds) Moisture Sensitivity Level (MSL) Package 1 24-/32-QFNS 3 TQFP, csBGA, ucBGA, 256-caBGA, 48-/64QFNS, 100-fpBGA, 208-ftBGA, 256-ftBGA (Option 1), 324-ftBGA 1 20-PLCC 3 332-caBGA, fpBGA (>208 balls), 256-ftBGA (Option 2) 1 28-PLCC 3 PQFP, 44-PLCC 4 fcBGA , 84-PLCC For specific reflow profiles, see Lattice Technical Note TN1076. LATTICESEMI.COM/ROHS TM Green Packaging From Lattice Product Family LatticeECP3 LatticeECP2/M Halogen-Free (RoHS6/6) Device Family Device Family Description Backward Compatible Standard Lead-Free (RoHS6/6) Backward Compatible Standard Low Power, High-Value, SERDES-Capable FPGA 256-fpBGA 484-fpBGA 672-fpBGA 1156-fpBGA LatticeECP2/M High-Value FPGA, High End Features + SERDES 144-TQFP 208-PQFP 256-fpBGA 484-fpBGA 672-fpBGA 900-fpBGA 1152-fpBGA LatticeECP-DSP 1.2V Low-Cost FPGA with Embedded High-Performance DSP LatticeEC 1.2V Low-Cost FPGA for High-Volume Applications 100-TQFP 144-TQFP 208-PQFP 256-fpBGA 484-fpBGA 672-fpBGA LatticeECP3 LatticeECP/EC 256-fpBGA 900-fpBGA 1020-fcBGA 1152-fcBGA 1704-fcBGA LatticeSC LatticeSC/M Extreme Performance 90nm FPGA LatticeSCM LatticeXP2 Low-cost, non-volatile FPGA with flexiFLASH architecture 144-TQFP 208-PQFP 132-csBGA 256-ftBGA 484-fpBGA 672-fpBGA LA-LatticeXP2 AEC-Q100 qualified flexiFLASH architecture FPGA 144-TQFP 208-PQFP 132-csBGA 256-ftBGA LatticeXP “C” 1.8V/2.5V/3.3V Low-Cost Non-Volatile FPGAs with TransFR Technology LatticeXP “E” 1.2V Low-Cost Non-Volatile FPGAs with TransFR Technology 100-TQFP 144-TQFP 208-PQFP 256-fpBGA 388-fpBGA 484-fpBGA MachXO2 “HC” 3.3V/2.5V High-Performance PLD MachXO2 “HE” 1.2V High-Performance PLD LatticeXP2 LatticeXP 100-TQFP 144-TQFP MachXO2 MachXO2 “ZE” 1.2V Low-Power PLD MachXO “C” 1.8V/2.5V/3.3V PLD MachXO “E” 1.2V PLD LA-MachXO “C” 1.8V/2.5V/3.3V AEC-Q100 Qualified PLD LA-MachXO “E” 1.2V AEC-Q100 Qualified PLD 25-WLCSP 36-WLCSP 64-ucBGA 132-csBGA 184-csBGA 256-caBGA 256-ftBGA 332-caBGA 484-fpBGA 100-TQFP 144-TQFP MachXO 100-csBGA 132-csBGA 256-caBGA 256-ftBGA 324-ftBGA 256-ftBGA 324-ftBGA LATTICESEMI.COM/ROHS TM Green Packaging From Lattice (Continued) Product Family ispMACH 4000 (Continued) Platform Manager Power Manager ispClock Device Family Halogen-Free (RoHS6/6) Device Family Description ispMACH 4000V 3.3V Low-Power CPLD ispMACH 4000B 2.5V Low-Power CPLD ispMACH 4000C 1.8V Low-Power CPLD LA-ispMACH 4000V 3.3V AEC-Q100 Qualified Low-Power CPLD LPTM10-1247 In-System Programmable Power and Digital Board Management LPTM10-12107 Standard Backward Compatible Standard 44-TQFP 48-TQFP 100-TQFP 128-TQFP 144-TQFP 176-TQFP 256-ftBGA 44-TQFP 48-TQFP 100-TQFP 128-TQFP 144-TQFP 128-TQFP 208-ftBGA ProcessorPM-POWR605 Power Supply Supervisor, Reset Generator and Watchdog Timer 24-QFNS ispPAC-POWR607 Power Supply Supervisor, Reset Generator, Watchdog Timer and Sequencing Controller 32-QFNS ispPAC-POWR1014/A Power Supply Supervisor, Reset Generator, Watchdog Timer and Sequencing Controller 48-TQFP LA-ispPAC-POWR1014/A AEC-Q100 Qualified In-System Programmable Power Supply Supervisor, Reset Generator and Sequencing Controller 48-TQFP ispPAC-POWR1220AT8 Power Supply Supervisor, Reset Generator, Sequencing, Trimming and Managing Controller 100-TQFP ispPAC-POWR6AT6 Power Supply Monitoring and Margining Controller 32-QFNS ispClock5300S Ultra-low Jitter In-System Programmable Differential Clock 48-TQFP 64-TQFP ispClock5400D Ultra-low Phase Noise, Zero-Delay Buffer Clock 48-QFNS 64-QFNS ispClock5600/A In-System Programmable Clock Generator 48-TQFP 100-TQFP 5V In-System Programmable High Density PLD 44-PLCC 84-PLCC 44-TQFP 100-TQFP 128-TQFP 128-PQFP 5V In-System Programamble High Density PLD 44-PLCC 84-PLCC 44-TQFP 48-TQFP 100-TQFP 128-TQFP 176-TQFP 128-PQFP 160-PQFP 3.3V In-System Programmable High Density SuperFAST PLD 44-TQFP 48-TQFP 100-TQFP 128-TQFP 176-TQFP ispLSI 1016E ispLSI 1032E ispLSI® 1000E ispLSI 1048E ispLSI 2032A ispLSI 2064A ispLSI 2096A ispLSI 2000A ispLSI 2128A ispLSI 2032VE ispLSI 2000VE Backward Compatible Lead-Free (RoHS6/6) ispLSI 2096VE ispLSI 2192VE 208-fpBGA LATTICESEMI.COM/ROHS TM Green Packaging From Lattice Product Family Halogen-Free (RoHS6/6) Device Family Device Family Description Backward Compatible Standard High Performance E2CMOS® 3.3V CPLD Family 44-TQFP 44-PLCC 48-TQFP 100-TQFP 144-TQFP 208-PQFP 256-fpBGA High Performance E2CMOS 5V CPLD Family 44-TQFP 44-PLCC 48-TQFP 100-TQFP 100-PQFP 144-TQFP 208-PQFP M4A3-32 ispMACH 4A3 M4A3-64 M4A3-192 M4A3-512 M4A5-32 M4A5-64 ispMACH 4A5 M4A5-128 M4A5-192 ispXPLD 5000MX ispXPGA® ORCA® 4 FPSC ispGDX2™ Backward Compatible Lead-Free (RoHS6/6) Standard 256-fpBGA 484-fpBGA 672-fpBGA ispXPLD 5000MV 3.3V high Density CPLD + Memory ispXPLD 5000MB 2.5V High Density CPLD + Memory ispXPGA-B, EB 3.3V/2.5V Non-Volatile, Infinitely Reconfigurable FPGA 256-fpBGA ORT8850H/L 1.5V ORCA 4 FPSC Plus Embedded HighPerformance ASIC Core 484-fpBGA 680-fpBGA1 ispGDX2-V, EV 3.3V High Performance Digital Crosspoint Switch 100-fpBGA 208-fpBGA 484-fpBGA ORT82G51/42G5 208PQFP ispGDX80VA ispGDXVA ispGDX160VA 3.3V In-System Programmable Generic Digital Crosspoint 100-TQFP 208-fpBGA 388-fpBGA ispGDX240VA 1. Lead-free version is supported without heat spreader. 2. Also halogen-free. Note: Reference appropriate data sheet for valid part number and package combinations. Applications Support 1-800-LATTICE (528-8423) (503) 268-8001 [email protected] Copyright © 2013 Lattice Semiconductor Corporation. Lattice Semiconductor, L (stylized) Lattice Semiconductor Corp., Lattice (design), ispClock, ispGAL, ispGDX, ispGDX2, ispLSI, ispMACH, ispPAC, ispXP, ispXPGA, ispXPLD, LatticeEC, LatticeECP, LatticeECP-DSP, LatticeECP2, LatticeECP2M, LatticeECP3, LatticeSC, LatticeSCM, LatticeXP, LatticeXP2, MachXO, MachXO2, ORCA, Platform Manager, ProcessorPM, SuperFAST and TransFR are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. March 2013 Order #: E001A LATTICESEMI.COM/ROHS