FTB1F-15 THRU FTB10F-15 N1716 REV.-

FTB1F-15
THRU
FTB10F-15
Technical Data
Data Sheet N1716, Rev. -
Green Products
FTB1F-15 THRU FTB10F-15
1.5A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Features:
•
•
•
•
•
•
•
•
Glass Passivated Chip Junction
Reverse Voltage - 100 to 1000 V
Forward Current - 1.5 A
Designed for Surface Mount Application
Fast reverse recovery time
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
PIN
1
2
DESCRIPTION
Input Pin(~)
Input Pin(~)
3
Output Anode(+)
4
Output Cathode(-)
Mechanical Data:
•
•
•
Case: ABF
Terminals: Solderable per MIL-STD-750, Method 2026
Weight: 82 mg
Mechanical Dimensions: In mm/mil
ABF
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FTB1F-15
THRU
FTB10F-15
Technical Data
Data Sheet N1716, Rev. -
Green Products
The recommended mounting pad size:
Marking Diagram:
Type number
Marking code
FTB1F-15
FTB2F-15
FTB4F-15
FTB6F-15
FTB8F-15
FTB10F-15
F15F1
F15 F2
F15F4
F15F6
F15F8
F15F10
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FTB1F-15
THRU
FTB10F-15
Technical Data
Data Sheet N1716, Rev. -
Green Products
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
FTB1F FTB2F FTB4F FTB6F FTB8F FTB10F
-15
-15
-15
-15
-15
-15
Units
Maximum repetitive peak reverse voltage
VRRM
100
200
400
600
800
1000
V
Maximum RMS voltage
VRMS
70
140
280
420
560
700
V
Maximum DC blocking voltage
VDC
100
200
400
600
800
1000
V
Average Rectified Output Current
at TA=50℃
Peak forward surge current 8.3ms single half
sine-wave superimposed on rated load (JEDEC
Method)
Io
1.5
A
IFSM
50
A
Maximum instantaneous forward voltage at 1.5A
VF
1.3
V
Maximum DC reverse current TA=25 ℃
at rated DC blocking voltage TA=125 ℃
IR
5.0
100
µA
Typical Junction Capacitance (Note 1)
CJ
25
pF
RθJA
Trr
Trr(TYP.)
TJ
80
500
300
-55 to +150
°C/W
TSTG
-55 to +150
°C
Typical Thermal Resistance (Note 2)
Maximum Reverse Recovery Time (Note 3)
Junction Temperature
Storage Temperature Range
Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
2. Mounted on glass epoxy PC board with 4×(5×5mm2) copper pad.
3. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
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ns
°C
FTB1F-15
THRU
FTB10F-15
Technical Data
Data Sheet N1716, Rev. -
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Green Products
FTB1F-15
THRU
FTB10F-15
Technical Data
Data Sheet N1716, Rev. -
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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