0402HL

Document 913-1
Chip Inductors – 0402HL (1005)
• Higher inductance values than other 0402 ceramic chip
inductors
Part number1
Inductance2
±5% (nH)
0402HL-271XJR_
0402HL-301XJR_
0402HL-331XJR_
0402HL-361XJR_
0402HL-391XJR_
0402HL-471XJR_
0402HL-511XJR_
0402HL-561XJR_
0402HL-601XJR_
0402HL-681XJR_
0402HL-741XJR_
0402HL-821XJR_
Q
270
300
330
360
390
470
510
560
600
680
740
820
•12 inductance values from 270 nH to 820 nH
DCR max5
Irms6
SRF typ4
typ3 (MHz)(Ohms) (mA)
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
[email protected] MHz
590
600
513
485
260
220
450
420
440
380
165
385
1.95
2.15
2.23
2.36
2.35
2.67
3.50
3.70
3.78
5.15
5.45
5.85
190
190
170
170
170
160
150
140
130
120
110
90
1. When ordering, please specify termination and packaging codes:
Core material Ceramic
0402HL-821XJRW
Termination:R=RoHS compliant matte tin over nickel over silverplatinum-glass frit.
Special order: Q = RoHS tin-silver-copper (95.5/4/0.5)
or P = non-RoHS tin-lead (63/37).
Packaging:W
=7″ machine-ready reel. EIA-481 punched paper
tape (2000 parts per full reel).
U=Less than full reel. In tape, but not machine ready.
To have a leader and trailer added ($25 charge),
use code letter W instead.
2. Inductance measured at 25 MHz using a Coilcraft SMD-F test fixture
and Coilcraft-provided correlation pieces with an Agilent/HP 4286
impedance analyzer.
3. Q measured using a Coilcraft SMD-F fixture in Agilent/HP 4287A
impedance analyzer or equivalent.
4. SRF measured using Agilent/HP 8753D network analyzer and Coilcraft
SMD­‑D test fixture.
5. DCR measured on Cambridge Technology micro-ohmmeter and a
Coilcraft CCF858 test fixture.
6. Current that causes a 15°C temperature rise from 25°C ambient. This
information is for reference only and does not represent absolute
maximum ratings.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Environmental RoHS compliant without exemption, halogen free
A max B max C max
D
E
F
G
H
Terminations RoHS compliant matte tin over nickel over silverplatinum-glass frit. Other terminations available at additional cost.
Weight 0.7 – 1.3 mg
Ambient temperature –40°C to +125°C with Irms current,
Storage temperature Component: –40°C to +140°C.
Tape and reel packaging: –40°C to +80°C
Maximum part temperature +140°C (ambient + temp rise).
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +150 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
One per billion hours / one billion hours, calculated per Telcordia SR-332
Packaging 2000 per 7″ reel. Paper tape: 8 mm wide, 0.66 mm thick,
2 mm pocket spacing
PCB washing Tested to MIL-STD-202 Method 215 plus an additional
aqueous wash. See Doc787_PCB_Washing.pdf.
I
0.048 0.031 0.022 0.010 0.0180.0080.0260.0140.025inches
1,22 0,79 0,56 0,25 0,460,200,660,360,64mm
Note: Height dimension (C) is before optional solder application. For maximum
height dimension including solder, add 0.006 in / 0,152 mm.
Document 913-1 Revised 01/18/12
Document 913-2
Chip Inductors – 0402HL Series
L vs Frequency
Typical Q vs Frequency
Typical Impedance vs Frequency
Document 913-2 Revised 01/18/12
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