FPBGA SNPB Auwire484_9065nmprods

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
3.44%
0.0790
Mold
24.22%
0.557
D/A Epoxy
0.48%
0.62%
0.0142
Solder Balls
24.25%
0.558
Foil
18.44%
28.56%
with SnPb Solder Balls
(90nm and 65nm products)
MSL: 3
Peak Reflow Temp: 225°C
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
21.80%
0.73%
1.16%
0.05%
0.48%
0.501
0.0167
0.0267
0.0011
0.0111
Silica (Fused or Amorphous)
Epoxy resin
Phenol resin
Carbon black
Other
60676-86-0
1333-86-4
-
0.39%
0.10%
0.0089
0.0022
Silver (Ag)
Organic esters and resins
7440-22-4
-
Gold (Au)
7440-57-5
0.0111
Wire
Substrate
484 fpBGA
2.30
Grams
Notes / Assumptions:
Die size: 9.63 x 11.36 mm
Mold Compound composition:
85 to 95% Silica Fused or Amorphous (LSC uses 90% in our calculation)
0.5 to 5% Epoxy resin (LSC uses 3% in our calculation)
3 to 6% Phenol resin (LSC uses 4.8% in our calculation)
approx. 0.2%
approx. 2%
Mold compound: Hitachi CEL9750HF10ALKU
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
Die Attach: Ablestik 2100A
0.8 to 1.0 mil diameter; 1 wire per solder ball
15.28%
8.97%
0.351
0.206
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Solder ball composition Sn63/Pb37
12.54%
5.90%
0.288
0.136
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.424
0.657
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B4