Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight February, 2012 % of Total Pkg. Wt. Weight (g) Die 1.48% 0.0111 Mold 54.91% 0.412 D/A Epoxy 0.24% 0.40% 0.0030 Solder Balls 13.46% 0.1009 Foil 21.27% 8.25% % of Total Weight (g) Pkg. Wt. Halogen Free MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 50.52% 2.75% 1.65% 0.3789 0.0206 0.0124 Silica Epoxy Resin Phenol Resin 60676-86-0 - 0.19% 0.05% 0.0014 0.0004 Silver-filled epoxy Silver (Ag) Organic esters and resins 7440-22-4 - Gold (Au) 7440-57-5 0.0018 Wire Substrate 208 ftBGA Side-by-side (dual-die) 0.750 Grams with SnAgCu Solder Balls Notes / Assumptions: Die size: 3.25 x 3.25 mm + 2.65 x 2.65 mm Mold Compound: Kyocera G2250LKDS series 75 to 95% Fused silica filler (LSC uses 92% in our calculation) 1 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 7% Phenal resin (LSC uses 3% in our calculation) Mold Compound Density ranges between 1.85 and 2.15 grams/cc Die Attach: Ablebond 2100A 70 to 100% Silver (LSC uses 80% in our calculation) 7 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Die attach epoxy Density: 4 grams/cc 0.7 mil Au wire 12.99% 0.40% 0.07% 0.0974 0.0030 0.0005 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn96.5%/Ag3.0%/Cu0.5% 14.46% 6.81% 0.1085 0.0510 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.1595 0.0619 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A