TB0203A _Rev.2.0_.pdf

TAI-SAW TECHNOLOGY CO., LTD.
No. 3, Industrial 2nd Rd., Ping-Chen Industrial District,
Taoyuan, 324, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail: [email protected]
Web: www.taisaw.com
Approval Sheet For Product Specification
Issued Date:
Product Name: Low-Loss 140MHz IF SAW Filter (BW=10 MHz)
TST Parts No.: TB0203A
Customer Parts No.:
Company:
Division:
Approved by :
Date:
Checked by:
Vincent-WT Chiu
Approval by:
Francis Chen
Date:
06 Nov. 2003
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
FR-71S03-01
TAI-SAW TECHNOLOGY CO., LTD.
No.3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail: [email protected] Web: www.taisaw.com
Low-Loss 140 MHz IF SAW Filter (SMD 13.3×6.5 mm)
Model No.: TB0203A
Rev. No.:2
RoHS Compliant
Lead free
Lead-free soldering
A. Maximum Rating:
1. Input Power Level: +20 dBm
2. Operating Temperature: -10°C to +70°C
3. Storage Temperature: -40°C to +85°C
B. Electrical Characteristics:
Parameters
Unit
MHz
Min.
139.6
Typical
140
Max.
140.4
Insertion Loss, IL
dB
-
10.5
11.5
1.5 dB Bandwidth
MHz
8.9
9.3
-
3 dB Bandwidth
MHz
9.4
9.9
-
35 dB Bandwidth
MHz
-
13.5
14.5
10 to 132 MHz
dB
45
50
149 to 260 MHz
dB
40
47
Amplitude ripple within Fc ± 3.6 MHz
dB
-
0.65
1.0
nsec
-
60
150
-
-
YZ-LN
-
ppm/ °C
-
-94
-
Center frequency, Fc
Relative Attenuation:
Group Delay ripple within Fc ± 3.6 MHz
Substrate Material
Temperature Coefficient of frequency
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
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C. Frequency Characteristics:
(1) Frequency Response
(2) Passband response and Group Delay Variation
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
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D. Measurement Circuit:
Source and load impedance: 50 Ω
Network analyzer
L1
K
50Ω
SAW Filter
E
L2
50Ω
C1
A,B,C,D,F,G,H,I,J,L
Input: L1=82H, Q>40; C1=33 pF
Output: L2=56 nH, Q>40
E. Outline Drawing:
203
Pin K: RF Input
Pin E: RF Output
Pin L: Input Ground
Pin F: Output Ground
Pin A, B, C, D, G, H, I, J: To be Ground
□: Date code
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
4