10 Fx122PB100SC03 M819F1x T1 14

10-FZ122PB100SC03-M819F18
10-F0122PB100SC03-M819F19
target datasheet
flow PHASE 0
1200 V / 100 A
Features
flow 0 housing
● High efficiency IGBT4 half-bridge
● Full current FWD
● Thermistor
12 mm housing
17 mm housing
Schematic
Target applications
●
●
●
●
●
Industrial Drives
Power Supply
Solar
UPS
Welding
Types
● 10-FZ122PB100SC03-M819F18
● 10-F0122PB100SC03-M819F19
Maximum Ratings
Tj=25°C, unless otherwise specified
Parameter
Condition
Symbol
Value
Unit
1200
V
116
A
300
A
307
W
±20
V
Half-bridge Switch
Collector-emitter voltage
Collector current
V CES
IC
T j = T jmax
Repetitive peak collector current
I CRM
t p limited by T jmax
Total power dissipation
P tot
T j = T jmax
Gate-emitter voltage
V GES
Short circuit ratings
Maximum Junction Temperature
Copyright Vincotech
T s =80 °C
T s =80 °C
t SC
Tj ≤ 150°C
10
µs
V CC
VGE = 15V
800
V
175
°C
T jmax
1
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10-FZ122PB100SC03-M819F18
10-F0122PB100SC03-M819F19
target datasheet
Parameter
Conditions
Symbol
Value
Unit
1200
V
107
A
200
A
207
W
175
°C
Half-bridge Diode
Peak Repetitive Reverse Voltage
Continuous (direct) forward current
V RRM
IF
Repetitive peak forward current
I FRM
Total power dissipation
P tot
Maximum Junction Temperature
T jmax
T j = T jmax
T s = 80°C
T j = T jmax
T s = 80°C
Module Properties
Parameter
Conditions
Symbol
Value
Unit
Thermal Properties
Storage temperature
T stg
-40…+125
°C
Operation Junction Temperature
T jop
-40…+(T jmax - 25)
°C
4000
V
min 12,7
mm
Isolation Properties
Isolation voltage
V isol
DC voltage
Creepage distance
t p=2s
Clearance
for 12 mm housing
9,12
mm
Clearance
for 17 mm housing
min 12,7
mm
Comparative Tracking Index
Copyright Vincotech
>200
CTI
2
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10-FZ122PB100SC03-M819F18
10-F0122PB100SC03-M819F19
target datasheet
Characteristic Values
Half-bridge Switch
Parameter
Symbol
Conditions
V GE [V]
V CE [V]
Value
I C [A]
T j[ °C]
Unit
Min
Typ
Max
5,1
5,8
6,4
1,90
2,1
Static
Gate-emitter threshold voltage
Collector-emitter saturation voltage
V GE(th)
V GE=V CE
0,0038
15
V CEsat
100
Collector-emitter cut-off current
I CES
0
1200
Gate-emitter leakage current
I GES
20
0
Internal gate resistance
Input capacitance
V
V
2,30
10
125
25
125
120
rg
7,5
µA
nA
Ω
6300
C ies
f=1 MHz
Reverse transfer capacitance
25
125
25
125
150
25
0
25
25
pF
270
C res
Thermal
Thermal resistance junction to sink
R th(j-s)
Thermal foil
thickness=76um
Kunze foil KU-ALF5
0,31
K/W
Value
Unit
Half-bridge Diode
Parameter
Symbol
Conditions
V r [V] I F [A] T j [°C]
Min
Typ
Max
1,83
2,05
Static
Forward voltage
VF
Reverse leakage current
Ir
100
1200
25
125
1,35
1,86
25
18
150
V
µA
Thermal
Thermal resistance junction to sink
Copyright Vincotech
R th(j-s)
Thermal foil
thickness=76um
Kunze foil KU-ALF5
3
0,46
K/W
01 Nov. 2015 / Revision 1
10-FZ122PB100SC03-M819F18
10-F0122PB100SC03-M819F19
target datasheet
Thermistor
Parameter
Conditions
Symbol
V GE [V]
Rated resistance
ΔR/R
Power dissipation
P
I C [A]
T j[ °C]
Min
25
R
Deviation of R100
V CE [V]
Value
R100=1486 Ω
100
Power dissipation constant
Typ
Unit
Max
21,5
-4,5
kΩ
+4,5
%
25
210
mW
25
3,5
mW/K
B-value
B(25/50)
25
3884
K
B-value
B(25/100)
25
3964
K
Vincotech NTC Reference
Copyright Vincotech
F
4
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10-FZ122PB100SC03-M819F18
10-F0122PB100SC03-M819F19
target datasheet
Ordering Code & Marking
Version
without thermal paste 12mm housing
without thermal paste 17mm housing
NN-NNNNNNNNNNNNNN
NNNNNNNN WWYY UL
Vinco LLLLL SSSS
Ordering Code
10-FZ122PB100SC03-M819F18
10-F0122PB100SC03-M819F19
Text
Datamatrix
in DataMatrix as
M819F18
M819F19
in packaging barcode as
M819F18
M819F19
Name
Date code
UL & Vinco
Lot
Serial
NN-NNNNNNNNNNNNNN-NNNNNNNN
WWYY
UL Vinco
LLLLL
SSSS
Type&Ver
Lot number
Serial
Date code
TTTTTTTVV
LLLLL
SSSS
WWYY
Outline
Pin table [mm]
Pin
X
Y
Function
1
0
0
DC-
2
0
2,3
DC-
3
0
4,6
DC-
4
0
6,9
DC-
5
0
15,6
DC+
6
0
17,9
DC+
7
0
20,2
DC+
8
0
22,5
DC+
9
13,85
16,45
G12
10
16,75
16,45
S12
11
12
33,5
33,5
11,5
9,2
Ph
Ph
13
33,5
6,9
Ph
14
33,5
4,6
Ph
15
33,5
2,3
Ph
16
33,5
0
Ph
17
13,85
13,55
Ph
18
19,55
4,95
S11
19
19,55
7,85
G11
20
21
33,5
26,1
22,5
22,5
Therm1
Therm2
Copyright Vincotech
12 mm housing
17 mm housing
5
01 Nov. 2015 / Revision 1
10-FZ122PB100SC03-M819F18
10-F0122PB100SC03-M819F19
target datasheet
Pinout
Identification
ID
Component
Voltage
Current
Function
T11,T12
IGBT
1200V
100A
Half-bridge Switch
D11,D12
FWD
1200V
100A
Half-bridge Diode
Rt
NTC
-
-
Thermistor
Copyright Vincotech
6
Comment
01 Nov. 2015 / Revision 1
10-FZ122PB100SC03-M819F18
10-F0122PB100SC03-M819F19
target datasheet
Packaging instruction
Standard packaging quantity (SPQ)
135
>SPQ
Standard
<SPQ
Sample
Handling instruction
Handling instructions for flow 0 packages see vincotech.com website.
Package data
Package data for flow 0 packages see vincotech.com website.
Document No.:
Date:
10-Fx122PB100SC03-M819F1x-T1-14
01 Nov. 2015
Modification:
Pages
Product status definition
Datasheet Status
Product Status
Target
Formative or In Design
Definition
This datasheet contains the design specifications for product development.
Specifications may change in any manner without notice. The data contained is
exclusively intended for technically trained staff.
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine
the suitability of the information and the product for reader’s intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval
of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or effectiveness.
Copyright Vincotech
7
01 Nov. 2015 / Revision 1