Data Sheet

Freescale Semiconductor, Inc.
Data Sheet: Technical Data
FXLN83xxQ
Rev 2.0, 7/2014
Xtrinsic FXLN83xxQ 3-Axis LowPower Analog-Output Accelerometer
FXLN83xxQ
FXLN83xxQ is a family of 3-axis, low-power, low-g, analogoutput accelerometers that consist of an acceleration sensor
along with a CMOS signal conditioning and control ASIC in a
3x3x1mm QFN package. The analog outputs for the X, Y, and Z
axes are internally compensated for zero-g offset and sensitivity,
and then buffered to the output pads. The outputs have a fixed
zero-g offset of 0.75V, irrespective of the VDD supply voltage.
The bandwidth of the output signal for each axis may be
independently adjusted using external capacitors. The host can
place the FXLN83xxQ into a low-current shutdown mode to
conserve power.
Features
• Supply voltage (VDD) from 1.71 V to 3.6 V
• Accelerometer operating ranges selectable
• ±2 g or ±8 g (FXLN83x1Q)
• ±4 g or ±16 g (FXLN83x2Q)
• Low current consumption of 180 μA (typical)
• Output Bandwidth Options
• High bandwidth, 2.7 kHz (XY axes), 600 Hz (Z axis),
(FXLN837XQ)
• Low bandwidth, 1.1 kHz (XY axes), 600 Hz (Z axis),
(FXLN836XQ)
• 3 x 3 x 1 mm, 12-pin QFN package (0.65 mm lead pitch)
• Robust design with high shock survivability (10,000 g)
• Operating temperature from –40 °C to +105 °C
• MSL 1 compliant
Typical Applications
• Tamper detection
• White goods: tilt, vibration, and shake detection
• Motion sensing in robotics applications
• Inclinometer, vibrometer
• Activity monitoring in sports and medical devices
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products. © 2014 Freescale Semiconductor, Inc. All rights
reserved.
12-pin QFN
3 mm x 3 mm x 1 mm
Case 2300-01
Top View
NC
NC
12
11
BYP 1
10
XOUT
VDD
2
9
YOUT
ST
3
8
ZOUT
EN
4
7
GND
5
6
g-Select GND
Pin Connections
Ordering Information
Part Number
Operating Range
Bandwidth
Temperature
Range
Package
Description
Shipping
FXLN8361QR1
±2/8 g
Low
–40 °C to +105 °C
QFN-12
Tape and reel (1 k)
FXLN8362QR1
±4/16 g
Low
–40 °C to +105 °C
QFN-12
Tape and reel (1 k)
FXLN8371QR1
±2/8 g
High
–40 °C to +105 °C
QFN-12
Tape and reel (1 k)
FXLN8372QR1
±4/16 g
High
–40 °C to +105 °C
QFN-12
Tape and reel (1 k)
Related Documentation
The FXLN83xxQ device features and operations are described in a variety of reference manuals, user guides,
and application notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at freescale.com.
2. In the Keyword search box at the top of the page, enter the device number FXLN83xxQ.
3. In the Refine Your Result pane on the left, click on the Documentation link.
2
Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Table of Contents
1 General Description......................................................................... 4
1.1 Block Diagram.........................................................................4
1.2 Pin Descriptions.......................................................................4
1.3 Typical Application Circuit..................................................... 6
1.4 Sensing Direction and Output Response................................. 6
2 Device Characteristics..................................................................... 8
2.1 Absolute Maximum Ratings.................................................... 8
2.2 Mechanical Specifications ...................................................... 9
2.3 Electrical Specifications ......................................................... 10
3 Printed Circuit Board Layout and Device Mounting.......................11
3.1 Printed Circuit Board Layout...................................................11
3.2 Overview of Soldering Considerations....................................12
3.3 Halogen Content...................................................................... 13
4 Package Information........................................................................ 13
4.1 Device Marking....................................................................... 13
4.2 Tape and Reel Information...................................................... 13
4.3 Package Description................................................................ 14
5 Revision History.............................................................................. 17
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
3
Freescale Semiconductor, Inc.
General Description
1 General Description
1.1 Block Diagram
BYP
XOUT
D2SAAF
VDD
aX,aY,aZ
10 KΩ
Z+
Y+
X+
G-cell
MUX
C2V
Gain
YOUT
MUX
D2SAAF
10 KΩ
ST
X-
Z-
Y-
ZOUT
D2SAAF
10 KΩ
EN
References
Self Test
Clock
Digital Logic
and
Control
g-Select
Figure 1. FXLN83xxQ block diagram
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Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
General Description
1.2 Pin Descriptions
NC
NC
12
11
BYP 1
10
XOUT
VDD
2
9
YOUT
ST
3
8
ZOUT
EN
4
7
GND
5
6
g-Select GND
Figure 2. Pin locations
Table 1. Pin descriptions
Pin
Name
Description
I/O
1
BYP
Internal voltage regulator output capacitor connection
Output
2
VDD
Supply voltage
Power
3
ST1
Self-Test
• When ST pin is logic high, the accelerometer is put into self-test mode.
• When ST pin is logic low, the accelerometer is put into normal operating mode.
Input
4
EN
Power enable pin
• When the EN pin is logic low, the accelerometer is shut down, minimizing current
consumption.
• When the EN pin is logic high, the accelerometer is fully functional.
Input
5
g-Select Full Scale Range selection:
For part numbers FXLN8361QR1 & FXLN8371QR1:
• When the g-select pin is logic low, the accelerometer is in ±8 g mode
• When the g-select pin is logic high, the accelerometer is in ±2 g mode
Input
For part numbers FXLN8362QR1 & FXLN8372QR1:
• When the g-select pin is logic low, the accelerometer is in ±16 g mode
• When the g-select pin is logic high, the accelerometer is in ±4 g mode
6
GND
Ground
Ground
7
GND
Ground
Ground
8
ZOUT
Z-axis analog output
Output
9
YOUT
Y-axis analog output
Output
10
XOUT
X-axis analog output
Output
11
NC
No internal connection, may be left floating or connected to GND
—
12
NC
No internal connection, may be left floating or connected to GND
—
EP
DNC
Center pads should not be soldered, refer to Printed Circuit Board Layout and Device Mounting
—
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
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Freescale Semiconductor, Inc.
General Description
1. The Self-Test function verifies the correct functioning of the sensor and signal path without the need to apply a
mechanical stimulus. When Self-Test is activated, an electrostatic actuation force is applied to the sensor, simulating a
small acceleration.
1.3 Typical Application Circuit
XOUT
12
11
C6
1
2
3
C3
0.1μF
4
XOUT
VDD
YOUT
ST
EN
ZOUT
GND
10
9
YOUT
8
7
C5
5
6
C2
4.7μF
BYP
g-Select
GND
VDD
NC
NC
C1
0.1μF
ZOUT
FXLN83xxQ
C4
SELF-TEST
ENABLE
RANGE SELECT
Notes:
1. Position the decoupling capacitors (C2, C3) as near as
possible to the VDD pin (common practice to filter out
undesired noise from the power supply).
2. C1 is required to stabilize the output of the internal
voltage regulator.
3. Connecting the EN pin to the VDD pin is not a supported
configuration and may prevent the part from starting up.
Do not set the EN pin high until VDD > 1.71 V.
Recommended Minimum Capacitance Specifications
Part Number
FXLN8361Q
FXLN8362Q
FXLN8371Q
FXLN8372Q
Bandwidth C4 (pF) C5 (pF)
Low
Low
High
High
9100
9100
8200
8200
9100
9100
3300
3300
C6 (pF)
9100
9100
3300
3300
Figure 3. Electrical Connections
6
Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
General Description
1.4 Sensing Direction and Output Response
Side View
Top View
BACK
Pin 1
Xout @ 0 g
Yout @ 0 g
Zout @ –1 g
FRONT
263
P3XX
ALYM
Xout @ 0 g
Yout @ –1 g
Zout @ 0 g
Xout @ 0 g
Yout @ 0 g
Zout @ 1 g
Earth Gravity
Z
263
P3XX
ALYM
Xout @ –1 g
Yout @ 0 g
Zout @ 0 g
Xout @ 1 g
Yout @ 0 g
Zout @ 0 g
X
Xout @ 0 g
Yout @ 1 g
Zout @ 0 g
Y
Top View
Part Number
Mode
FXLN8361Q, FXLN8371Q
FXLN8362Q, FXLN8372Q
XYZ Output Voltage
–1 g
0g
+1 g
±2 g
±8 g
0.521
0.693
0.750
0.750
0.979
0.807
±4 g
±16 g
0.636
0.722
0.750
0.750
0.865
0.779
Figure 4. Sensitive Axes Orientation and Response to Gravity Stimulus
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
7
Freescale Semiconductor, Inc.
Device Characteristics
2 Device Characteristics
2.1 Absolute Maximum Ratings
Absolute maximum ratings are the limits the device can be exposed to without
permanently damaging it. Absolute maximum ratings are stress ratings only; functional
operation at these ratings is not guaranteed. Exposure to absolute maximum ratings
conditions for extended periods may affect reliability.
This device contains circuitry to protect against damage due to high static voltage or
electrical fields. It is advised, however, that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
circuit.
Table 2. Absolute maximum ratings
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to +3.6
V
Drop-test height, component
Ddrop
1.8
m
Operating temperature range
TOP
–40 to +105
°C
Storage temperature range
TSTG
–40 to +125
°C
Table 3. ESD and latch-up protection characteristics
Rating
Symbol
Value
Unit
VHBM
±2000
V
Machine model (MM)
VMM
±200
V
Charge device model (CDM)
VCDM
±500
V
Latch-up current at T = 85 °C
ILU
±100
mA
Human body model (HBM)
Caution
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
Caution
This is an ESD sensitive device, improper handling can cause permanent damage to the part.
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Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Device Characteristics
2.2 Mechanical Specifications
Table 4. Mechanical characteristics
Parameter
Symbol
Full scale range (FXLN83X1)
FSR
Full scale range (FXLN83X2)
Nominal sensitivity
SEN
Test Conditions
Min
Typ
Max
±2 g mode
—
±2
—
±8 g mode
—
±8
—
±4 g mode
—
±4
—
±16 g mode
—
±16
—
±2 g range
—
229.0
—
±4g range
—
114.5
—
±8 g range
—
57.25
—
±16 g range
—
28.62
—
Unit
g
mV/g
±2 g
Calibrated sensitivity
SENCAL
±4 g
VBYP/(3.276*gRange)
±8 g
V/g
±16 g
Calibrated sensitivity error
SENERR
±2 g range
–5
—
+5
±4 g range
–6
—
+6
%
Sensitivity change vs.
temperature1
TCS
—
–0.07
—
+0.07
%/°C
Cross-axis sensitivity1
CAS
—
–4.2
—
+4.2
%
STOC
—
35(XY)
300(Z)
—
—
mg
±2 g range
0.705
0.75
0.795
0.7125
0.75
0.7875
±2 g range
–1.2
—
+1.2
±4 g range
–2.0
—
+2.0
1 mm (overall thickness),
2-layer, FR4-based PCB
–200
—
+200
mg
FXLN8371QR1,
FXLN8372QR1
—
200(XY)
280(Z)
—
µg/√Hz
FXLN8361QR1,
FXLN8362QR1
—
130(XY)
200(Z)
—
µg/√Hz
—
–40
—
+105
°C
Self-test output change1
Zero-g level offset
VOFF
±4 g range
±8 g range
V
±16 g range
Zero-g level change vs.
temperature1
Zero-g level offset, post board
mount1
Noise Density1, 2
Operating temperature range1
TCO
OFFPBM
ND
TOP
mg/°C
Notes:
Test conditions (unless otherwise noted):
• VDD = 2.8 V, unless otherwise noted
• T = 25 °C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product)
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
9
Freescale Semiconductor, Inc.
Device Characteristics
Table 4. Mechanical characteristics
• Analog acceleration output pin loading = 3.3 nF capacitors on X and Y axes, with 8.2 nF capacitor on Z axis (HBW
configuration)
• Analog acceleration output pin loading = 9.1 nF capacitors on X, Y and Z axes (LBW configuration)
• No analog acceleration output pin loading other than external BW setting capacitor
• No BYP pin loading other than bypass capacitor and 150 μA DC current draw through resistive divider.
1. Limits verified by characterization only.
2. High and Low Bandwidth modes are configured in non-volatile Memory (NVM) at the factory
2.3 Electrical Specifications
Table 5. Electrical characteristics
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Supply voltage1
VDD
—
1.71
2.8
3.6
V
Active supply current
IDD
—
—
180
—
µA
IDD–SD
—
—
30
—
nA
VBYP
IBYP ≤ 150 µA
1.45
1.5
1.55
V
RO
—
8
10
12
kΩ
High BW device
—
2700(XY)
600(Z)
—
Low BW device
—
1100(XY)
600(Z)
—
Shutdown supply current
Voltage supplied at BYP
pin1
Output impedance (XYZ
outputs)1
Bandwidth1, 2, 3
BW
Hz
BYP output capacitor value
CBYP
External capacitor
70
100
500
nF
Logic high input level on EN, gSelect, ST pins1
VIH
—
0.75 * VDD
—
VDD
V
Logic low input level on EN, gSelect, ST pins1
VIL
—
0
—
0.3 * VDD
V
Turn-on time1, 2, 4
TON
—
660
—
µs
—
340
—
µs
–40
—
+105
°C
g-Select transition
delay3
Operating temperature range1
Tg-Select
TOP
—
Notes:
Test conditions (unless otherwise noted):
• VDD = 2.8 V
• Output load = 3.3 nF capacitors on X and Y axes, with 8.2 nF capacitor on Z axis (HBW configuration)
• Output load = 9.1 nF capacitors on X, Y and Z axes (LBW configuration)
• Output loading other than external capacitor: high impedance
• No electrical loading on BYP pin other than output capacitor and 150 μA (max)
• DC output current for ADC reference input
• T = 25°C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product)
1. Limits verified by characterization only.
2. Apply VDD first. Then, Turn-on time is defined by the delay between when the EN pin is set to high and the time at
which a pin's output value reaches 90% of its final value.
3. g-Select pin transition from high to low. Time for output value to reach 90% of final value.
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Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Printed Circuit Board Layout and Device Mounting
4. BYP pin is not connected
3 Printed Circuit Board Layout and Device Mounting
Printed Circuit Board (PCB) layout and device mounting are critical to the overall
performance of the design. The footprint for the surface mount packages must be the
correct size as a base for a proper solder connection between the PCB and the
package. This, along with the recommended soldering materials and techniques, will
optimize assembly and minimize the stress on the package after board mounting.
Freescale application note AN1902, "Assembly Guidelines for QFN and DFN
Packages" discusses the QFN package used by the FXLN83xxQ.
3.1 Printed Circuit Board Layout
The following recommendations are a guide to an effective PCB layout. See Figure 5
for footprint dimensions.
• The PCB land should be designed with Non-Solder Mask Defined (NSMD) as
shown in Figure 5.
• No additional via pattern underneath package.
• No components or vias should be placed at a distance less than 2 mm from the
package land area. This may cause additional package stress if it is too close to
the package land area.
• Signal traces connected to pads should be as symmetric as possible. Put dummy
traces on the NC pads in order to have same length of exposed trace for all pads.
• No copper traces should be on the top layer of the PCB under the package. This
will cause planarity issues with board mount. Freescale QFN sensors are
compliant with Restrictions on Hazardous Substances (RoHS), having halide-free
molding compound (green) and lead-free terminations. These terminations are
compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-Cu) solder
paste soldering processes. Reflow profiles applicable to those processes can be
used successfully for soldering the devices.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
11
Freescale Semiconductor, Inc.
Printed Circuit Board Layout and Device Mounting
12X 0.330
3
5
12X 0.5
0.3
12X 0.686
12X 0.35
0.25
6
12X 0.3105
7
4
8X 0.325
8X 0.325
3
1
10
24
4X 0.650
4X 0.650
20
Package footprint
Package
PCB land pad
12X 0.533
12X 0.305
12X 0.889
12X 0.635
Package footprint
12X 0.4121
8X 0.325
8X 0.325
otprint
aste stencil
sk opening
4X 0.650
4X 0.650
Package footprint
Solder stencil opening
Solder mask opening
Figure 5. Footprint
3.2 Overview of Soldering Considerations
The information provided here is based on experiments executed on QFN devices.
These experiments cannot represent exact conditions present at a customer site.
Therefore, information herein should be used for guidance purposes only. Process and
design optimizations are recommended to develop an application-specific solution.
With the proper PCB footprint and solder stencil designs, the package will self-align
during the solder reflow process.
• Stencil thickness should be 100 or 125 µm.
• The PCB should be rated for the multiple lead-free reflow condition with a
maximum 260 °C temperature.
12
Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Package Information
• Use a standard pick-and-place process and equipment. Do not use a hand
soldering process.
• Do not use a screw-down or stacking to mount the PCB into an enclosure. These
methods could bend the PCB, which would put stress on the package.
3.3 Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer
standards. Halogen Free means that no homogeneous material within the assembly
package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight or
bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
4 Package Information
The FXLN83xxQ device uses a 12-lead QFN package, case number 2300-01.
4.1 Device Marking
Top View
Freescale code
263
P3XX
ALYW
Traceability date code
Assembly site
Lot code
Work week
Part number
P3XX
71, 72, 61, or 62
P = Prototype, 8 = Production
Figure 6. Device Marking Description
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
13
Freescale Semiconductor, Inc.
Package Information
4.2 Tape and Reel Information
Figure 7. Tape dimensions
Pin 1
Direction
to unreel
Barcode label
side of reel
Figure 8. Tape and reel orientation
14
Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Package Information
4.3 Package Description
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
15
Freescale Semiconductor, Inc.
Package Information
This drawing is located at freescale.com.
16
Freescale Semiconductor, Inc.
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Revision History
5 Revision History
Revision
number
Revision date
1.0
11/2013
Initial release.
1.1
7/2014
Revised to match current Freescale standard
2.0
7/2014
Description
Figure 3, added note #3
Changed document type from Advance Information to Technical Data
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
17
Freescale Semiconductor, Inc.
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Information in this document is provided solely to enable system and
software implementers to use Freescale products. There are no express
or implied copyright licenses granted hereunder to design or fabricate
any integrated circuits based on the information in this document.
Freescale reserves the right to make changes without further notice to
any products herein.
Freescale makes no warranty, representation, or guarantee regarding
the suitability of its products for any particular purpose, nor does
Freescale assume any liability arising out of the application or use of
any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages.
“Typical” parameters that may be provided in Freescale data sheets
and/or specifications can and do vary in different applications, and
actual performance may vary over time. All operating parameters,
including “typicals,” must be validated for each customer application by
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© 2014 Freescale Semiconductor, Inc.
Document Number FXLN83xxQ
Revision 2.0, 7/2014
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