lduv9s53.pdf

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
LDUV9S53
DATA SHEET
DOC. NO : QW0905-LDUV9S53
REV.
: A
DATE
: 07 - Mar. - 2016
發行
立碁電子
DCC
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PART NO. LDUV9S53
Features:
1. Top view LED.
2. white SMT package.
3. Leadframe package with individual 2 pin.
4.Wide viewing angle.
5.Soldering methods:IR reflow soldering.
6.Feature of the device:more light due to higher optical efficiency;extremely
wide viewing angle;ideal for backlighting and coupling in light guide.
Descriptions:
The LDUV9S53 SMD has wide viewing angle and optimized light coupling by
inter reflector,The low current requirement makes this device ideal for portable
equipment or any other application where power is at a premium.
Applications:
1. Telecommunication: indicator and backlighting in telephone and fax.
2. Indicators.
3. Switch lights.
Device Selection Guide:
COLOR
PART NO
LDUV9S53
MATERIAL
InGaN
Emitted
Lens
Purple
Water Clear
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PART NO. LDUV9S53
Package Dimensions
3.0
0.75
0.75
2.0
1.4
Soldering Terminal
Cathode Mark
2.7
Andoe
1.3
Cathode
Polarity
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
1.6
1.5
1.5
4.3
Note : The tolerances unless mentioned is ±0.1mm,Unit=mm.
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Page 3/11
PART NO. LDUV9S53
Absolute Maximum Ratings at Ta=25℃
Symbol
Ratings
UNIT
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/11@10KHz
IFP
100
mA
Power Dissipation
PD
108
mW
Reverse Current @5V
Ir
50
μA
Electrostatic Discharge
ESD
500
V
Operating Temperature
Topr
- 40 ~ + 85
°C
Storage Temperature
Tstg
- 40 ~ + 100
°C
Parameter
Typical Electrical & Optical Characteristics (Ta=25℃)
Symbol
Min.
Typ.
Radiant Intensity
Po
3.2
4.2
----
mw/sr
IF=20mA
Peak Wavelength
λP
----
400
----
nm
IF=20mA
△λ
----
20
----
nm
IF=20mA
VF
2.8
----
3.6
V
IF=20mA
2θ 1/2
----
120
----
deg
IF=20mA
Items
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Max. UNIT
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2.The luminous intensity data did not including ±15% testing tolerance.
3.The peak wavelength data did not including ±1nm testing tolerance.
CONDITION
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PART NO. LDUV9S53
Radiant Intensity Classification
BIN CODE
Po(mw/sr) at20mA
Min.
Max.
P
3.2
4.2
Q
4.2
5.5
R
5.5
7.2
S
7.2
9.4
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PART NO. LDUV9S53
Typical Electro-Optical Characteristics Curve
DUV CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vsForward Current
3.9
2.5
3.8
2.0
Relative Intensity
Normalize @20mA
Forward Voltage(V)
3.7
3.6
3.5
3.4
3.3
3.2
1.5
1.0
0.5
0
3.1
20
30
40
50
60
80
70
90
100
20
30
40
50
60
70
80
90
100
Forward Current(mA)
Forward Current(mA)
Fig.4 Relative Intensity vs. Wavelength
Fig.3 Forward Current vs. Wavelength
1.0
Relative Intensity@20mA
Wavelength(nm)WLP
420
410
400
390
380
20
40
60
80
100
Fig.5 Directive Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25%
50% 75% 100%
0.5
0.0
350
400
450
550
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PART NO. LDUV9S53
Carrier Type Dimensions
4.0
2.0
4.0
1.5
0.25
1.75
3.5
8.0±0.3
5.3
3.44
Polarity
1.53
Note : The tolerances unless mentioned is ± 0.1mm,Unit=mm.
‧ Packing Specifications
0.2
0.8
0.6
Aluminum Moist-Proof bag
Label
0.8
0.6
0.2
0.4
0.4
Label
Part No.
Description
Quantity/Reel
LDUV9S53
8.0mm tape,7"reel
2000 PCS
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Page 7/11
PART NO. LDUV9S53
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
PART :
LDUV9S53
BIN : Luminous Intensity
LOT :
GS11370168
HUE : Dominant Wavelength
QTY(PCS):
2000
VF: Forward Voltage
BIN/HUE :
Q
VF:2.8-3.6
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178 ±1.5
60.0±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LDUV9S53
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
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PART NO. LDUV9S53
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 320℃ 3 sec one time only.
2 PB-Free Reflow Solder
1~5°C/sec
1~5°C/sec
Preheat
180~200°C
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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PART NO. LDUV9S53
Precautions For Use:
Storage time:
1. Calculated shelf life before opening is 12 months at < 30°C and < 90% relative humidity (RH)
2. After bag is opened, devices which will be subjected to reflow soldering or other high
temperature processes must be
a) Assemblied within 168 hours in an environment of ≦ 30°C / 60% RH, or
b) Stored at ambient of 10% RH or less
3. Devices are required baking before assembly if:
a) Humidity Indicator Card reads >10% (for level 2a -5a)
or >60% (for level 2) at ambient temperature 23 ±5°C
b) 2.a) or 2.b) doesn't meet
4. If baking is required, devices should be baked for >24 hours at 60±5°C.Performing baking only once,
and using the baked devices within 72 hours.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 11/11
PART NO. LDUV9S53
Reliability Test:
Classification
Test Item
Test Condition
Sample
Size
Operating Life Test
1.Ta=25°C
2.If=20mA
3.t=1000 hrs (-24hrs,+72hrs)
22
High Temperature
Storage Test
1.Ta=100°C±5°C
2.t=1000 hrs (-24hrs,+72hrs)
22
Low Temperature
Storage Test
1.Ta=-40°C±5°C
2.t=1000 hrs (-24hrs,+72hrs)
22
High Temperature
High Humidity
Storage Test
1.Ta=85°C
2.RH=85%
3.t=1000hrs(-24hrs,+72hrs)
22
1.Ta=100°C±5°C ~ -40°C±5°C
20min/ 10sec / 20min
2.total 100 cycles
22
1.100°C±5°C ~ -40°C±5°C
30mins / 5mins / 30mins
2.100 Cyeles
22
Endurance
Test
Thermal Shock Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.T=260°C Max. 10sec.Max.
2. 6 Min
22