RCV e3 www.vishay.com Vishay Draloric High Voltage (up to 0.5 kV) Thick Film Chip Resistors FEATURES • High operating voltage (up to 500 V) • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS MODEL CASE SIZE INCH CASE SIZE METRIC POWER RATING P70 W LIMITINGELEMENT VOLTAGE UMAX. ACRMS/DC V RCV0805 e3 0805 RR 2012M 0.125 400 RCV1206 e3 1206 RR 3216M 0.25 TEMPERATURE COEFFICIENT ± ppm/K TOLERANCE ±% 100 1 200 5 100 1 200 5 500 RESISTANCE RANGE SERIES E24; E96 100K to 10M E24 E24; E96 100K to 10M E24 Notes • These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating voltage and permissible film temperature. However, the resistance typically increases due to the resistor’s film temperature over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional lifetime. • No marking. • Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material. TECHNICAL SPECIFICATIONS PARAMETER UNIT RCV0805 RCV1206 Rated dissipation P70 (1) W 0.125 0.25 Limiting element voltage Umax. ACRMS/DC V 400 Insulation voltage Uins. (1 min) V Voltage coefficient of resistance chart Insulation resistance 500 > 500 ppm/V 25 > 109 Operating temperature range °C Weight mg - 55 to + 155 5.5 10 Note (1) The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded. PART NUMBER AND PRODUCT DESCRIPTION Part Number: RCV1206100KFKEA R C V 1 2 0 6 1 0 0 K F K E A MODEL RESISTANCE TOLERANCE TCR PACKAGING RCV0805 RCV1206 K = Thousand M = Million F=±1% J=±5% K = ± 100 ppm/K N = ± 200 ppm/K EA, EB, EC Product Description: RCV1206 100 100K 1 % ET1 e3 RCV1206 100 100K 1% ET1 e3 MODEL TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE RCV0805 RCV1206 ± 100 ppm/K ± 200 ppm/K 100K = 100 k 10M = 10 M ±1% ±5% ET1, ET5, ET6 e3 = Pure tin termination finish Revision: 27-Mar-13 Document Number: 20054 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCV e3 www.vishay.com Vishay Draloric PACKAGING MODEL CODE EA = ET1 5000 180 mm/7" RCV0805 EB = ET5 10 000 285 mm/11.25" EC = ET6 20 000 EA = ET1 5000 EB = ET5 10 000 285 mm/11.25" EC = ET6 20 000 330 mm/13" RCV1206 QUANTITY CARRIER TAPE Paper tape acc. to IEC 60068-3 Type I WIDTH PITCH 8 mm REEL DIAMETER 330 mm/13" 4 mm 180 mm/7" DIMENSIONS SOLDER PAD DIMENSIONS in millimeters SIZE DIMENSIONS in millimeters REFLOW SOLDERING INCH METRIC L W 0805 2012 2.0 + 0.20 - 0.10 1206 3216 3.2 + 0.10 - 0.20 H 1.25 ± 0.15 0.45 ± 0.05 1.6 ± 0.15 0.55 ± 0.05 T1 WAVE SOLDERING T2 a b l a b l 0.3 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3 0.45 ± 0.2 0.4 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3 0 50 0.3 + 0.20 - 0.10 Fraction of Rated Dissipation P70 FUNCTIONAL PERFORMANCE 100 % 50 0 - 50 Derating Revision: 27-Mar-13 100 °C 150 70 Ambient Temperature in amb Document Number: 20054 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCV e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS PROCEDURE EN 60115-1 IEC 60068-2 CLAUSE TEST METHOD TEST REQUIREMENTS PERMISSIBLE CHANGE (R) Stability for product types: 100 k to 10 M RCV e3 4.5 - Resistance - ±1% ±5% 4.13 - Short time overload U = 2.5 x P 70 x R 2 x Umax.; 5s ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 4.17.2 58 (Td) Solder bath method; Sn60Pb40 non-activated flux; (235 ± 5) °C (2 ± 0.2) s Good tinning ( 95 % covered); no visible damage Solder bath method; Sn96.5Ag3Cu0.5 non-activated flux; (245 ± 5) °C (3 ± 0.3) s Good tinning ( 95 % covered); no visible damage Solderability - Temperature coefficient (20/- 55/20) °C and (20/155/20) °C 4.32 21 (Uu3) Shear (adhesion) 205 N No visible damage 4.33 21 (Uu1) Substrate bending Depth 2 mm; 3 times No visible damage, no open circuit in bent position ± (0.25 % R + 0.05 ) 4.8.4.2 ± 100 ppm/K ± 200 ppm/K 30 min. at - 55 °C; 30 min. at 125 °C 4.19 14 (Na) 4.23 Rapid change of temperature 5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 1000 cycles ± (1 % R + 0.05 ) ± (1 % R + 0.05 ) ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 70 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 70 °C; 8000 h ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) - Climatic sequence: - 4.23.2 2 (Ba) Dry heat 125 °C; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C; 90 % RH 24 h; 1 cycle 4.23.4 1 (Aa) Cold - 55 °C; 2 h 4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h 4.23.6 30 (Db) Damp heat, cyclic 55 °C; . 90 % RH 24 h; 5 cycle 4.23.7 - DC load U= P 70 x R U = P 70 x R Umax.; 1.5 h on; 0.5 h off; 4.25.1 - 58 (Td) Resistance to soldering heat Solder bath method (260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (1 % R + 0.05 ) ± (2 % R + 0.05 ) - Endurance at upper category temperature 155 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.05 ) 4.18.2 4.24 Endurance at 70 °C 4.25.3 Revision: 27-Mar-13 Document Number: 20054 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCV e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS PROCEDURE EN 60115-1 IEC 60068-2 CLAUSE TEST METHOD TEST Stability for product types: RCV e3 REQUIREMENTS PERMISSIBLE CHANGE (R) 100 k to 10 M 4.40 - Electrostatic discharge (human body model) IEC 61340-3-1; 3 pos. + 3 neg. discharges; ESD voltage acc. to style ± (1 % R + 0.05 ) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage 4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1, toothbrush Marking legible, no visible damage 4.22 6 (Fc) Vibration, endurance by sweeping f = 10 Hz to 2000 Hz; x, y, z 1.5 mm; A 200 m/s2; 10 sweeps per axis 4.37 - Periodic electric overload 4.27 - Single pulse high voltage overload, 10 μs/700 μs 15 x P 70 x R 2 x Umax.; 0.1 s on; 2.5 s off; 1000 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) U= Û = 10 x P 70 x R 2 x Umax.; 10 pulses ± (1 % R + 0.05 ) ± (1 % R + 0.05 ) All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification • EN 140400, sectional specification • EN 140401-802, detail specification • IEC 60068-2-x, environmental test procedures Revision: 27-Mar-13 Document Number: 20054 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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