CRA04P Datasheet

CRA04P
www.vishay.com
Vishay
Thick Film Chip Resistor Array
FEATURES
• Concave terminal array with square corners
• Wide ohmic range: 1R0 to 1M0
• 8 terminal package with isolated resistors
• Pure tin solder contacts on Ni barrier layer,
provides compatibility with lead (Pb)-free and
lead containing soldering processes
The CRA04P thick film resistor array is constructed on a
high grade ceramic body with concave terminations. A small
package enables the design of high density circuits. The
single component reduces board space, component counts
and assembly costs.
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CIRCUIT
CRA04P
03
POWER RATING
P70 °C
W
LIMITING ELEMENT
VOLTAGE MAX.
V
0.063
50
TEMPERATURE
COEFFICIENT
± ppm/K
TOLERANCE
±%
RESISTANCE
RANGE

100
2
10 to 1M
24
200
5
1 to 1M
24
E-SERIES
Zero-Ohm-Resistor: Rmax. = 50 m, Imax. = 1 A
TECHNICAL SPECIFICATIONS
PARAMETER
Rated dissipation P70 (1)
UNIT
CRA04P
W per element
0.063
V
50
Limiting element voltage Umax. AC/DC
Insulation voltage Uins (1 min)
V
100
Insulation resistance

> 109
Category temperature range
°C
- 55 to + 155
Note
(1) Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRA04P08347K0JTD (2)
C
R
A
0
4
P
0
8
3
4
7
K
0
J
T
D
MODEL
TERMINAL
STYLE
PIN
CIRCUIT
VALUE
TOLERANCE
PACKAGING (3)
SPECIAL
CRA04
P
08
3 = 03
R = Decimal
K = Thousand
M = Million
0000 = 0  Jumper
G=±2%
J=±5%
Z = 0  Jumper
TD
TC
PZ
Up to 2 digits
Product Description: CRA04P 08 03 47K 5 % RT7 e3
CRA04P
08
03
47K
5%
RT7
e3
MODEL
TERMINAL COUNT
CIRCUIT TYPE
RESISTANCE VALUE
TOLERANCE
PACKAGING (3)
LEAD (Pb)-FREE
CRA04P
08
03
10R = 10 
47K = 47 
1M = 1 M
0R0 = 0  Jumper
±2%
±5%
RT7
RT6
PZ
e3 = Pure tin
termination finish
Notes
Preferred way for ordering products is by use of the PART NUMBER.
Please refer to the table PACKAGING, see next page.
(2)
(3)
Revision: 24-Jun-13
Document Number: 31048
1
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRA04P
www.vishay.com
Vishay
PACKAGING
PACKAGING CODE
MODEL
TAPE WIDTH
DIAMETER
PITCH
PIECES/REEL
PAPER TAPE
PART NUMBER
CRA04P
8 mm
PRODUCT DESCRIPTION
180 mm/7"
2 mm
10 000
TD
RT7
330 mm/13"
2 mm
20 000
TC
RT6
330 mm/13"
2 mm
50 000
PZ
PZ
CIRCUIT
DERATING
Rated Power in %
03 Circuit
120
100
80
60
40
20
0
- 55
- 25
0
25
50
75
70
100
125
155 175
Ambient Temperature in °C
DIMENSIONS
A
C
PIN
NO#
8
W
P
B
TOL.
DIMENSIONS in millimeters
L
A
B
C
PNOM.
T
W
2.00
0.20
0.32
0.25
0.50
0.45
1.00
± 0.20 ± 0.10 ± 0.10 ± 0.15
-
± 0.10 ± 0.10
T
L
SOLDER PAD DIMENSIONS in millimeters
WAVE
c
c
w
p
a
b
0.5
1.5
0.5
0.32
0.5
w
b
p
Revision: 24-Jun-13
a
Document Number: 31048
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRA04P
www.vishay.com
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
REQUIREMENTS PERMISSIBLE
CHANGE (R) (1)
PROCEDURE
STABILITY CLASS 2 OR BETTER
Stability for product type:
CRA04P
10  to 1 M
1  to 1 M
±2%
±5%
4.5
-
Resistance
-
4.7
-
Voltage proof
U = 1.4 x Uins; 60 s
No flashover or breakdown
4.13
-
Short time overload
U = 2.5 x P 70 x R
 2 × Umax.; Duration according to style
± (0.5 % R + 0.05 )
Solder bath method; Sn60Pb40;
non-activated flux; (235 ± 5) °C; (2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method; Sn96.5Ag3Cu0.5;
non-activated flux; (245 ± 5) °C; (3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.17.2
4.8.4.2
58 (Td)
Solderability
-
Temperature coefficient
(20/- 55/20) °C and (20/125/20) °C
4.32
21 (UU3)
Shear (adhesion)
45 N
No visible damage
4.33
21 (UU1)
Substrate bending
Depth 2 mm; 3 times
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 )
4.19
14 (Na)
Rapid change of temperature
30 min. at - 55 °C; 30 min at 125 °C
5 cycles
1000 cycles
± (0.5 % R + 0.05 )
± (1 % R + 0.05 )
-
Dry heat
-
4.23.2
4.23
2 (Ba)
Damp heat, cyclic
125 °C; 16 h
55 °C;  90 % RH; 24 h; 1 cycle
4.23.3
30 (Db)
Cold
4.23.4
1 (Aa)
Low air pressure
- 55 °C; 2 h
4.23.5
13 (M)
-
1 kPa; (25 ± 10) °C; 1 h
4.23.6
30 (Db)
Damp heat, cyclic
55 °C;  90 % RH; 24 h; 5 cycle
4.23.7
-
D.C. load
4.25.1
-
4.18.2
U =
± 100 ppm/K
± 200 ppm/K
± (2 % R + 0.05 )
P 70 x R
Endurance at 70 °C
U = P 70 x R  U max.
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (2 % R + 0.1 )
± (4 % R + 0.1 )
58 (Td)
Resistance to soldering heat
Solder bath method; (260 ± 5) °C; (10 ± 1) s
± (0.5 % R + 0.05 )
4.35
-
Flammability, needle flame test
IEC 60695-11-5; 10 s
No burning after 30 s
4.24
78 (Cab)
Damp heat, steady state
(40 ± 2) °C; (93 ± 3) % RH; 56 days
± (1 % R + 0.05 )
4.25.3
-
Endurance at
upper category temperature
155 °C; 1000 h
± (2 % R + 0.1 )
4.40
-
Electrostatic discharge
(human body model)
IEC 61340-3-1; 3 positive and 3 negative
discharges; ESD voltage according to style
± (1 % R + 0.05 )
4.29
45 (XA)
Component solvent resistance
Isopropyl alcohol; 50 °C; method 2
No visible damage
Marking legible,
no visible damage
4.30
45 (XA)
Solvent resistance of marking
Isopropyl alcohol; 50 °C; method 1;
toothbrush
4.22
6 (Fc)
Vibration, endurance by sweeping
f = 10 Hz to 2000 Hz; x, y, z  1.5 mm;
A  200 m/s2; 10 sweeps per axis
± (0.5 % R + 0.05 )
4.37
-
Periodic electric overload
U = 15 x P 70 x R  2 x U max.
0.1 s on; 2.5 s off; 1000 cycles
± (1 % R + 0.05 )
4.27
-
Single pulse high voltage overload,
10 μs/700 μs
P 70 x R  2 x U max.
10 pulses
± (1 % R + 0.05 )
Û = 10 x
Note
(1) Figures are given for a single element.
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 24-Jun-13
Document Number: 31048
3
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000