Data Sheet

Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
DESCRIPTION
Monolithic temperature and
overload protected logic level power
MOSFET in a 5 pin surface
mounting plastic envelope, intended
as a general purpose switch for
automotive systems and other
applications.
BUK114-50L/S
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VDS
ID
Ptot
Tj
RDS(ON)
Continuous drain source voltage
Continuous drain current
Total power dissipation
Continuous junction temperature
Drain-source on-state resistance
VIS = 5 V
VIS = 7 V
SYMBOL
PARAMETER
VPSN
Protection supply voltage
BUK114-50L
BUK114-50S
APPLICATIONS
General controller for driving
lamps
motors
solenoids
heaters
FEATURES
Vertical power DMOS output
stage
Low on-state resistance
Logic and protection supply
from separate pin
Low operating supply current
Overload protection against
over temperature
Overload protection against
short circuit load
Latched overload protection
reset by protection supply
Protection circuit condition
indicated by flag pin
5 V logic compatible input level
Separate input pin
for higher frequency drive
ESD protection on input, flag
and protection supply pins
Over voltage clamping for turn
off of inductive loads
Both linear and switching
operation are possible
PINNING - SOT426
PIN
UNIT
50
15
40
150
V
A
W
˚C
125
100
mΩ
mΩ
NOM.
UNIT
5
10
V
V
FUNCTIONAL BLOCK DIAGRAM
PROTECTION SUPPLY
FLAG
DRAIN
O/V
CLAMP
POWER
INPUT
MOSFET
LOGIC AND
PROTECTION
SOURCE
Fig.1. Elements of the TOPFET.
PIN CONFIGURATION
SYMBOL
DESCRIPTION
1
input
2
flag
3
(connected to mb)
4
protection supply
5
source
D
mb
TOPFET
P
F
I
P
3
1 2
S
4 5
Fig. 2.
mb
MAX.
Fig. 3.
drain
September 1996
1
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
BUK114-50L/S
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
VDSS
VIS
VFS
VPS
PARAMETER
CONDITIONS
Voltages
Continuous off-state drain source
voltage1
Continuous input voltage
Continuous flag voltage
Continuous supply voltage
MIN.
MAX.
UNIT
-
50
V
0
0
0
11
11
11
V
V
V
VIS = 0 V
-
Currents
VIS =
-
7
5
V
ID
ID
IDRM
Continuous drain current
Continuous drain current
Repetitive peak on-state drain current
Tmb ≤ 25 ˚C
Tmb ≤ 100 ˚C
Tmb ≤ 25 ˚C
-
15 13
9.5 8.5
60 54
A
A
A
Ptot
Tstg
Tj
Thermal
Total power dissipation
Storage temperature
Junction temperature2
Tmb = 25 ˚C
continuous
-55
-
40
150
150
W
˚C
˚C
Tsold
Lead temperature
during soldering
-
250
˚C
OVERLOAD PROTECTION LIMITING VALUES
With the protection supply
connected, TOPFET can protect
itself from two types of overload over temperature and short circuit
load.
SYMBOL
An n-MOS transistor turns on
between the input and source to
quickly discharge the power
MOSFET gate capacitance.
PARAMETER
For internal overload protection to
remain latched while the control
circuit is high, external series input
resistance must be provided. Refer
to INPUT CHARACTERISTICS.
CONDITIONS
MIN.
VIS =
3
UNIT
7
5
-
V
4.4
5.4
4
5
-
V
V
VPSP
Protection supply voltage
VDDP(T)
Over temperature protection
VPS = VPSN
Protected drain source supply voltage VIS = 10 V; RI ≥ 2 kΩ
VIS = 5 V; RI ≥ 1 kΩ
-
50
50
V
V
VDDP(P)
Short circuit load protection
VPS = VPSN; L ≤ 10 µH
Protected drain source supply voltage4 VIS = 10 V; RI ≥ 2 kΩ
VIS = 5 V; RI ≥ 1 kΩ
Instantaneous overload dissipation
-
25
45
0.8
V
V
kW
MIN.
MAX.
UNIT
-
2
kV
PDSM
for valid protection
BUK114-50L
BUK114-50S
MAX.
ESD LIMITING VALUE
SYMBOL
PARAMETER
CONDITIONS
VC
Electrostatic discharge capacitor
voltage
Human body model;
C = 250 pF; R = 1.5 kΩ
1 Prior to the onset of overvoltage clamping. For voltages above this value, safe operation is limited by the overvoltage clamping energy.
2 A higher Tj is allowed as an overload condition but at the threshold Tj(TO) the over temperature trip operates to protect the switch.
3 The minimum supply voltage required for correct operation of the overload protection circuits.
4 The device is able to self-protect against a short circuit load providing the drain-source supply voltage does not exceed VDDP(P) maximum.
For further information, refer to OVERLOAD PROTECTION CHARACTERISTICS.
September 1996
2
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
BUK114-50L/S
OVERVOLTAGE CLAMPING LIMITING VALUES
At a drain source voltage above 50 V the power MOSFET is actively turned on to clamp overvoltage transients.
SYMBOL
PARAMETER
IDRRM
EDSM
Repetitive peak clamping drain current RIS ≥ 100 Ω
Non-repetitive inductive turn-off
IDM = 15 A; RIS ≥ 100 Ω
energy2
Repetitive inductive turn-off energy
RIS ≥ 100 Ω; Tmb ≤ 95 ˚C;
IDM = 4 A; VDD ≤ 20 V;
f = 250 Hz
EDRM
IDIRM
CONDITIONS
MIN.
MAX.
UNIT
-
15
200
A
mJ
-
20
mJ
-
50
mA
MIN.
MAX.
UNIT
-
15
A
1
Repetitive peak drain to input current3
RIS = 0 Ω; tp ≤ 1 ms
REVERSE DIODE LIMITING VALUE
SYMBOL
PARAMETER
CONDITIONS
IS
Continuous forward current
Tmb = 25 ˚C;
VIS = VPS = VFS = 0 V
THERMAL CHARACTERISTIC
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
-
2.5
3.1
K/W
MIN.
TYP.
MAX.
UNIT
50
-
65
V
50
-
70
V
-
0.5
1
10
20
µA
µA
-
10
100
µA
-
75
95
100
125
mΩ
mΩ
Thermal resistance
Rth j-mb
Junction to mounting base
-
STATIC CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
V(CL)DSR
Drain-source clamping voltage
RIS = 100 Ω; ID = 10 mA
V(CL)DSR
Drain-source clamping voltage
IDSS
IDSR
IDSR
RDS(ON)
RIS = 100 Ω; IDM = 1 A; tp ≤ 300 µs;
δ ≤ 0.01
Zero input voltage drain current VDS = 12 V; VIS = 0 V
Drain source leakage current
VDS = 50 V; RIS = 100 Ω;
Drain source leakage current
VDS = 40 V; RIS = 100 Ω;
Tj = 125 ˚C
Drain-source on-state
resistance
IDM = 7.5 A;
tp ≤ 300 µs; δ ≤ 0.01
VIS = 7 V
VIS = 5 V
1 The input pin must be connected to the source pin by a specified external resistance to allow the power MOSFET gate source voltage to
become sufficiently positive for active clamping. Refer to INPUT CHARACTERISTICS.
2 While the protection supply voltage is connected, during overvoltage clamping it is possible that the overload protection may operate at
energies close to the limiting value. Refer to OVERLOAD PROTECTION CHARACTERISTICS.
3 Shorting the input to source with low resistance inhibits the internal overvoltage protection by preventing the power MOSFET gate source
voltage becoming positive.
September 1996
3
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
BUK114-50L/S
OVERLOAD PROTECTION CHARACTERISTICS
With adequate protection supply
voltage TOPFET detects when one
of the overload thresholds is
exceeded.
SYMBOL
Provided there is adequate input
series resistance it switches off
and remains latched off until reset
by the protection supply pin.
PARAMETER
Refer also to OVERLOAD
PROTECTION LIMITING VALUES
and INPUT CHARACTERISTICS.
CONDITIONS
1
Short circuit load protection
VPS = V
; Tmb = 25 ˚C; L ≤ 10 µH;
RI ≥ 2 kΩ
VDD = 13 V; VIS = 10 V
VDD = 13 V; VIS = 10 V
MIN.
TYP.
MAX.
UNIT
-
150
375
-
mJ
µs
150
-
-
˚C
2
PSN
EDS(TO)
td sc
Overload threshold energy
Response time
Tj(TO)
Over temperature protection VPS = VPSN; RI ≥ 2 kΩ
Threshold junction temperature from ID ≥ 0.65 A3
TRANSFER CHARACTERISTICS
Tmb = 25 ˚C
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
gfs
Forward transconductance
VDS = 10 V; IDM = 7.5 A tp ≤ 300 µs;
δ ≤ 0.01
5
9
-
S
ID
Drain current4
VDS = 13 V;
-
25
40
-
A
A
MIN.
TYP.
MAX.
UNIT
Tj = 150 ˚C
1.5
1.0
0.2
0.4
2.5
-
0.35
1.0
3.5
-
mA
mA
V
V
IP = 1.35 mA
11
13
-
V
MIN.
TYP.
MAX.
UNIT
VIS = 5 V
VIS = 10 V
PROTECTION SUPPLY CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL
IPS,
IPSL
VPSR
V(CL)PS
PARAMETER
Protection supply
Protection supply current
CONDITIONS
normal operation or
protection latched
BUK114-50L
BUK114-50S
Protection reset voltage5
Protection clamp voltage
VPS = 5 V
VPS = 10 V
REVERSE DIODE CHARACTERISTICS
Tmb = 25 ˚C
SYMBOL
PARAMETER
CONDITIONS
VSDS
Forward voltage
IS = 15 A; VIS = VPS = VFS = 0 V;
tp = 300 µs
-
1.0
1.5
V
trr
Reverse recovery time
not applicable6
-
-
-
-
1 The short circuit load protection is able to save the device providing the instantaneous on-state dissipation is less than the limiting value for
PDSM, which is always the case when VDS is less than VDSP maximum.
2 At the appropriate nominal protection supply voltage for each type. Refer to QUICK REFERENCE DATA.
3 The over temperature protection feature requires a minimum on-state drain source voltage for correct operation. The specified minimum ID
ensures this condition.
4 During overload condition. Refer also to OVERLOAD PROTECTION LIMITING VALUES and CHARACTERISTICS.
5 The supply voltage below which the overload protection circuits will be reset.
6 The reverse diode of this type is not intended for applications requiring fast reverse recovery.
September 1996
4
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
BUK114-50L/S
INPUT CHARACTERISTICS
Tmb = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1.0
0.5
11
1.5
10
13
2.0
100
-
V
V
nA
V
-
55
95
35
60
-
Ω
Ω
Ω
Ω
VDS > 30 V
100
-
-
Ω
VII = 5 V
VII = 10 V
1
2
-
-
kΩ
kΩ
Normal operation
VIS(TO)
Input threshold voltage
IIS
V(CL)IS
Input current
Input clamp voltage
VDS = 5 V; ID = 1 mA
Tmb = 150 ˚C
VIS = 10 V
II = 1 mA
Overload protection latched
RISL
Input resistance1
VPS = 5 V
II = 5 mA;
Tmb = 150 ˚C
II = 5 mA;
Tmb = 150 ˚C
VPS = 10 V
RIS
RI
Application information
External input resistances for
internal overvoltage clamping2
3
internal overload protection
(see figure 29)
RI = ∞ Ω;
RIS = ∞ Ω;
SWITCHING CHARACTERISTICS
Tmb = 25 ˚C; RI = 50 Ω; RIS = 50 Ω (see figure 29); resistive load RL = 10 Ω. For waveforms see figure 28.
SYMBOL
PARAMETER
CONDITIONS
td on
Turn-on delay time
VDD = 15 V; VIS: 0 V ⇒ 10 V
tr
Rise time
td off
Turn-off delay time
tf
Fall time
VDD = 15 V; VIS: 10 V ⇒ 0 V
MIN.
TYP.
MAX.
UNIT
-
8
-
ns
-
13
-
ns
-
100
-
ns
-
45
-
ns
MIN.
TYP.
MAX.
UNIT
CAPACITANCES
Tmb = 25 ˚C; f = 1 MHz
SYMBOL
PARAMETER
CONDITIONS
Ciss
Input capacitance
VDS = 25 V; VIS = 0 V
-
415
600
pF
Coss
Output capacitance
VDS = 25 V; VIS = 0 V
-
275
400
pF
Crss
Reverse transfer capacitance
VDS = 25 V; VIS = 0 V
-
55
80
pF
Cpso
Protection supply pin
capacitance
VPS = 10 V
-
30
-
pF
Cfso
Flag pin capacitance
VFS = 10 V; VPS = 0 V
-
20
-
pF
1 The resistance of the internal transistor which discharges the power MOSFET gate capacitance when overload protection operates.
The external drive circuit should be such that the input voltage does not exceed VIS(TO) minimum when the overload protection has
operated. Refer also to figure for latched input characteristics.
2 Applications using a lower value for RIS would require external overvoltage protection.
3 For applications requiring a lower value for RI, an external overload protection strategy is possible using the flag pin to ‘tell’ the control circuit to
switch off the input.
September 1996
5
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
FLAG DESCRIPTION
The flag pin provides a means to
detect the presence of the
protection supply and indicate the
state of the overload detectors.
The flag is the open drain of an
n-MOS transistor and requires an
external pull-up resistor1. It is
suitable for both 5 V and 10 V logic.
Flag may be used to implement an
external protection strategy2 for
applications which require low input
drive impedance.
BUK114-50L/S
TRUTH TABLE
CONDITION
DESCRIPTION
FLAG
NORMAL
Normal operation and adequate
protection supply voltage
LOGIC LOW
OVER TEMP.
Over temperature detected
LOGIC HIGH
SHORT CIRCUIT
Overload condition detected
LOGIC HIGH
SUPPLY FAULT
Inadequate protection supply
voltage
LOGIC HIGH
FLAG CHARACTERISTICS
Tmb = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VFS
IFSS
Flag ‘low’
Flag voltage
Flag saturation current
normal operation
IF = 1.6 mA
VFS = 10 V
-
0.15
15
0.4
-
V
mA
IFS
VPSF
Flag ‘high’
Flag leakage current
Protection supply threshold
voltage
overload or fault
VFS = 10 V
VFF = 5 V; RF = 3 kΩ;
-
-
10
µA
2.5
3.3
3.3
4.2
4
5
V
V
V(CL)FS
Flag clamping voltage
IF = 1 mA; VPS = 0 V
11
13
-
V
VFF =5 V
VFF =10 V
1
2
10
20
50
100
kΩ
kΩ
BUK114-50L
BUK114-50S
Application information
RF
Suitable external pull-up
resistance
1 Even if the flag pin is not used, it is recommended that it is connected to the protection supply via a pull-up resistor. It should not be left
floating.
2 Low pass filtering of the flag signal may be advisable to prevent false tripping.
September 1996
6
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
120
BUK114-50L/S
Normalised Power Derating
PD%
BUK114-50L/S
Zth / (K/W)
10
110
100
90
D=
0.5
80
1
70
0.2
60
50
0.05
0.1
40
0.1
0.02
PD
30
20
10
D=
tp
T
0
0
0
20
40
60
80
100
Tmb / C
120
1E-05
1E-03
t/s
1E-01
1E+01
Fig.7. Transient thermal impedance.
Zth j-mb = f(t); parameter D = tp/T
Normalised Current Derating
ID%
t
T
0.01
1E-07
140
Fig.4. Normalised limiting power dissipation.
PD% = 100⋅PD/PD(25 ˚C) = f(Tmb)
120
tp
50
ID / A
BUK114-50L/S
110
VIS / V =
100
90
10
40
9
80
70
30
60
50
20
8
7
6
5
40
30
3
2
0
0
20
40
60
80
Tmb / C
100
120
0
140
0
Fig.5. Normalised continuous drain current.
ID% = 100⋅ID/ID(25 ˚C) = f(Tmb); conditions: VIS = 5 V
100
4
10
20
10
D
S/I
=V
20
12
16
VDS / V
VIS / V =
10 us
O
S(
20
ID / A
tp =
D
N)
8
24
28
32
Fig.8. Typical output characteristics, Tj = 25 ˚C.
ID = f(VDS); parameter VIS; tp = 250 µs & tp < td sc
BUK114-50L/S
ID & IDM / A
4
10
BUK114-50L/S
7
6
5
RD
15
10
100 us
4
1 ms
DC
10
10 ms
1
100 ms
5
3
Overload protection characteristics not shown
0.1
0
1
10
100
0
VDS / V
Fig.6. Safe operating area. Tmb = 25 ˚C
ID & IDM = f(VDS); IDM single pulse; parameter tp
September 1996
1
VDS / V
2
Fig.9. Typical on-state characteristics, Tj = 25 ˚C.
ID = f(VDS); parameter VIS; tp = 250 µs
7
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
RDS(ON) / mOhm
150
BUK114-50L/S
a
BUK114-50L/S
VIS / V =
Normalised RDS(ON) = f(Tj)
4
1.5
5
6
100
7
1.0
10
50
0.5
0
0
0
2
4
6
8
10
ID / A
12
14
16
18
20
BUK114-50L/S
ID / A
0
20
40 60
Tj / C
80
100 120 140
Fig.13. Normalised drain-source on-state resistance.
a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 7.5 A; VIS ≥ 5 V
Fig.10. Typical on-state resistance, Tj = 25 ˚C.
RDS(ON) = f(ID); parameter VIS; tp = 250 µs
50
-60 -40 -20
230
Tj(TO) / C
BUK114-50L/S
220
40
210
200
30
190
20
BUK114-50S
180
170
10
BUK114-50L
160
0
150
0
2
4
6
VIS / V
8
10
0
12
Fig.11. Typical transfer characteristics, Tj = 25 ˚C.
ID = f(VIS) ; conditions: VDS = 10 V; tp = 250 µs
10
gfs / S
2
4
6
VPS / V
8
10
Fig.14. Typical over temperature protection threshold
Tj(TO) = f(VPS); conditions: VDS > 0.1 V
PDSM%
BUK114-50L/S
120
9
8
100
7
80
6
5
60
4
40
3
2
20
1
0
0
0
10
20
30
40
-60
50
ID / A
Fig.12. Typical transconductance, Tj = 25 ˚C.
gfs = f(ID); conditions: VDS = 10 V; tp = 250 µs
September 1996
-40
-20
0
20
40
60
Tmb / C
80
100
120
140
Fig.15. Normalised limiting overload dissipation.
PDSM% =100⋅PDSM/PDSM(25 ˚C) = f(Tmb)
8
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
50
VDDP(P) / V
BUK114-50L/S
BUK114-50L/S
0.5
40
Energy & Time
BUK114-50L/S
0.4
max
30
0.3
20
0.2
10
0.1
0
0
Time / ms
Energy / J
Tj(TO)
0
2
4
6
VIS / V
8
-60
10
20
60
100
Tmb / C
140
180
220
Fig.19. Typical overload protection characteristics.
Conditions: VDD = 13 V; VPS = VPSN, VIS = 7 V; SC load
Fig.16. Maximum drain source supply voltage for
SC load protection. VDDP(P) = f(VIS); Tmb ≤ 150 ˚C
VPSP / V
-20
BUK114-50L/S
0.4
ESC(TO) / J
BUK114-50L/S
10
0.3
8
BUK114-50L
VIS / V = 5
min
BUK114-50S
6
10
0.2
5
4
10
BUK114-50L
0.1
2
BUK114-50S
0
0
0
2
4
6
VIS / V
8
0
10
TIME / ms
4
6
VPS / V
8
10
Fig.20. Typical overload protection energy, Tj = 25 ˚C
ESC(TO) = f(VPS); conditions: VDS = 13 V, parameter VIS
Fig.17. Minimum protection supply voltage
for SC load protection. VPSP = f(VIS); Tmb ≥ 25 ˚C
10
2
BUK114-50L/S
20
ID / A
BUK114-50L/S
15
typ.
10
1
PDSM
5
0.1
0
0.1
1
POWER / kW
50
10
Fig.18. Typical overload protection characteristics.
td sc = f(PDS); conditions: VPS ≥ VPSP; VIS ≥ 5 V
September 1996
60
VDS / V
70
Fig.21. Typical clamping characteristics, 25 ˚C.
ID = f(VDS); conditions: RIS = 100 Ω; tp ≤ 50 µs
9
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
BUK114-50L/S
VIS(TO) / V
IS / A
20
BUK114-50L/S
max.
2
15
typ.
10
min.
1
5
0
0
-60
-40
-20
0
20
40
60
Tj / C
80
100
0
120 140
1.5
VSD / V
Fig.25. Typical reverse diode current, Tj = 25 ˚C.
IS = f(VSDS); conditions: VIS = 0 V; tp = 250 µs
Fig.22. Input threshold voltage.
VIS(TO) = f(Tj); conditions: ID = 1 mA; VDS = 5 V
IPS / mA
1.0
1
0.5
BUK114-50L/S
EDSM%
120
110
100
90
80
70
0.5
60
50
40
30
20
10
0
0
2
4
6
8
10
12
0
14
0
20
40
60
VPS / V
Fig.23. Typical DC protection supply characteristics.
IPS = f(VPS); normal or overload operation; Tj = 25 ˚C
IISL / mA
BUK114-50L/S
140
V(CL)DSR
VDD
+
0
9
7
0
6
VIS
VDS
+ VPS
-
D
RF
TOPFET
5
0
4
VDD
L
ID
8
50
120
VDS
10
100
100
Fig.26. Normalised limiting clamping energy.
EDSM% = f(Tmb); conditions: ID = 15 A
150
VPS / V = 11
80
Tmb / C
RI = RIS
P
F
I
-ID/100
D.U.T.
P
S
R 01
shunt
0
0
2
4
6
VIS / V
8
10
Fig.27. Clamping energy test circuit, RIS = 100 Ω.
EDSM = 0.5 ⋅ LID2 ⋅ V(CL)DSR /(V(CL)DSR − VDD )
Fig.24. Typical latched input characteristics, 25 ˚C.
IISL = f(VIS); after overload protection latched
September 1996
10
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
VIS / V & VDS / V
BUK114-50L/S
BUK114-50L/S
1 mA
Idsr
15
VDS
100 uA
VIS
10
10 uA
typ.
5
1 uA
0
100 nA
0
0.5
time / us
0
1
20
40
60
80
Tj / C
100
120
140
Fig.31. Typical off-state leakage current.
IDSR = f(Tj); Conditions: VDS = 40 V; RIS = 100 Ω.
Fig.28. Typical resistive load switching waveforms
RI = RIS = 50 Ω; RL = 10 Ω; VDD = 15 V; Tj = 25 ˚C
Ips normalised to 25 C
VII
1.5
D
RI
TOPFET
P
F
I
VIS
P
1
S
RIS
0.5
-60
Fig.29. External input resistances RI and RIS,
generator voltage VII and input voltage VIS.
10000
Capacitance / pF
-20
20
60
Tj / C
100
140
180
Fig.32. Normalised protection supply current.
IPS/IPS25 ˚C = f(Tj); VPS = VPSN
BUK114-50L/S
1000
Ciss
Coss
100
Crss
10
0
10
20
30
40
50
VDS / V
Fig.30. Typical capacitances, Ciss, Coss, Crss.
C = f(VDS); conditions: VIS = 0 V; f = 1 MHz
September 1996
11
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
BUK114-50L/S
MECHANICAL DATA
Dimensions in mm
10.3 MAX
4.5 MAX
1.4 MAX
2.5
15.4
11 MAX
Net Mass: 1.5 g
0.85 MAX
(x4)
3.4
1.7
1.7
3.4
0.5
Fig.33. SOT426
mounting base connected to centre pin (cropped short)
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5
3.4
1.7
1.7
3.8
1.3 (x4)
Fig.34. SOT426
soldering pattern for surface mounting.
September 1996
12
Rev 1.000
Philips Semiconductors
Product specification
Logic level TOPFET
SMD version of BUK104-50L/S
BUK114-50L/S
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1996
13
Rev 1.000
Similar pages