LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-110G/Y-CT DATA SHEET DOC. NO : QW0905-LG-110G/Y-CT REV. : A DATE : 19 - Jul. - 2011 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/12 PART NO. LG-110G/Y-CT Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process. Descriptions: 1. The LG-110G/Y SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO LG-110G/Y-CT MATERIAL COLOR Emitted GaP Green GaAsP/GaP Yellow Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/12 PART NO. LG-110G/Y-CT Package Dimensions 1.5 Cathode Mark 1.0 0.5 1 2 Resin 2 1 0.6 0.8 0.6 4 3.2 DIE2 DIE1 0.6 0.6 3 Soldering Terminal 4 0.4 0.4 PCB 1,2 Y G 4 3 Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 1.0 0.9 Cathode 1,2 5.0 1.5 4 1.0 1.5 3 1.0 Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm. 4 3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/12 PART NO. LG-110G/Y-CT Absolute Maximum Ratings at Ta=25 ℃ Parameter Ratings Symbol G Y UNIT Power Dissipation PD 65 65 mW Peak Forward Current Duty 1/10@10KHz IFP 120 80 mA Forward Current IF 25 25 mA Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Iv Peak Wavelength λP Dominant Wavelength λD Spectral Line Half-Width Forward Voltage Viewing Angle Min. Typ. Symbol △λ VF 2θ 1/2 Max. UNIT G 3.2 8.0 ---- Y 3.2 8.0 ---- G ---- 565 ---- Y ---- 585 ---- G ---- 573 ---- Y ---- 588 ---- G ---- 30 ---- Y ---- 35 ---- G 1.7 ---- 2.6 Y 1.7 ---- 2.6 G ---- 120 ---- Y ---- 120 ---- Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. CONDITION mcd IF=20mA nm IF=20mA nm IF=20mA nm IF=20mA V IF=20mA deg IF=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/12 PART NO. LG-110G/Y-CT Luminous Intensity Classification BIN CODE G H J K L BIN CODE Y H J K L Iv(mcd) at 20mA Min. Max. 3.2 5 8 12.5 5 8 12.5 20 Iv(mcd) at 20mA Min. Max. 3.2 5 8 12.5 5 8 12.5 20 Dominant Wavelength Classification BIN CODE G 7 8 9 10 11 BIN CODE Y 14 15 16 17 18 λD(nm) at 20mA Min. Max. 568 570 572 574 576 570 572 574 576 578 λD(nm) at 20mA Min. Max. 583 585 587 587 592 585 587 587 592 595 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/12 PART NO. LG-110G/Y-CT Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 1.5 2.0 2.5 1.0 3.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 650 Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/12 PART NO. LG-110G/Y-CT Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 1.5 2.0 2.5 3.0 1.0 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) 1.0 0.5 0 100 10 550 600 650 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/12 PART NO. LG-110G/Y-CT Carrier Type Dimensions 4.0±0.2 0.25 2.0 1.5 1.75 3.5±0.2 8.0±0.3 5.3 3.4 Polarity 1.25 4.0±0.2 1.87 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. ‧ Packing Specifications Label Aluminum Moist-Proof bag Label Part No. Description Quantity/Reel LG-110G/Y-CT 8.0mm tape,7"reel 3000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/12 PART NO. LG-110G/Y-CT Label Explanation BIN K : Green Chip Luminous Intensity LIGITEK ELECTRONICS CO., LTD. Pb BIN J : Yellow Chip Luminous Intensity PART : LG-110G/Y-CT LOT : GS1-080168 QTY(PCS): 3000PCS VF:1.7-2.6 BIN/HUE : K/9 - J/15 VF:1.7-2.6 HUE 9 : Green Chip Dominant Wavelength HUE 15 : Yellow Chip Dominant Wavelength VF : Forward Voltage Reel Dimensions 0.2 0.4 0.8 0.8 0.6 0.2 0.4 0.6 2.0±0.5 178±1.5 6.0±1.0 9.0±1.0 ψ13.5±1.0 12.0±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/12 PART NO. LG-110G/Y-CT Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/12 PART NO. LG-110G/Y-CT Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245±5℃ within 5 sec 120 ~ 150℃ Preheat 120 ~ 180 sec 3 PB-Free Reflow Solder 1~5°C/sec 1~5°C/sec Preheat 180~200°C 260°C MaX. 10sec.Max 6°C/sec Above 220°C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/12 PART NO. LG-110G/Y-CT Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 12/12 PART NO. LG-110G/Y-CT Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=1000hrs¡Ó2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105 ℃ ~ 25℃ ~ -55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260°C Max. 10sec.Max. 2. 6 Min MIL-STD-202F:103B JIS C 7021: B-11 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020