LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-110G/Y-D-CT/T DATA SHEET DOC. NO : QW0905-LG-110G/Y-D-CT/T REV. : A DATE : 05 - Dec. - 2014 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/12 PART NO. LG-110G/Y-D-CT/T Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process. Descriptions: 1. The LG-110G/Y SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO LG-110G/Y-D-CT/T MATERIAL COLOR Emitted GaP Green GaAsP/GaP Yellow Lens Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/12 PART NO. LG-110G/Y-D-CT/T Package Dimensions 1.5 1.0 Mark 0.5 0.65 Resin 3.2 DIE2 Soldering Terminal 0.8 DIE1 R1.0 0.65 PCB G Y Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 5.0 1.0 0.9 1.0 1.5 1.5 Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm. 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/12 PART NO. LG-110G/Y-D-CT/T Absolute Maximum Ratings at Ta=25 ℃ Parameter Ratings Symbol G Y UNIT Power Dissipation PD 65 52 mW Peak Forward Current Duty 1/10@10KHz IFP 120 80 mA Forward Current IF 25 20 mA Reverse Current @5V Ir 10 μA Electrostatic Discharge ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Dominant Wavelength Spectral Line Half-Width Forward Voltage Viewing Angle Min. Typ. Symbol Iv λD △λ VF 2θ 1/2 Max. UNIT G 2 3.2 ---- Y 0.8 1.25 ---- G ---- 573 ---- Y ---- 588 ---- G ---- 30 ---- Y ---- 35 ---- G 1.7 ---- 2.6 Y 1.7 ---- 2.6 G ---- 120 ---- Y ---- 120 ---- CONDITION mcd IF=5mA nm IF=5mA nm IF=5mA V IF=5mA deg IF=5mA Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 3.The dominant wavelength data did not including ±1nm testing tolerance LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/12 PART NO. LG-110G/Y-D-CT/T Luminous Intensity Classification BIN CODE G Min. Max. G 2 3.2 H 3.2 5 J 5 8 K 8 12.5 BIN CODE Y Iv(mcd) at 5mA Iv(mcd) at 5mA Min. Max. E 0.8 1.25 F 1.25 2 G 2 3.2 H 3.2 5 Dominant Wavelength Classification BIN CODE G 7 8 9 10 11 BIN CODE Y 14 15 16 17 18 λD(nm) at 5mA Min. Max. 568 570 572 574 576 570 572 574 576 578 λD(nm) at 5mA Min. Max. 583 585 587 587 592 585 587 587 592 595 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/12 PART NO. LG-110G/Y-D-CT/T Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 2.5 Relative Intensity Normalize @5mA Forward Current(mA) 1000 100 10 1.0 2.0 1.5 1.0 0.5 0.0 0.1 1.0 1.5 2.0 2.5 1.0 3.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@5mA Normalize @25℃ Forward Voltage@5mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@5mA 100 650 Fig.6 Directive Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/12 PART NO. LG-110G/Y-D-CT/T Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @5mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Relative Intensity@5mA Normalize @25℃ Forward Voltage@5mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity@5mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 650 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 500 1000 Forward Current(mA) Forward Voltage(V) -40 100 700 Fig.6 Directive Radiation 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/12 PART NO. LG-110G/Y-D-CT/T Carrier Type Dimensions 0.25 4.0±0.2 2.0 1.5 1.75 3.5±0.2 8.0±0.3 5.3 3.4 Polarity 1.25 4.0±0.2 1.87 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. ‧ Packing Specifications Label Aluminum Moist-Proof bag Label Part No. Description Quantity/Reel LG-110G/Y-D-CT/T 8.0mm tape,7"reel 3000 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/12 PART NO. LG-110G/Y-D-CT/T Label Explanation LIGITEK ELECTRONICS CO., LTD. Pb PART : LG-110G/Y-D-CT/T BIN : Luminous Intensity LOT : GS114C0168 HUE : Dominant Wavelength QTY(PCS): 3000 BIN/HUE : G/8-F/15 VF:1.7-2.6 VF:1.7-2.6 VF : Forward Voltage Reel Dimensions 0.2 0.4 0.8 0.8 0.6 0.2 0.4 0.6 2.0±0.5 178±1.5 6.0±1.0 9.0±1.0 ψ13.5±1.0 12.0±1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/12 PART NO. LG-110G/Y-D-CT/T Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/12 PART NO. LG-110G/Y-D-CT/T Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 280°C 3 sec one time only. 2 PB-Free Reflow Solder 1~5°C/sec 1~5°C/sec Preheat 180~200°C 260°C MaX. 10sec.Max 6°C/sec Above 220°C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/12 PART NO. LG-110G/Y-D-CT/T Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 12/12 PART NO. LG-110G/Y-D-CT/T Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=5mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=1000hrs¡Ó2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105 ℃ ~ 25℃ ~ -55℃ ~ 25℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260°C Max. 10sec.Max. 2. 6 Min MIL-STD-202F:103B JIS C 7021: B-11 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020