lhir9553.pdf

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
LHIR9553
DATA SHEET
DOC. NO : QW0905-LHIR9553A
REV.
: A
DATE
: 08 - May. - 2013
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
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Page 1/11
PART NO. LHIR9553
Features:
1. Top view LED.
2. white SMT package.
3. Leadframe package with individual 2 pin.
4.Wide viewing angle.
5.Soldering methods:IR reflow soldering.
6.Feature of the device:more light due to higher optical efficiency;extremely
wide viewing angle;ideal for backlighting and coupling in light guide.
Descriptions:
The LHIR9553 SMD has wide viewing angle and optimized light coupling by
inter reflector,The low current requirement makes this device ideal for portable
equipment or any other application where power is at a premium.
Applications:
1. Smoke detector.
2. VCR.
3. Optoelectronic Switch.
4. Sensor.
Device Selection Guide:
PART NO
MATERIAL
LENS COLOR
LHIR9553
GaAIAs
Water Clear
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PART NO. LHIR9553
Package Dimensions
3.5
1.85
0.9
0.9
2.8
2.2
Cathode Mark
Soldering Terminal
3.2
Anode
0.9
Cathode
Polarity
0.9
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
4.5
1.5
1.5
2.6
Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD.
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Page 3/11
PART NO. LHIR9553
Absolute Maximum Ratings at Ta=25℃
Ratings
Parameter
Symbol
UNIT
HIR
Power Dissipation
PD
100
mW
Peak Forward Current
(300pps,10μs Pulse)
IFP
1
A
Forward Current
IF
50
mA
Operating Temperature
Topr
- 40 ~ + 85
℃
Storage Temperature
Tstg
- 40 ~ + 85
℃
Typical Electrical & Optical Characteristics (Ta=25℃)
SYMBOL
Min.
Typ.
Max.
UNIT
CONDITION
Radiant Intensity
Le
1.8
3.1
----
mW/sr
IF=20mA
Peak Emission Wavelength
λP
----
850
----
nm
IF=20mA
△λ
----
50
----
nm
IF=20mA
Forward Voltage
VF
1.2
----
1.6
V
IF=20mA
Reverse Current
IR
----
----
100
μA
VR=5V
2θ 1/2
----
120
----
deg
PARAMETER
Spectral Line Half Width
Viewing Angle
Note : 1.The Radiant intensity data did not including ±15% testing tolerance.
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Page 4/11
PART NO. LHIR9553
Radiant Intensity
BIN CODE
M
N
P
Po(mw/sr) at 20mA
Min.
Max.
1.8
2.4
3.2
2.4
3.2
4.2
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PART NO. LHIR9553
Page 5/11
Typical Electro-Optical Characteristics Curve
HIR CHIP
Fig.2 Relative Radiant Power vs. Wavelength
Fig.1 Forward Current vs. Rorward Voltage
Relative Radiant Power
Normalize @20mA
Forward Current[mA]
1000
100
10
1
0.1
0.0
1.0
2.0
3.0
4.0
1.0
0.5
0.0
800
850
Wavelength[nm]
Forward Voltage[V]
Fig.4 Relative Radiant Power
vs. Forward Peak Current
Fig.3 Relative Radiant Power
vs. Forward DC Current
10.0
Relative Radiant Power
Normalize @100 mA
Relative Radiant Power
Normalize @20mA
10.0
1.0
0.1
10
1
0.9
0.8
-40
-20
0
20
40
60
Ambient Temperature [℃]
80
100
Relative Radiant Power
Normalize @ 20mA, 25 ℃
1.2
1.0
100
1000
IFPK[mA]
Fig.6 Relative Radiant Power vs. Temperature
Fig.5 Forward DC Voltage vs. Temperature
1.1
1.0
0.1
10
100
IFDC[mA]
Forward DC Voltage
Normalize @20mA, 25 ℃
950
900
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature[ ℃]
80
100
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PART NO. LHIR9553
Carrier Type Dimensions
4.0
2.0
4.0
2.24
ψ1.55
1.75
5.5
12.0±0.3
9.3
4.06
Polarity
3.12
Note : The tolerances unless mentioned is ±0.1mm,Unit=mm.
‧ Packing Specifications
0.2
0.8
0.6
Aluminum Moist-Proof bag
Label
0.8
0.6
0.2
0.4
0.4
Label
Part No.
Description
Quantity/Reel
LHIR9553
12.0mm tape,7"reel
1500 PCS
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Page 7/11
PART NO. LHIR9553
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
PART :
LHIR9553
LOT :
GS1-0C0288
QTY(PCS):
1500
BIN/HUE :
M
BIN : Radiant Intensity
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
ψ13.5±1.0
178±1.5
60.0±1.0
13.0±1.0
16.0±1.0
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Page 8/11
PART NO. LHIR9553
Box Explanation
1. 4 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
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Page 9/11
PART NO. LHIR9553
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 320℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
120 ~ 150℃
Preheat
120 ~ 180 sec
3 PB-Free Reflow Solder
1~5°C/sec
1~5°C/sec
Preheat
180~200°C
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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Page 10/11
PART NO. LHIR9553
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 11/11
PART NO. LHIR9553
Reliability Test:
(1)Test items and results
Classification
Test Item
Test Condition
Sample
Size
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs
22
High Temperature
Storage Test
1.Ta=105 ℃± 5℃
2.t=500 hrs
22
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs
22
High Temperature
High Humidity
Storage Test
1.IR-Reflow In-Board, 2 Times
2.Ta=85℃± 5℃
3.RH=90 %~95%
4.t=500hrs±2hrs
22
Thermal Shock Test
1.IR-Reflow In-Board,2 times
2.Ta=105 ℃ ±5℃ &
-40℃± 5℃
(30min) (30min)
3.total 100 cycles
22
1.T.Sol=260 ℃±5℃
2.Dwell Time= 10Max.
22
1.105℃ ~ 25℃ ~ - 40℃
30mins 15mins 30mins
2.100 Cyeles
22
Endurance
Test
Environmental
Test
Reflow Soldering Test
Temperature
Cycling
(2)Criteria for judging the damage
Item
Symbol Test Conditions
Criteria for Judgement
Min.
Max.
Forward Voltage
Vf
If=20mA
-
U.S.L x1.2
Reverse Current
Ir
Vr=5V
-
U.S.L x2.0
Radiant Intensity
Iv
If=20mA
L.S.L x 0.5
-
Note:
1.U.S.L.:Upper Standard Level.
2.L.S.L.:Lower Standard Level.