Product Brief 650 V CoolMOS™ C7 Gold in TOLL package A new SMD package using Kelvin source concept Infineon Technologies introduces the new 650 V CoolMOS™ C7 Gold technology in latest surface mount device (SMD) TO-Leadless (TOLL) package. The CoolMOS™ C7 Gold series (G7) for the first time brings together the benefits of the improved 650 V CoolMOS™ C7 Gold technology, 4pin Kelvin source capability and the improved thermal properties of the TOLL package to enable an SMD solution for high current hard switching topologies such as power factor correction (PFC) up to 3 kW. Benefits to the customer: ››Higher efficiency due to the improved CoolMOS™ C7 Gold technology, and faster switching due to the package low parasitic source inductance and the 4pin Kelvin source concept ››Improved power density due to low RDS(on) in small footprint by either replacing TO packages (height restrictions) or paralleling SMD packages due to thermal or RDS(on) requirements Production cost reduction by moving to SMD through quicker assembly times ›› Key features ››CoolMOS™ C7 Gold ––Gives best-in-class FOM RDS(on) x Eoss and RDS(on) x QG ––Enables best-in-class RDS(on) in smallest footprint TOLL package ›› ––Inbuilt 4th pin Kelvin source configuration and low parasitic source inductance (~1 nH) –– Is MSL1 compliant, total Pb-free, has easy visual inspection grooved leads ––Enables improved thermal performance Rth Key benefits ››FOM R Improved CoolMOS™ C7 Gold technology Parameter Package RDS(on) (max) [mΩ] QG (typ) [nC] Coss (typ) [pF] Competitor A 650 V D²PAK 95 71 74 650 V CoolMOS™ C7 Gold (G7) TOLL 105 35 26 Comparison 30% footprint reduction Similar RDS(on) for comparison 51% lower than competitor 65% lower than competitor TOLL package versus D²PAK Parameter Footprint [mm²] RDS(on) (max) [mΩ] Source inductance [nH] Kelvin source feature D²PAK 150 63* 5 No TOLL 115 33 1 Yes Comparison 30% footprint reduction 48% lower RDS(on) 80% lower inductance Benefits in Kelvin source for efficiency and ease-of-use * Best competitor www.infineon.com/c7-gold-toll x QG is 14% better than previous 650 V CoolMOS™ C7 enabling faster switching leading to higher efficiency DS(on) ››Power density through BIC 33 mΩ in 115 mm² TOLL footprint ››Reducing parasitic source inductance by Kelvin source improves efficiency switching and ease-of-use ››TOLL package is easy to use and has the highest quality standards ››Improved thermals enable SMD TOLL package to be used in higher current designs than has been previously possible Product Brief Benefits in efficiency TOLL versus TO-247 CoolMOS™ C7 Gold close to GaN performance in hard switching topologies Efficiency difference low line IPT65R033G7 IPW65R045C7 0.6 6 0.5 5 0.4 0.3 0.6% 0.2 0.1 0 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 Stored energy Eoss [µJ] Difference [%] 0.7 IPP60R199CP IPT65R195G7 IPP65R190C7 GaN HEMT C7 Gold further reduction 50% reduction CP > C7 4 3 2 1 0 0 100 200 300 400 Drain-source voltage VDS [V] Pout [W] Performance gain of 0.6 percent full load efficiency gain TOLL versus TO-247 due to lower RDS(on) from TOLL and 4pin Kelvin source capability. CoolMOS™ C7 Gold technology improves again over previous best 650 V CoolMOS™ C7 to get even closer in performance in Eoss, a key value in hard switching topologies such as PFC. Benefits in temperature due to higher efficiency TOLL versus TO-247 Four in Kelvin source capability MOS temperature curve low line VDRV 85 IPT65R033G7 Drain IPW65R045C7 80 PWMin 5°C Temperature [°C] Gate VDRV 75 70 VLS 65 Source LSource SGND 60 55 VGS 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 ››Separate pin “source-sense” delivers undisturbed signal to driver ››Higher efficiency at full load Pout [W] 5°C lower temperature seen for TOLL as higher efficiency means less thermal losses produced. TO-Leadless package versus D²PAK 2.3 mm 4.4 mm Product portfolio RDS(on) (max) [mΩ] TO-Leadless (TOLL) 195 IPT65R195G7 105 IPT65R105G7 33 IPT65R033G7 Published by Infineon Technologies Austria AG 9500 Villach, Austria © 2016 Infineon Technologies AG. All Rights Reserved. 9.9 mm 10.0 mm ››30 percent footprint reduction ››50 percent height reduction ››60 percent space reduction Please note! THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND ANY INFORMATION GIVEN HEREIN SHALL IN NO EVENT BE REGARDED AS A WARRANTY, GUARANTEE OR DESCRIPTION OF ANY FUNCTIONALITY, CONDITIONS AND/OR QUALITY OF OUR PRODUCTS OR ANY SUITABILITY FOR A PARTICULAR PURPOSE. WITH REGARD TO THE TECHNICAL SPECIFICATIONS OF OUR PRODUCTS, WE KINDLY ASK YOU TO REFER TO THE RELEVANT PRODUCT DATA SHEETS PROVIDED BY US. OUR CUSTOMERS AND THEIR TECHNICAL DEPARTMENTS ARE REQUIRED TO EVALUATE THE SUITABILITY OF OUR PRODUCTS FOR THE INTENDED APPLICATION. WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT AND/OR THE INFORMATION GIVEN HEREIN AT ANY TIME. Order Number: B152-I0276-V1-7600-EU-EC-P Date: 05 / 2016 11.7 mm 15.0 mm Additional information For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices, please contact your nearest Infineon Technologies office (www.infineon.com). Warnings Due to technical requirements, our products may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by us in a written document signed by authorized representatives of Infineon Technologies, our products may not be used in any life-endangering applications, including but not limited to medical, nuclear, military, life-critical or any other applications where a failure of the product or any consequences of the use thereof can result in personal injury.