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UG_201512_PL30_005
XMC1400 Boot Kit
For XMC1000 Family
About this document
Scope and purpose
This document provides the schematic and hardware description of XMC1400 Boot Kit, so that user is able to
make use of this board for their application code development on XMC1404-Q064X0200 device.
Intended audience
For people who are interested to explore the functionality of XMC1404 device.
Table of Contents
About this document....................................................................................................................... 1
Table of Contents ........................................................................................................................... 1
1
1.1
1.2
Overview ...................................................................................................................... 2
Key Features ............................................................................................................................................2
Block Diagram .........................................................................................................................................2
2
2.1
2.2
2.3
2.3.1
2.4
2.5
2.6
2.7
2.8
2.9
Hardware Description .................................................................................................... 3
Power Supply...........................................................................................................................................4
Reset ........................................................................................................................................................5
Clock Generation.....................................................................................................................................5
External Crystal and external Real time Clock crystal ......................................................................5
Boot Option .............................................................................................................................................7
CAN bus connector..................................................................................................................................7
Debug Interface and virtual com port ....................................................................................................8
LED ...........................................................................................................................................................9
Potentiometer .........................................................................................................................................9
Application Card connector .................................................................................................................. 10
3
3.1
3.2
3.3
3.4
Production Data ...........................................................................................................11
Schematics ............................................................................................................................................ 11
Layout and Geometry............................................................................................................................ 14
CR number of XMC1400 Boot Kit........................................................................................................... 15
Bill of Material........................................................................................................................................ 16
Revision History ............................................................................................................................18
User Manual
www.infineon.com
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Overview
1
Overview
This document describes the features and hardware details of the XMC1400 Boot Kit. This board is mounted
with ARM® Cortex®-M0 based XMC1400 Microcontroller from Infineon Technologies AG. This board is part of
Infineon’s XMC1000 Application Kits.
The XMC1400 Boot Kit (CPU-14A-V1) houses the XMC1400 Microcontroller and a 2x30 pin edge for application
expansion. The board along with application cards (e.g. Colour LED Card, White LED Card) demonstrates the
capabilities of XMC1400. The main use case for this board is to demonstrate the generic features of XMC1400
device, including tool chain. The focus is safe operation under evaluation conditions. The board is neither cost
nor size optimized and does not serve as a reference design.
1.1
Key Features
The XMC1400 Boot Kit is equipped with the following features
•
•
•
•
•
•
•
•
XMC1400 (ARM®Cortex®-M0 based) Microcontroller, VQFN64
Connection to application cards via card edge connector
Detachable J-Link debugger and UART virtual COM port, with micro USB connector
Four user LEDs
Potentiometer, connected to analog input P2.5
Power supply via Micro-USB connector
Usage of 20MHz external crystal for CAN communication
Usage of 32.768 kHz external crystal as standby clock
1.2
Block Diagram
Figure 1 shows the functional block diagram of the XMC1400 Boot Kit.
Features include:
• On board Debugger for downloading and debugging of application code
• Virtual COM port for UART communication with terminal program e.g. Hyperterminal
• 2x30 card edge connector for extension to application card e.g. Colour LED Card and White LED Card
• 4 User LEDs connected to GPIO P4.0, P4.1, P4.2, P4.3
• Variable resistor R110 connected to analog input P2.5
• All the pins of XMC1400 are accessible via the connector JP101, JP103, JP104 and JP105
• CAN interface with CAN transceiver mounted
• External crystal 20 MHz and 32.768 kHz mounted
User Manual
2
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Hardware Description
Figure 1
2
Block Diagram of XMC1400 Boot Kit
Hardware Description
The following sections give a detailed description of the hardware and how it can be used.
User Manual
3
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Hardware Description
Figure 2
2.1
XMC1400 Boot Kit
Power Supply
XMC1400 Boot Kit is powered from the micro USB connector (+5V); however, there is a current limit that can be
drawn from the host PC through USB. If the CPU-14A-V1 board is used to drive other application board (e.g.
Colour LED Card, White LED Card) and the total current required exceeds 500mA, then the board needs to be
powered by external power supply connected to VDD and GND connection on board.
The XMC1404 device can operate by power supply of 1.8V till 5.5Vdc. On this board 5Vdc is used to power the
XMC1404 device. However, if the user wants to power the XMC1404 device with 3.3Vdc, then set jumper at
JP201 to 3.3V side.
User Manual
4
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Hardware Description
Figure 3
2.2
Power Supply circuit
Reset
Since XMC1404 does not have a reset pin, the user can unplug and replug the USB cable to achieve power-on
master reset.
2.3
Clock Generation
XMC1404 has two internal oscillators: DCO1 and DCO2. DCO1 has a clock output of 96 MHz. DCO2 is used to
generate the standby clock running at 32.768 kHz which used for Real Time Clock too. The main clock, MCLK
and fast peripherial clock, PCLK, are generated from the output of DCO1.
2.3.1
External Crystal and external Real time Clock crystal
The XMC1400 device allows its main clock MCLK to be generated from external crystal to achieve higher
accuracy. It also allows its real time clock to be run from external RTC crystal. On the XMC1400 Boot Kit, a 20
MHz external crystal circuit and a 32.768 kHz RTC external crystal circuit are implement on board to allows user
to run its application using external crystals. The 20 MHz crystal Q102 is connected to the XMC1404 device via
R111 and R114. If user does not want to use the external 20MHz crystal Q102 but wish to use P0.10 and P0.11 as
general purpose pins, then R111 and R114 need to be desoldered while R113 and R115 soldered.
The 32.768 kHz crystal Q101 is not connected to the XMC1404 device. If user wants to use the external 32.768
kHz crystal, the two 0 ohm resistors R109 and R112 need to be soldered while R108 and R110 need to
desoldered. Please refer to Figure 6 for locations of these 0 ohm resistors.
User Manual
5
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Hardware Description
Figure 4
The external 20 MHz crystal
Figure 5
The external 32.768 kHz RTC crystal
User Manual
6
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Hardware Description
Figure 6
2.4
The positions of 0 ohm resistors for connection of external crystals to XMC1400 device
Boot Option
After power-on reset with master reset, XMC1404 device enters different boot modes depending on the BMI
(Boot Mode Index) value stored in flash configuration sector 0 (CS0). The BMI value pre-programmed in the
XMC1404 on Boot Kit is User mode with debug enabled, hence, the XMC1404 device will start to run the
application code in its embedded flash after power on reset.
2.5
CAN bus connector
A CAN bus header connector is provided for CAN communication with the XMC1404 device using CAN node 1
RXD pin P4.8 and TXD pin P4.9.
If the user wants to test the CAN BSL mode of XMC1404 device using this CAN transceiver circuit, then R104 and
R106 need to be removed, then RXD and TXD pins of IFX1051LE need to be connected to P0.14 and P0.15 of
XMC1404 device respectively. Furthermore, dip-switches SWD/SPD and SWCLK need to set to position ‘off’.
IFX1051LE requires 5V power supply. If the input voltage to XMC1404 is set to 3.3V, then remove R101 and solder
R102. Next, supply an external power supply of 5V to pin4 (+) of JP102. By making these changes, the user can
use this CAN transceiver for CAN BSL handshaking.
User Manual
7
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Hardware Description
Figure 7
CAN transceiver circuitry
Figure 8
CAN header JP102, H refers to CANH, L refers to CANL, + refers to VCC, 0 refers to GND
2.6
Debug Interface and virtual com port
XMC1400 Boot Kit has on-board debugger which supports Serial Wire Debug (SWD) and Single Pin Debug (SPD)
as debug interface. SPD is a proprietary debugging protocol from Infineon Technologies and it requires only 1
pin for debug communication. The debugger also provides a virtual COM port which support UART
communication via P1.3 (rx-in) and P1.2 (tx-out) of XMC1400. There is a 2x5 pins Header Debug connector X201.
Table 1
Debug connector X201
Pin
Signal Name
XMC1400 Signal
Description
1
SWCLK
P0.15
SWD clock signal
2
SWD(SPD)
P0.14
SWD / SPD signal
3
VDDP
VDDP
+5V
4
GND
VSSP
Ground
5
GND
VSSP
Ground
6
VDDP
VDDP
+5V
7
PC_TXD
P1.3
UART data received
8
PC_RXD
P1.2
UART data transmit
User Manual
8
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Hardware Description
2.7
LED
The port pins P4.0, P4.1, P4.2 and P4.3 are connected to LED101, LED102, LED103 and LED104 respectively. The
LEDs turns on by output ‘Low’ at the respective port pins.
Figure 9
Table 2
LEDs circuit
LEDs Pinout
LED
XMC1400 Port Pin
Description
LED101
P4.0
Output ‘Low’ to on LED
LED102
P4.1
Output ‘Low’ to on LED
LED103
P4.2
Output ‘Low’ to on LED
LED104
P4.3
Output ‘Low’ to on LED
2.8
Potentiometer
XMC1400 Boot Kit provides a potentiometer R110 for ease of use and testing of the on-chip analog to digital
converter. The potentiometer is connected to the analog input P2.5. The analog output range of the
potentiometer is the same the VDDP voltage supplied to the XMC1404 device.
Figure 10
User Manual
Potentiometer Circuit
9
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Hardware Description
2.9
Application Card connector
XMC1400 Boot Kit has a 2x30 pins card edge connector. The mating connector is SAMTEC HSEC8-130-01-L-RAXX.
Figure 11
User Manual
Pinout of the 2x30 pin edge connector
10
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Production Data
3
Production Data
3.1
Schematics
This chapter contains the schematics for the XMC1400 Boot Kit:
• Figure 12: CPU, Pin Headers, external crystals, CAN transceiver circuitry, Potentiometer, LEDs and 60pin
Edge connector
• Figure 13: On-board Debugger, Power Supply
User Manual
11
Revision 1.0
2016-01-21
E
D
C
B
100nF/0603
C101
R106
0R/0603
GND
C102
R104
0R/0603
GND
R115 nm/0R/0201
R113 nm/0R/0201
R110 0R/0201
P2.13
P2.11
P2.9
P2.7
P2.5
P3.3
1
P0.13
P0.11_1
P0.9_1
P0.7
P0.5
P0.3
P0.1
13
14
15
16
17
18
19
20
21
22
41
42
43
44
45
46
47
48
51
52
53
54
55
56
57
58
ORC
P3.4
P3.2
P3.0
36
37
38
39
40
R109
50
S&H0
G0.CH1
G0.CH2
G0.CH3
G0.CH4
G0.CH0
CMP2
2
ACMP
CMP3
CMP0
XMC1404-Q064X0200
P3.0
P3.1
P3.2
P3.3
P3.4
Port 3 - standard port
IC102_P3
S&H1
G1.CH1
G1.CH0
G1.CH4
G1.CH2
G1.CH3
G1.CH6
G1.CH7
CMP1
XMC1404-Q064X0200
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P0.8/RTC_XTAL1
P0.9/RTC_XTAL2
P0.10/XTAL1
P0.11/XTAL2
P0.12
P0.13
P0.14
P0.15
S&H1
S&H0
G0.CH7
G0.CH6
G0.CH5
VDDP
G1.CH5
EXP
VSSP
35
ORC
EXP
49
12
11
10
9
P2.0
P2.2
3
220nF/0402
GND/3.6C
VDDP
C112
P2.3
P2.2
P2.1
P2.0
GND/3.6C
220nF/0402
VDDP
C108
GND
Q102
20MHz
External XTAL
GND
2
4
P2.3
P0.11_1
P0.10_1
P1.0
510R/0201
0R/0201
R114
R111
P1.1
P2.13
AGND
P2.8
P2.4
P4.8
P0.10
P0.14/3.6C
P2.2
P0.4
GND/3.6C
P4.0
P4.4
P0.0
34
33
32
31
30
29
28
27
26
P3.1
VDDP
P2.10
P2.6
P4.6
P4.10
P0.12
P2.0
VDDP
P0.6
P0.8
P4.2
P0.2
P1.1
P2.1
AGND
P4.9
P4.7
P4.5
P4.3
P4.1
GND/3.6C
VDDP
24
25
2
59
60
61
62
63
64
3
4
5
6
7
8
4
220nF/0402 1
C111
P4.10
P4.8
P4.6
P4.4
P4.2
P4.0
C110
100nF/0402 23
C109 VAREF
P1.7
P1.5
P1.3/3.7B
P4.11
220nF/0402
VDDP
P1.8
P1.6
P1.4
P1.2/3.6B
P3.2
P2.12
P2.11
P2.7
P4.7
P4.11
P0.13
P2.1
P0.3
P0.7
P0.9
P4.3
GND/3.6C
P1.0
P1.4
P1.8
5
P3.0
VAREF
P2.9
P2.5
P4.9
P0.11
P0.15/3.7B
P2.3
P0.5
VDDP
P4.1
P4.5
P0.1
P1.2/3.6B
P1.6
P3.4
0R/0603 R107
0R/0603 R105
C103
BR102
BR101
S
0R/0603
R123
Potentiometer and LEDs
P0.14
AGND
VAREF
P2.5
VAREF
P1.2
VDDP
GND
P0.14
Debug Connector SWD, SPD, UART
VAREF
AGND
60pin edge connector
6
100nF/0603
5
6
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Legal Disclaimer
XMC1404-Q064X0200
VSSP
VDDP
P4.0
P4.1
P4.2
P4.3
P4.4
P4.5
P4.6
P4.7
P4.8
P4.9
P4.10
P4.11
Port 4 - standard port
IC102_P4
XMC1404-Q064X0200
VSSP/VSS
VDD
VDDP
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
P1.8
2
4
6
8
10
12
14
16
2
4
6
8
10
12
14
16
2
4
6
8
10
12
14
16
2
4
6
8
10
12
14
16
MCU pins
1
3
5
7
9
11
13
15
JP105
1
3
5
7
9
11
13
15
JP104
1
3
5
7
9
11
13
15
JP103
1
3
5
7
9
11
13
15
JP101
Port 1 - high current port
VDDP
P0.8_1
nm/0R/0201
R112
P0.9_1
nm/0R/0201
7
6
1
3
JP102
P1.5
VDDP
IC102_P1
GND
Q101
32.768KHz
External RTC
R103
GND
120R/0805
2
9
P1.3/3.7B
P1.7
P3.3
Port 0 - standard port
XMC1404-Q064X0200
P2.4
P2.5
P2.6
P2.7
P2.8
P2.9
P2.10
P2.11
P2.12
P2.13
CANH
CANL
GND
EPAD
IFX1051LE
TXD
RXD
RM
VCC
VIO
4
XMC1404 MCU
IC102_P0
P0.11
P0.10
P0.9
P0.8
1
4
8
Port 2 - analogue features
IC102_P2
P0.15/3.7B
P3.1
P2.12
P2.10
P2.8
P2.6
P2.4
P0.14/3.6C
P0.12
P0.10_1
P0.8_1
P0.6
P0.4
P0.2
P0.0
Note: nm means 'not mounted'
P0.11_1
P0.10_1
P0.9_1
P0.8_1
R108 0R/0201
Jumpers to connect P0.8,P0.9,P0.10,P0.11
to Header
P4.8
P4.9
GND
100nF/0603
3
5
C104
VDDP
15pF/0402
R101
15pF/0402
0R/0603
8pF/0402
A
C106
IC101
C105
R102
C107
nm/0R/0805
8pF/0402
3
E
A
2
R122
AGND 10k
1
8
6
4
2
P4.0
P4.1
P4.2
P4.3
7
VDDP
VDD_DEV
PC_RXD
VDDP
GND
SWD(SPD)
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P0.8
P0.9
P3.4
P4.2
P0.12
P0.13
P1.1
P0.15
P1.0
P1.1
P1.2
P1.3
P0.8
P0.9
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
7
7
5
3
1
0R/0603
R117
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
VDDP
PC_TXD
GND
VDDP
SWCLK
P1.8
P2.11
P2.10
P2.9
P2.8
P2.7
P2.6
GND
VDDP
P4.4
P4.5
P4.6
P4.7
P4.8
P4.9
P4.10
P4.11
P1.5
P1.7
P1.6
P1.4
P1.3
P1.2
P1.1
1K/0603
P1.0
P3.0
R116
P3.1
P3.2
P3.3
P0.6
P0.7
8
P1.3
GND
VDDP
P0.15
XSE060_HSEC8_MATINGCARD
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
X101
Debug
X102
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
4K7/0603 R118
LED101
LED-RED/D/0603
12
4K7/0603 R119
LED102
LED-RED/D/0603
User Manual
E
D
C
B
A
not saved!
MCU
XMC1400_VQFN64-V1-2
Sheet: 2/3
8
4K7/0603 R120
LED103
LED-RED/D/0603
Figure 12
4K7/0603 R121
LED104
LED-RED/D/0603
CAN transceiver (work for 5V only)
XMC1400 Boot Kit
For XMC1000 Family
Production Data
Schematic 1 of 2 XMC1400 Boot Kit
Revision 1.0
2016-01-21
Figure 13
User Manual
13
10k/0402
R215
VCCA
A
DIR
SN74LVC1T45DCK
VCCB
B
GND
IC206
1
3
5
1
2
3
5
GND
10k/0402
GND
6
4
2
VCCA
A
DIR
SN74LVC1T45DCK
VCCB
B
GND
IC204
1
3
5
TX
TX_EN
10k/0402
GND
R216
R214
5
6
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Legal Disclaimer
PC_TXD_DEV
GND GND
IO
VDD_DEV
7
GND
7
5
3
1
8
4
PC_TXD
GND
VDDP
SWCLK
VCCA
A1
A2
DIR
SN74LVC2T45DCT
VCCB
B1
B2
GND
IC205
RESET
1
X203
DEBUG
RESET_DEV# 7
PULL_SEL_DEV 6
P14.9
8
6
4
2
P0.14
P0.15
P1.3
P1.2
RESET#
PULL_SEL
PULL_SEL_DEV
GND
E
D
C
B
A
Sheet: 3/3
8
not saved!
J-Link & UART
XMC1400_VQFN64-V1-2
1
2
3
5
P1.3
GND
VDD_DEV
P0.15
GNDGND
SWD_DEV
+3V3
4
R217
10k/0402
SWD_OUT
SWD_DIR
GND
RX
SWD_IN
IO
VDD_DEV
RESET_DEV#
PC_RXD
VDDP
GND
SWD(SPD)
S201
X201
4
3
2
1
n.m./0603
3
GND
6
4
2
VCCA
A1
A2
DIR
SN74LVC2T45DCT
VCCB
B1
B2
GND
+3V3
2
SWD_DEV
8
7
6
4
100nF/0402 C209
IO
GND
VDD_DEV
10k/0402
100nF/0402 C212
GND
PC_RXD_DEV
100nF/0402 C213
1
+3V3
SN74LVC1T45DCK
SWCLK
CS
+3V3
GND
1
3
5
IO
VDD_DEV VDD_DEV
IO
100nF/0402
C207
X202S
P1.2
VDD_DEV
GND
P0.14
219-04
VIN
8
VDD_DEV
P201
+
IO
VDD_DEV
JP201
JMPER_VSEL
3
2
1
R213
E
15pF/0402 C205
VCCA
A
DIR
100nF/0402 C208
VCCB
B
GND
R211
IC203
10k/0402
6
4
2
+3V3
IC202
4.7uF/0805 C210
IO
100nF/0402 C211
SWCLK_DEV
+3V3
VDD_DEV
D1
R218
ESD8V0L2B-03L
V204
IO
GND
R209
C215
GND
R208
R212
GND
D2 3
GNDGNDGND GND
1
2
3
4
5
IO
VDD_DEV
100nF/0402
GND
R207
5K10 / 1%
R210
GND
V203
5K10 / 1%
VDD_DEV
Voltage Translators
15pF/0402 C206
GND
10k/0402
GND
1M/0402
XMC_SWD
no ass./10nF/0402
31
6
41
28
5
4k7/0402
XMC4200_QFN48
VDDC1
VDDC
VDDP2
VDDP1
VDDP
2
1
2
3
4
5
JP202
VSS
EPAD
Supply
1
27
EPAD
PORST#
TCK
TMS
XTAL1
33R/0402
33R/0402
R201
32
34
33
R204
R206
BAT60A
A
29
3
4
X202C
L201
BLM18PG600
ZX62-AB-5PA
DBGPRES#
WTCK
WTMS
USB_D-
USB USB_D+
+3V3
GND
C
XTAL2
7
10
LED-GN/D/0603
680R/0603 V201
30
HIB_IO_0
VBAT
R202
510R/0603
Hibernate/RTC
LED-R/D/0603
680R/0603 V202
RTC_XTAL_1
RTC_XTAL_2
ON
GND
+3V3
1
8
5
6
7
8
2
GND
VAREF
VAGND
SWD_DEV
SWCLK_DEV
PC_TXD_DEV
PC_RXD_DEV
Debug Connector SWD, SPD, UART
3
9
18
17
+5V
GND
4
C214
R205
C204
P14.9
COM LED
Level Shifter
No RESET Pin
UART
SPD
SWV
JTAG
GND
3
USB5V 3.3V
100nF/0402
19
20
11
12
13
14
15
16
OUT
4
2
P14.9
P14.8
P14.7
P14.6
P14.5
P14.4
P14.3
P14.0
IN
IC201
IFX25001MEV33
22uF/10V/0805 C201
SWCLK
CS
SWD_OUT
SWD_IN
SWD_DIR
1
GND2
GND1
35
36
37
38
39
40
PULL_SEL
TX_EN
COMDIS#
TX
RX
RESET#
DEBUG_LED#
AUX_LED#
+5V
0R
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
42
43
44
45
46
47
48
1
2
+3V3
R203
Analog
Digital
P0.8
P0.7
P0.6
P0.5
P0.4
P0.3
P0.2
P0.1
P0.0
+3V3
7
C202
D
RESET#
GPIO-P0.3
DEBUG_LED# GPIO-P0.2
AUX_LED#
GPIO-P0.1
RESET#
DEBUG_LED#
AUX_LED#
P2.5
P2.4
P2.3
P2.2
P2.1
P2.0
U201
+5V
Power Supply
6
10uF/10V/0805
C
U1C0
DX0A-P0.4
DOUT0-P0.5
GPIO-P0.7
GPIO-P0.6
UART2 (DM2)
RXD
TXD
TX_ENABLE
TXACTIVE#
RXD
TXD
TX_EN
EN#
24
25
26
SWCLK 22
23
CS
21
Configure COMDIS# as open-drain output
Configure wiggler-P0.5 as USIC_Tx but only active while X-spy function is selected
Configure wiggler-P0.4 as USIC_Rx but only active while X-spy function is selected
Configure wiggler-P0.3 as RESET# detect input but with additional open-drain output capabilities
5
100nF
Q201
12MHZ/S/3.2X2.5
P14.9
ADC
AIN
VDD_DEV
U0C1
DX2A-P2.3
DX1A-P2.4
GPIO-P0.8
U0C0
GPIO-P1.3
DX0B-P1.4
DOUT0-P1.5
SCLKOUT-P1.1
SELO0-P1.0
4
+3V3
PULL_SEL
SPI Master
SWD DIR
MISO
MOSI
CLK_OUT
CS_OUT
3
+3V3
SPI Slave
CS_IN
CLK_IN
PULL Select
SWD_DIR
SWD_IN
SWD_OUT
SWCLK
2
C203
B
A
1
On-board J-Link with UART
XMC1400 Boot Kit
For XMC1000 Family
Production Data
+3V3
Schematic 2 of 2 XMC1400 Boot Kit
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Production Data
3.2
Figure 14
User Manual
Layout and Geometry
XMC1400 Boot Kit layout and geometry
14
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Production Data
USB5V 3.3V
VIN
X202
V204 R209
R207
R204 C207
V203 R203
R208
R202 R201
V202 V201
C210
C209
R206
C202
C203
C211
C212
C208
U201
R205
L201
C205
S201
R215
C201
IC201
R216
R213
R217
8
R214
R218
R118
R119
R120
R121
R123
LED101
LED102
LED103
LED104
ADJ_301
R122
R117
JP105
JP101
R102
JP102
IC101
C102
2
10
C101 R101
IC
C105
R112 R110
Q102
R113 R111
R108 R109
C108
C112
C109
V_SEL-
+
R210
R212
C215
C204
C214
R211
C206
Q201
8
C111
JP104
R105
R107
JP103
ADJ_302
ADJ_303
X101
2
60
R116
R106
R115
R114
C106
C107
IC203 IC202 IC205
IC206
IC204
R103
Q101
C213
R104
C110
C104
3
1
X102
1
4
3
2
1
5: GND
4: #DBGPRES
3: TMS
2: TCK
1: +3V3
X203
1
X201
ON
Revision 1.0
2016-01-21
15
User Manual
CR number of XMC1400 Boot Kit
Figure 15
CR number of XMC1400 Boot Kit
3.3
JP202
C103
XMC1400 Boot Kit
For XMC1000 Family
Production Data
3.4
Bill of Material
Table 3
XMC1400 Boot Kit
No.
Value
Device
1
JMPER_VSEL
1x3 pin header
Qty Reference
Designator
1
JP201
2
CAN pins
2x2 pin header
1
JP102
3
Debug
2x4 pin header
2
X102 X201
4
100nF 10V 10% 0402
Capacitor X7R
9
C110 C204 C207 C208 C209 C211
C212 C213 C215
5
100nF 10V 10% 0603
Capacitor X7R
4
C101 C102 C103 C203
6
10uF 10V 10% 0805
Capacitor X7R
1
C202
7
15pF 10V 1% 0402
Capacitor NPO
4
C104 C105 C205 C206
8
220nF 10V 10% 0402
Capacitor X7R
4
C108 C109 C111 C112
9
22uF 10V 10% 0805
Capacitor X7R
1
C201
10
4.7uF 10V 10% 0805
Capacitor X7R
1
C210
11
8pF 10V 2% 0402
Capacitor NPO
2
C106 C107
12
12 MHz S 3.2X2.5
Crystal 12 MHz SMD 8pF
NX3225GB-12.000M-STD-CRA-2
1
Q201
13
20 MHz S 3.2X2.5
Crystal 20 MHz SMD 8pF
NX3225GB-20.000M-STD-CRA-2
1
Q102
13a1)
20 MHz S 3.2X2.5
Crystal 20 MHz SMD 8pF HONG
KONG X’TALS LIMITED
3225M2000IB01
1
Q102
14
ESD8V0L2B-03L
Diode, Infineon
1
V204
15
SN74LVC2T45DCT
Dual-bit Dual supply bus
transceiver
2
IC202 IC205
16
BLM18PG600
Ferrite Bead
1
L201
17
LED-GN D 0603
LED, green
1
V201
18
jumper (red)
Jumper
1
JP201A
19
ZX62-AB-5PA
Connector Micro-USB AB SMD
ZX62-AB-5PA Hirose
1
X202
20
LED-RED D 0603
LED, red
1
V202
21
LED-RED D 0603
LED, red
4
LED101 LED102 LED103 LED104
22
0R 10% 0201
Resistor
3
R108 R110 R111
23
0R 10% 0603
Resistor
8
R101 R104 R105 R106 R107 R117
R123 R203
24
10k
Resistor, Potentiometer
1
R122
25
10k 10% 0402
Resistor
7
R208 R211 R214 R215 R216 R217
R218
26
120R 10% 0805
Resistor
1
R103
27
1K 10% 0603
Resistor
1
R116
28
1M 10% 0402
Resistor
1
R209
User Manual
16
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Production Data
No.
Value
Device
29
33R 10% 0402
Resistor
Qty Reference
Designator
2
R204 R206
30
4k710% 0402
Resistor
1
R207
31
4K7 10% 0603
Resistor
4
R118 R119 R120 R121
32
510R 10% 0201
Resistor
1
R114
33
510R 10% 0603
Resistor
1
R205
34
5K10 10% 1%
Resistor
2
R210 R212
35
680R 10% 0603
Resistor
2
R201 R202
36
32.768 kHz, FC-135
Crystal 32.768 kHz SMD 12.5pF
NDK NX3215SA-32.678K
1
Q101
36a1)
32.768 kHz, FC-135
Crystal 32.768 kHz SMD
HONG KONG X’TALS LIMITED
3215K3276IB01
1
Q101
37
SN74LVC1T45DCK
Single bit Dual supply bus
transceiver
3
IC203 IC204 IC206
38
IFX1051LE
CAN transceiver, Infineon
1
IC101
39
XMC1404-Q064X0200
Microcontroller, Infineon
1
IC102
40
IFX25001MEV33
Voltage regulator, 3V3, Infineon
1
IC201
41
XMC4200-Q48K256
Microcontroller, Infineon
1
U201
42
BAT60A
Diode Infineon
1
V203
43
no ass. 10nF 10% 0402
Capacitor
1
C214
44
MCU pins
2x8 pin header
4
JP101 JP103 JP104 JP105
45
XMC_SWD
1x5 pin header
1
1X05
46
no ass. 0R 10% 0805
Resistor
1
R102
47
no ass. 0R 10% 0201
Resistor
1
R109
48
no ass. 0R 10% 0201
Resistor
1
R112
49
no ass. 0R 10% 0201
Resistor
1
R113
50
no ass. 0R10% 0201
Resistor
1
R115
51
no ass. 0R 10% 0603
Resistor
1
R213
Note: 1) Alternative part.
User Manual
17
Revision 1.0
2016-01-21
XMC1400 Boot Kit
For XMC1000 Family
Revision History
Revision History
Major changes since the last revision
Page or Reference
Description of change
V1.0
Initial Version
User Manual
18
Revision 1.0
2016-01-21
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBlade™, EasyPIM™,
EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, Infineon™, ISOFACE™, IsoPACK™,
i-Wafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™,
PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Trademarks updated August 2015
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2016-01-21
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2016 Infineon Technologies AG.
All Rights Reserved.
Do you have a question about this
document?
Email: erratum@infineon.com
Document reference
UG_201512_PL30_005
IMPORTANT NOTICE
The information contained in this application note
is given as a hint for the implementation of the
product only and shall in no event be regarded as a
description or warranty of a certain functionality,
condition or quality of the product. Before
implementation of the product, the recipient of this
application note must verify any function and other
technical information given herein in the real
application.
Infineon
Technologies
hereby
disclaims any and all warranties and liabilities of
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non-infringement of intellectual property rights of
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information given in this application note.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments
to evaluate the suitability of the product for the
intended application and the completeness of the
product information given in this document with
respect to such application.
For further information on the product, technology,
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