Application Note AN 2010-06 V2.0, February 2013 EconoPACK™4 Product Family Mounting instructions / Application Note IFAG IPC MP N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 Edition 2013-02-01 Published by Infineon Technologies AG 59568 Warstein, Germany © Infineon Technologies AG 2010. All Rights Reserved. Attention please! THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN 2010-06 Actual Version: 2013-02-01 V2.0 Previous Version: 2010-08-06 V1.0 Major changes since last revision: Additional chapter 11.Climatic conditions; chapter 3.2 typ. press-in force 110N/ pin. Author: R. Ott / M. Knecht IFAG IPC MP We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [[email protected]] -2- N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 Inhaltsverzeichnis 1 1.1 1.2 General information ...................................................................................................................... 4 General application information .................................................................................................. 4 Handling of electrostatic sensitive components ....................................................................... 4 2 Requirements for printed circuit boards .................................................................................... 4 3 3.1 3.2 3.3 The press-in process .................................................................................................................... 6 Press-in tools ................................................................................................................................ 7 Press-in forces .............................................................................................................................. 7 Additional fixing of the printed circuit board ............................................................................. 8 4 The press-out process ................................................................................................................. 9 5 Requirements towards the heat sink for module assembly ................................................... 10 6 6.1 6.2 Application of the thermal interface material ........................................................................... 10 Application of thermal conductive paste by screen printing ................................................. 10 Alternative: Applying TCP by roller or spatula ........................................................................ 12 7 7.1 7.2 Mounting the module to the heat sink ...................................................................................... 12 Screws to mount the module to the heat sink ......................................................................... 12 Mounting the module to the heat sink ...................................................................................... 12 8 8.1 Connecting the busbars to the power terminals ..................................................................... 14 Connecting the power terminals with ideal strain relief ......................................................... 15 9 Mechanical loads (vibration and shock) ................................................................................... 16 10 Storage and transportation of IGBT modules .......................................................................... 16 11 Climatic conditions during active, current carrying operation of EconoPACK™ 4 modules ....................................................................................................................................... 16 -3- N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 1 General information 1.1 General application information Compliance with the requirements for Infineon IGBT modules is assured by appropriate reliability tests and by 100% final tests that are performed during production. Maximum values in the product data sheets and application notes of IGBT modules are definite limits that may never be exceeded, even not for a short period of time, as this could end in the destruction of the components. This application note cannot cover all different applications and application conditions. Therefore application notes can not replace a detailed technical evaluation and examination by the user. Therefore, the application notes will under no circumstances become part of any supplier agreed warranty, unless the supply agreement determines otherwise in writing. 1.2 Handling of electrostatic sensitive components IGBT modules are electrostatic sensitive components. Electrostatic discharge (ESD) may pre-damage these modules or even destroy them. In order to prevent destruction or pre-damage of the components by electrostatic discharge, the components are delivered according to the approved ESD regulations, in appropriate ESD protected packaging. The removal of the ESD protection and the handling of the unprotected modules require the installation of ESD conform workplaces. Further information is available e.g. from the ESD security guidelines IEC 61340-5-1 and ANSI/ESD S2020. 2 Requirements for printed circuit boards The PressFIT technology used in the EconoPACK™ 4 modules has been inspected and qualified by Infineon Technologies AG for standard FR4 printed circuit boards with „chemical tin“ surface (according to the IEC 60352-5 + IEC60747-15 standards). If other technologies are used for the production of printed circuit boards, they have to be tested, inspected and qualified separately. Requirements for the printed circuit board (PCB) material are: Double-sided PCB according to IEC 60249-2-4 or IEC 6249-2-5. Multilayer PCB according to IEC 60249-2-11 or IEC 60249-2-12. In order to ensure a good contact between PCB hole and PressFIT pin, the specification of the hole given in table 1 has to be followed. If the specification of the PCB holes included only the final hole dimension (i.e. the metallized hole), different drill sizes and metalization thicknesses could be used depending on the PCB manufacturer and his production capability. This could result in varying results and so compromise the quality of the electrical contact. For this reason it is recommended to follow the complete guidelines provided in table 1. A further recommendation is to drill the holes in the PCB with a drill of 1.15mm in diameter, and not to mill it. Experience has shown that with milling the final hole diameter is typically between 1.12mm and 1.15mm due to the runout tolerances of the spindles used and due to shrinkage of the FR4 material. -4- N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 Drill hole diameter Copper thickness in hole Min. Typ. 1.12 1.15 Max. >25m <50m Metallization in hole <15m Final hole diameter 0.94mm Copper thickness of conductors 35m 1.09mm 70m - 105m Metallization of PCB Tin (chemical) Metallization of pin Tin (galvanic) Table 1 400m Requirements for the printed circuit board With a copper thickness of 25m to 50m in the hole and a tin layer of about 1m for chemically applied tin, a final hole diameter is obtained as a test dimension. Due to the thinner tin layer thickness compared to e.g. HAL printed circuit boards, the diameter is always higher than the value of 1mm that is given in the according standard (IEC 60352-5). The final hole diameter, considering the drilled hole diameter, copper thickness and tin thickness is typically between 1.02mm and 1.09mm. Drill hole 1,15 -0,03 mm 1,15 -0,03 mm Copper in drill hole Annular ring min. 0,2 mm min. 25µm Cu ; max. 50µm Cu Final hole diameter max. 15µm tin chemical tin typ 1µm min. 0.94 mm max.1.09 mm Figure 1 min. 0.94mm ; max 1.09mm Structure of the printed circuit board The PressFIT technology is qualified for FR4 printed circuit board material. After a reflow soldering process is carried out on a printed circuit board, the module can still be pressed into the board. The retention forces of the PressFIT pins are not lessened. -5- N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 As with Easy and Econo PressFIT modules, a distance of 5mm from the middle of each pin to other components on the PCB has to be observed. The same dimensions have to be considered in case of Press-tools developed by the user when positioning components on the PCB. A PressFIT module can be replaced up to two times. This means that a printed circuit board can be used up to three times in total. Correct handling of the components is essential in this case. A module that has been pressed in and then pressed out again can no longer be pressed in. Instead, the module can be attached in a new PCB by soldering. The plastic deformation of the PressFIT pin does not allow further press-fitting. 3 The press-in process The PressFIT module is inserted into a printed circuit board by press-in. The press-fitting can be performed either using a simple toggle lever press or a machine. A press-in tool that records the necessary force and the distance moved is recommended as this will assure constant quality. Doing so, a consistent quality is assured. The press-fitting speed should be between 25mm/min and 50mm/min according to IEC 60352-5. Please note that during the press-in process the placement area of the printed circuit board and the pressing area of the pressure plate have to be parallel towards each other. The pressure plate should be mechanically fixed in position. The module should be pressed into the printed circuit board by a uniform movement. The module pins should penetrate the printed circuit board during press-in until the bearing areas of the module housing are touched by the PCB. To limit the force at the end the press-in process, springs could be implemented at the upper part of the press-in tool. The spring-biased force of the tool can be adjusted to the amount of pins and the according necessary press-in force. The springs may be not necessary in certain cases, especially if the press-in force is controlled and limited. The following illustrations show the press-in process of an EconoPACK™ 4 as it is implemented in the Infineon Technologies AG lab. Step 1: Step 2: Step 3: The press is aligned to ensure The PCB and the module are The PressFIT pins of the module that both parts of the tool are placed in the tool. The positioning are pressed into the PCB by directly above each other. is supported by the tool guides. moving the downwards. Figure 2 Example of the press-in process for an EconoPACK™ 4 module. -6- upper tool part N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 3.1 Press-in tools Infineon has developed an example press-in tool for the EconoPACK™4 and EconoBRIDGE™4. Figure 3 shows the press-in tool. Drawings of the tool can be requested through the normal Infineon channels. The suitability for the specific assembly process and application has to be tested and qualified by the user. When adjusting the tool for a specific PCB or developing a tool, the positioning of PCB components close to the load bearing areas of the tool has to be taken into account in order to prevent damaging of these components during the press-in process. Figure 3 3.2 Example of a press-in tool for EconoPACK™ 4 and EconoBRIDGE™ 4. Press-in forces To press a module into a printed circuit board, a force of approximately 110N has to be applied for each pin of the module. The press-in forces depend on the PCB hole diameters. As the EconoPACK™4 feature 15 PressFIT pins; the typical necessary press-in force is approximately 1.6kN. If the holes in the PCB are at the lower limit of the tolerance and/ or several modules will be pressed in parallel, the press-in force can be higher. It is the responsibility of the customer that surface mounted devices on the PCB will not be damaged. Min. Typ. Drill hole diameter 1.15mm Press-in speed Copper thickness in hole 25mm/min 25m 50m Typical Press-in force per pin Table 2 Max. 110N Typical Press-in forces -7- N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 3.3 Additional fixing of the printed circuit board After the press-in process, it is recommended to mechanically relieve the contact areas between module and printed circuit board. Relieve of the contact areas is achieved by mounting the PCB onto the module using the four PCB mounting stand-offs (see figure 4) using self-tapping screws or similar fastening methods. Besides screwing the PCB to the mounting domes by hand, an electronically controlled or at least slowly turning electric screw driver (U 300U/min) is a preferred tool for this process. Due to a lack of accuracy we do not recommend the use of pneumatic screw drivers. Figure 4 PCB mounting stand-offs of EconoPACK™ 4 modules (marked red) The effective length of the screw thread entering the PCB mounting stand-offs should be of a minimum length of lmin 4mm and a maximum length of lmax 10mm, taking into account the specific PCB thickness and the weight of the mounted PCB. A. Correctly assembled PCB B. Incorrectly positioned screw screw screw PCB Modul Figure 5 Modul A. Correctly assembled screw in the PCB mounting stand-off B. Incorrectly positioned screw in the PCB mounting stand-off -8- N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 The upper 1.5mm of the mounting stand-offs serve as guidance only and can’t take any force. The thread in the plastic will form itself when the screw is driven in. Recommended self-tapping screws are for example: PT WN 1451 K25x10 A2K : Mmax = 0.65Nm 10% - Ejot - Ejot DELTA PT WN 5451 K25x10 : Mmax = 0.65Nm 10% To avoid damage or splitting of the mounting stand-off, straight insertion of the screws into the standoffs has to be achieved during assembly (figure 5). The recommended screws and torques are based on laboratory tests. Depending on the screws used and tools it may be necessary to adjust the assembly process accordingly. 4 The press-out process Infineon has developed an example press-out tool for the EconoPACK™4 and EconoBRIDGE™4. The tool is shown in figure 6. Drawings of the tool can be requested through the normal Infineon channels. The suitability for the specific assembly process and application has to be tested and qualified by the user. When adjusting the tool for a specific PCB or developing a tool , the positioning of PCB components close to the load bearing areas of the tool has to be taken into account in order to prevent damaging of these components during the press-out process. Figure 6 Exemplary press-out tool for EconoPACK™ 4 and EconoBRIDGE™ 4 -9- N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 5 Requirements towards the heat sink for module assembly The power loss generated in the module has to be dissipated via a heat sink in order not to exceed the maximum permissible temperature specified in the data sheets during switching (Tvjop). Detailed information can be found in Application Note 2008-01 „Definition and use of junction temperature values“. The condition of the heatsink surface in the module mounting area is of great importance, as the interface between heatsink and and module has a large influence on efficient towards the heat transfer from the module to the ambient. The contact surfaces, the base plate of the module and the surface of the heatsink have to be free of degradation and contamination and should be cleaned with a fresh, lint free cloth. The contact surface of the heatsink should not exceed the following values, referenced to a length of L = 100mm: - Surface flatness 50m - Surface roughness Rz 10m The heat sink has to be of sufficient stiffness for the assembly and the subsequent shipping in order not to exert additional strain or pulling forces to the base plate of the module. The heatsink has to be handled twist-free during the entire assembly process. 6 Application of the thermal interface material Due to the individual surface shapes of the module base plates and the heat sinks, there are inherent air gaps in-between both mating surfaces. To dissipate the losses in the module and to achieve an efficient heat flow from the chip into the heat sink, these gaps or cavities must be filled by a thermal interface material (TIM). An optimum layer thickness displaces all air, but also does not prevent the metal-to-metal contact between the baseplate and the heat sink surface where it occurs. When using a thermal conductive paste (TCP), a homogenous application has to be ensured. A TIM should be selected that shows permanent elastic features in order to ensure a constant good heat transfer resistance. The TIM should be applied in a way that no screw holes are contaminated so that screw torqueses are not compromised. 6.1 Application of thermal conductive paste by screen printing It’s everything but easy to apply thermal conductive paste manually with a constant thickness in the m-range. Homogenity and reproducability of the resulting thermal layer are always questionable. Therefore it is recommended to apply the thermal conductive paste by screen printing (see figure 7). Besides applying the TCP homogeneously and reproducably, this method offers the possibility to adjust the distribution of the paste to the individual module. Proposals for module specific drawings of such screen printing stencils can be requested using the normal Infineon channels. The suitability of the stencil in combination with the specific TCP and the assembly process and application has to be tested and qualified by the user. - 10 - N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 A. Screen printing equipment B. Applying the TCP TCP stencile Module base plate Figure 7 A. Example of screen printing equipment to apply TCP B. Applying the TCP by using a stencil A typical distribution of thermal conductive paste on the base plate of an EconoPACK™ 4 applied by screen printing is shown in figure 8. Figure 8 Base plate of an EconoPACK™ 4 after applying TCP by screen printing Further information of the use of stencils to apply thermal conductive paste by screen printing can be found in the application note AN2006-02 „Application of screen print templates to paste thermal grease within Infineon modules “. - 11 - N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 6.2 Alternative: Applying TCP by roller or spatula If the application of thermal conductive paste can’t be done by the recommended screen printing process, the paste could be applied using a roller or spatula alternatively. The layer thickness of the applied grease should be typically between 50µm and 100µm. As a guideline for the required the amount of thermal conductive paste depending on the thickness d the following volumes can be given: d = 50µm VTCP 0,4cm 3 d = 100µm VTCP 0,8cm . These volumes can be either measured with the aid of a syringe or applied from a tube. Common rollers or fine toothed spatulas can be used to apply the thermal conductive paste. Unfortunately, the homogenity and reproducability of the resulting layer thickness is always questionable. For qualification and verification of the assembly process and during training phases, the thickness of the paste can be controlled by the aid of a wet film comb. 3 7 Mounting the module to the heat sink 7.1 Screws to mount the module to the heat sink To mount the modules the following is recommended: DIN M5 bolts which comply at least with class 6.8, e.g. according to DIN912 (ISO4762), ISO 7380, DIN6912, DIN7984 in combination with a suitable washer and spring washer, e.g. according to DIN433 or DIN125 or comparable combined screws. The clearance and creepage distances that are specified in the EconoPACK™ 4 data sheets are the shortest clearance and creepage distances at the unassembled and unconnected module. When selecting suitable M5 screws, washers and spring washers to mount the module, it is recommended to consider the resulting clearance and creepage distances between the power terminals and the nearest screw head or washer during the development phase and according to the valid standards. 7.2 Mounting the module to the heat sink Mounting of the module has to be carried out within the permissible module tolerances. Further information and module drawings are given in the relevant data sheets. The clamping force of the module, resulting from the assembly process to the heatsink, depends on the applied torque and the condition of the heat sink. The following torque values specified in the data sheet result from steel screws in aluminium heat sinks with a dry M5 thread and their typical friction factors of µG=0,2…µG=0,25 (µG=friction coefficient thread in heat sink): Mmin=3Nm to Mmax=6Nm. The module fastening screws have to be tightened uniformly in the recommended sequences with the specified torque. Other material combinations of screws and/or heatsink material may require an adjustment of the mechanical parameters. To ensure a good thermal contact to the heatsink, the following procedure is recommended when tightening the four M5 fastening screws: - 12 - N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 1. Place the module with the applied thermal compound onto the heat sink and fix with the screws 2. Fix the screws with 0.5Nm (hand tight, crosswise) in the following sequence (see figure 9) Screw number: 1 – 2 – 3 – 4 3. Tighten the screws with 3Nm – 6Nm in the same sequence (crosswise) Screw number: 1 – 2 – 3 – 4 Depending on the viscosity of the used thermal compound, an intermediate step 2a may be required, especially for pastes with high viscosity. This additional step will give the thermal compound the chance to distribute during the assembly process and to adapt to the module base plates and heat sink’s shape. After a certain time, depending on the used thermal compound, step 3 has to be carried out. 2.a. Tighten the screws with approximately 2Nm in the same sequence (crosswise) Screw number: 1 – 2 – 3 – 4 Figure 9 Tightening sequence to mount the module to the heat sink When using thermal compound, it may be necessary (depending on the type of paste) to check the tightening torques of the fastening screws for the correct value after a heat-up test. When using thermal foils instead of TCP, it is definitely recommended to perform this additional check. The application notes and the given torques are valid only when using thermal conductive paste. Therefore, own tests and measurements with the envisaged heat conductive foils are absolutely necessary! When selecting the thermal interface material between module and heat sink, the thermal contact and the long-term stability should be considered and discussed with the manufacturer of the thermal interface material. - 13 - N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 8 Connecting the busbars to the power terminals Connecting the module has to be carried out within the permissible module tolerances given in the individual datasheets. The DC power side should be connected to a laminated bus bar in order to keep the switching overvoltages as low as possible by minimising the stray inductance. Adherence to the maximum permissible voltage at the power terminals and at the IGBT chip has to be assured according to the relevant data sheet (see RBSOA). For the connection of the power terminals DIN M6 screws are required which comply at least with class 6.8, in combination with a suitable washer and spring washer or complete combination screws. These should be tightened with the recommended torque of Mmin=3Nm to Mmax=6Nm. When selecting the screw length, the layer thickness of the connected parts has to be substracted from the total length of the screws. The effective length of engagement into the module thread may not exceed the maximum specified depth of 10mm. The connected parts have to be mounted to the power terminals in a way that the specified forces (see figure 10) are not exceeded during assembly or later in operation. Fz+ < 100N Fy- < 100N Fx+ < 100N Fy+ < 100N Fx- < 100N Fz- < 500N Figure 10 Maximum permissible pull and push forces at the power terminals of the EconoPACK™ 4 - 14 - N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 8.1 Connecting the power terminals with ideal strain relief To connect the power terminals with the best possible strain relief, an assembly according to the concept drawings in figures 11 or 12 is recommended. Taking into account all tolerances, the mounting block should be approximately 0.5mm lower than the height of the power terminals in order to ideally give a pre-tension to the power terminals and especially to avoid a damaging permanent force in Fz+ direction (see figure 10). F fixing block x fan Figure 11 X- 0,5mm height A heat sink Concept drawing 1 of EconoPACK™ 4 assembly with ideal strain relief copper module copper 0026 plastic fixing blockk screw heat sink cable lug cable Figure 12 fixing block screw Concept drawing 2 of EconoPACK™ 4 assembly with ideal strain relief - 15 - heat sink N 2010-03 2009 Application Note AN 2010-06 V2.0, February 2013 9 Mechanical loads (vibration and shock) The EconoPACK™ 4 modules exhibit a rugged construction, developed with a clear focus to offer the best mechanical robustness in the application. However, the maximum permissible values given in this application note for pull and push forces at the power terminals in chapter 8 as well as the press-in forces at the auxiliary terminals given in chapter 3.2 are values for a one-time mechanical load during the mounting process. The impacts of continuous mechanical loads on the module, especially generated by vibration or shock, strongly depend on the mechanical set-up of the inverter and the load profile in the application and can’t be specified in general. The ability of the modules for the operation under such specific mechanial loads has to be tested and qualified by the user in his mechanical set-up and using the specific mechanical load profile. 10 Storage and transportation of IGBT modules During transport and storage of the modules extreme forces by shock or vibration have to be avoided as well as extreme environmental influences. Storing the modules at the limits of the specified temperature in the data sheet is possible, however, not recommended. The recommended storage conditions according to TR14 should be assured fort he recommended storage time of maximum 2 years. If stored according to the recommended conditions, pre-drying of the module prior to the assembly process like recommended for moulded discrete components (e.g. microcontrollers, TO-cases etc.) is not required for EconoPACK™ 4 modules. 11 Climatic conditions during active, current carrying operation of EconoPACK™ 4 modules EconoPACK™ 4 modules are not hermetically sealed. The housings and the molding compound, used for the electrical isolation within the housing, are permeable for humidity and gases in both directions. Therefore humidity differences will be equalized in both directions. Corrosive gases must be avoided during operation and storage of the devices. The climatic conditions for Infineon EconoPACK™ 4 modules in active, current carrying operation are specified as per EN60721-3-3 class 3K3 for fixed installations. The operation of the modules in humid atmosphere caused by condensation and/or the operation in climatic conditions beyond class 3K3 of EN60721-3-3 must be avoided and additional countermeasures need to be taken in such cases. - 16 -