Data Sheet

PMBTA44
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
Rev. 01 — 22 February 2008
Product data sheet
1. Product profile
1.1 General description
NPN high-voltage low VCEsat Breakthrough In Small Signal (BISS) transistor in a
SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package.
1.2 Features
n Low current (max. 300 mA)
n High voltage (max. 400 V)
n AEC-Q101 qualified
1.3 Applications
n
n
n
n
n
n
LED driver for LED chain module
LCD backlighting
High Intensity Discharge (HID) front lighting
Automotive motor management
Hook switch for wired telecom
Switch mode power supply
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
-
-
400
V
IC
collector current
-
-
300
mA
hFE
DC current gain
VCE = 10 V; IC = 10 mA
50
-
200
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
2. Pinning information
Table 2.
Pinning
Pin
Description
1
base
2
emitter
3
collector
Simplified outline
Symbol
3
3
1
1
2
2
sym021
3. Ordering information
Table 3.
Ordering information
Type number
PMBTA44
Package
Name
Description
Version
-
plastic surface-mounted package; 3 leads
SOT23
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
PMBTA44
W3*
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
PMBTA44_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
2 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
500
V
VCEO
collector-emitter voltage
open base
-
400
V
VEBO
emitter-base voltage
open collector
-
6
V
IC
collector current
-
300
mA
ICM
peak collector current
single pulse;
tp ≤ 1 ms
-
300
mA
IBM
peak base current
single pulse;
tp ≤ 1 ms
-
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
-
250
mW
[1]
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−55
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
006aab196
300
Ptot
(mW)
200
100
0
−75
−25
25
75
125
175
Tamb (°C)
FR4 PCB, standard footprint
Fig 1. Power derating curve SOT23 (TO-236AB)
PMBTA44_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
3 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
[1]
Thermal characteristics
Parameter
Conditions
[1]
thermal resistance from junction to in free air
ambient
Min
Typ
Max
Unit
-
-
500
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
006aab151
103
duty cycle = 1
Zth(j-a)
(K/W)
0.75
0.5
102
0.33
0.2
0.1
0.05
10
1
0.02
0.01
0
10−1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for
SOT23 (TO-236AB)
PMBTA44_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
4 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
ICBO
Conditions
Min
Typ
Max
Unit
collector-base cut-off VCB = 320 V; IE = 0 A
current
VCB = 320 V; IE = 0 A;
Tj = 150 °C
-
-
100
nA
-
-
10
µA
IEBO
emitter-base cut-off
current
VEB = 4 V; IC = 0 A
-
-
100
nA
hFE
DC current gain
VCE = 10 V
IC = 10 mA
VCEsat
collector-emitter
saturation voltage
50
-
200
IC = 50 mA
[1]
45
-
-
IC = 100 mA
[1]
40
-
-
IC = 1 mA; IB = 0.1 mA
-
-
400
mV
IC = 10 mA; IB = 1 mA
-
-
500
mV
IC = 50 mA; IB = 5 mA
[1]
-
-
750
mV
[1]
-
-
850
mV
20
-
-
MHz
VBEsat
base-emitter
saturation voltage
IC = 10 mA; IB = 1 mA
fT
transition frequency
VCE = 10 V; IE = 10 mA;
f = 100 MHz
Cc
collector capacitance VCB = 20 V; IE = ie = 0 A;
f = 1 MHz
-
-
7
pF
Ce
emitter capacitance
-
-
180
pF
[1]
VEB = 0.5 V;
IC = ic = 0 A; f = 1 MHz
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMBTA44_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
5 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
006aab190
200
006aab191
0.3
IB (mA) = 26
hFE
IC
(A)
23.4 20.8
150
18.2
(1)
0.2
15.6
13
10.4
(2)
7.8
100
5.2
0.1
(3)
2.6
50
0
10−1
1
10
102
103
0
0
1
2
3
4
IC (mA)
5
VCE (V)
Tamb = 25 °C
VCE = 10 V
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 3. DC current gain as a function of collector
current; typical values
006aab192
1.2
VBE
(V)
Fig 4. Collector current as a function of
collector-emitter voltage; typical values
006aab193
1.2
VBEsat
(V)
(1)
0.8
(1)
0.8
(2)
(2)
(3)
(3)
0.4
0
10−1
0.4
1
10
102
103
0
10−1
1
VCE = 10 V
102
103
IC/IB = 5
(1) Tamb = −55 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
(3) Tamb = 100 °C
Fig 5. Base-emitter voltage as a function of collector
current; typical values
Fig 6. Base-emitter saturation voltage as a function of
collector current; typical values
PMBTA44_1
Product data sheet
10
IC (mA)
IC (mA)
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
6 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
006aab194
1
006aab195
103
RCEsat
(Ω)
VCEsat
(V)
102
10−1
10
(1)
(2)
(3)
(1)
(2)
(3)
1
10−2
10−1
1
10
102
103
10−1
10−1
1
IC (mA)
IC/IB = 5
102
103
IC (mA)
IC/IB = 5
(1) Tamb = 100 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(3) Tamb = −55 °C
Fig 7. Collector-emitter saturation voltage as a
function of collector current; typical values
Fig 8. Collector-emitter saturation resistance as a
function of collector current; typical values
PMBTA44_1
Product data sheet
10
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
7 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
3.0
2.8
1.1
0.9
3
0.45
0.15
2.5 1.4
2.1 1.2
1
2
1.9
0.48
0.38
Dimensions in mm
0.15
0.09
04-11-04
Fig 9. Package outline SOT23 (TO-236AB)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
PMBTA44
[1]
Package
SOT23
Description
4 mm pitch, 8 mm tape and reel
3000
10000
-215
-235
For further information and the availability of packing methods, see Section 14.
PMBTA44_1
Product data sheet
Packing quantity
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
8 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
11. Soldering
2.90
2.50
0.85
2
1
solder lands
1.30
3.00
2.70
0.85
solder resist
solder paste
3
occupied area
0.60
(3x)
Dimensions in mm
0.50 (3x)
0.60 (3x)
1.00
3.30
sot023
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
Dimensions in mm
2.80
preferred transport direction during soldering
4.50
sot023
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
PMBTA44_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
9 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMBTA44_1
20080222
Product data sheet
-
-
PMBTA44_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
10 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
PMBTA44_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 22 February 2008
11 of 12
PMBTA44
NXP Semiconductors
400 V, 0.3 A NPN high-voltage low VCEsat (BISS) transistor
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8
Quality information . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information. . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 22 February 2008
Document identifier: PMBTA44_1
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