LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only BIPOLAR TYPE LED LAMPS Pb Lead-Free Parts LUYHDGL3363/A DATA SHEET DOC. NO : QW0905- LUYHDGL3363/A REV. : A DATE : 18 - Aug.- 2014 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LUYHDGL3363/A Page 1/8 Package Dimensions 5.9 5.0 7.6 8.6 UYH 1.5MAX 25.0MIN □0.5 TYP DGL 1 2 1.0MIN 2.54TYP 1 2 Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60 ° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO.LUYHDGL3363/A Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT UYH DGL Forward Current IF 50 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 100 mA Power Dissipation PD 130 120 mW ESD 2000 Electrostatic Discharge( * ) V Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted Peak Dominant Spectral wave halfwidth wave length length △λ nm λPnm λDnm Lens AlGaInP/GaP Yellow Forward voltage @20mA(V) Luminous Viewing intensity angle @20mA(mcd) 2θ 1/2 (deg) Min. Typ. Max. Min. Typ. --- 590 15 1.7 2.6 2.6 450 700 20 --- 505 20 --- 3.5 4.2 450 900 20 Water Clear LUYHDGL3363/A InGaN Green Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUYHDGL3363/A Page 3/8 Brightness Code For Standard LED Lamps UYH CHIP Group Luminous Intensity(mcd) at 20 mA Min. Max. A18 450 550 A19 550 700 A20 700 900 A21 900 1100 A22 1100 1500 Color Code UYHCHIP Group Wave length(nm) at 20 mA Min. Max. 15 585 587 16 587 589 17 589 592 18 592 595 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/8 PART NO. LUYHDGL3363/A Brightness Code For Standard LED Lamps DGL CHIP Group Luminous Intensity(mcd) at 20 mA Min. Max. A18 450 550 A19 550 700 A20 700 900 A21 900 1100 A22 1100 1500 A23 1500 1800 Color Code DGL CHIP Group Wave length(nm) at 20 mA Min. Max. 1H 498 501 1I 501 504 1J 504 507 1K 507 510 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUYHDGL3363/A Page 5/8 Typical Electro-Optical Characteristics Curve UY(H) CHIP Fig.1 Forward Current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 500 Relative Intensity@20mA Normalize @25℃ 1.2 Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) Relative Intensity@20mA 100 650 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUYHDGL3363/A Page 6/8 Typical Electro-Optical Characteristics Curve DGL CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 450 500 550 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 600 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8 PART NO.LUYHDGL3363/A Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 ° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 120seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 120 Seconds Max 100 200 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 250 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LUYHDGL3363/A Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11