LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA112B/Y.WK-PF DATA SHEET DOC. NO : QW0905-LA 112B/Y.WK-PF REV. : A DATE : 26 - Nov.- 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO. LA112B/Y.WK-PF Package Dimensions 2.5±0.5 4.3 8.2 Ø3.2*2 Y 2.9 Ø2.9*2 5.0 9.6 WK 2.65 3.2±0.3 □0.5 TYP 4.45± 0.5 2.54TYP + 6.99± 0.5 LY2640-1-PF LWK2642 2.9 3.3 3.1 4.3 1.5MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/7 PART NO.LA112B/Y.WK-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT Y WK Forward Current IF 20 30 mA Peak Forward Current Duty 1/10@10KHz IFP 80 100 mA Power Dissipation PD 60 120 mW Ir 10 50 μA Electrostatic Discharge( * ) ESD ----- 150 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted LA112B/Y.WK-PF GaAsP/GaP Yellow PART NO Lens Yellow Diffused COLOR MATERIAL Emitted LA112B/Y.WK-PF Forward Peak Spectral voltage wave halfwidth length △λ nm @20mA(V) λPnm InGaN/GaN White Lens White Diffused Luminous intensity Viewing angle @ 10 mA(mcd) 2θ 1/2 (deg) Min. Max. Min. 585 35 1.7 Chromaticity Coordinates ( Typ. ) X Y 0.28 0.28 2.6 8.0 Typ. 12 50 Forward Luminous Viewing voltage intensity angle @20mA(V) @20mA(mcd) 2θ 1/2 (deg) Typ. Max. Min. 3.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 4.0 Typ. 550 1100 46 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO.LA112B/Y.WK-PF . Chromaticity Coordinates Specifications for Bin Grading BIN A1 A2 A3 A4 A5 X Y 0.21 0.190 0.21 0.150 0.22 0.165 0.22 0.205 0.22 0.205 0.22 0.165 0.23 0.180 0.23 0.220 0.23 0.220 0.23 0.180 0.24 0.195 0.24 0.235 0.24 0.235 0.24 0.195 0.25 0.210 0.25 X Y 0.26 0.265 0.26 0.225 0.27 0.240 0.27 0.280 0.27 0.280 0.27 0.240 0.28 0.255 0.28 0.295 0.33 0.370 0.28 0.295 0.33 0.370 0.28 0.255 0.33 0.330 0.29 0.270 0.34 0.345 0.29 0.310 0.34 0.385 0.29 0.310 0.34 0.385 0.29 0.270 0.34 0.345 0.30 0.285 0.35 0.360 0.250 0.30 0.325 0.35 0.400 0.25 0.250 0.30 0.325 0.25 0.210 0.30 0.285 0.26 0.225 0.31 0.300 0.26 0.265 0.31 0.340 . CIE Chromaticity Diagram BIN B1 B2 B3 B4 B5 BIN C1 C2 C3 C4 X Y 0.31 0.340 0.31 0.300 0.32 0.315 0.32 0.355 0.32 0.355 0.32 0.315 0.33 0.330 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LA112B/Y.WK-PF Page 4/7 Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 650 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) 500 1000 Forward Current(mA) Forward Voltage(V) -40 100 700 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LA112B/Y.WK-PF Page 5/7 Typical Electro-Optical Characteristics Curve WK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 SPECTRAL RADIANCE 100 Intensity 80 60 40 20 0 600 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80 Ambient Temperature( ℃) Fig.5 Luminous Spectrum(Ta=25 ℃) 500 3.0 -40 Ambient Temperature( ℃) 400 1000 Forward Current(mA) Forward Voltage(V) -40 100 800 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 PART NO.LA112B/Y.WK-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7 PART NO.LA112B/Y.WK-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃ &-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11