LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC FPT-80P-M21 80-pin plastic LQFP (FPT-80P-M21) 80-pin plastic LQFP (FPT-80P-M21) Lead pitch 0.50 mm Package width × package length 12 mm × 12 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max Weight 0.47 g Code (Reference) P-LFQFP80-12×12-0.50 Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 14.00±0.20(.551±.008)SQ * 12.00±0.10(.472±.004)SQ 60 0.145±0.055 (.006±.002) 41 61 40 0.08(.003) Details of "A" part +0.20 1.50 –0.10 +.008 .059 –.004 INDEX 0˚~8˚ 80 0.10±0.05 (.004±.002) (Stand off) 21 "A" LEAD No. 1 20 0.50(.020) C (Mounting height) 2006 FUJITSU LIMITED F80035S-c-2-2 0.20±0.05 (.008±.002) 0.08(.003) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.25(.010) M Dimensions in mm (inches). Note: The values in parentheses are reference values The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0603