LOW PROFILE QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC FPT-176P-M07 176-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 24.0 × 24.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Code (Reference) P-LQFP-0176-2424-0.50 (FPT-176P-M07) 176-pin plastic LQFP (FPT-176P-M07) Note 1) * : Values do not include resin protrusion. Resin protrusion is +0.25(.010)Max(each side). Note 2) Pins width and pins thickness include plating thickness Note 3) Pins width do not include tie bar cutting remainder. 26.00±0.20(1.024±.008)SQ *24.00±0.10(.945±.004)SQ 0.145±0.055 (.006±.002) 132 89 133 88 0.08(.003) Details of "A" part +0.20 1.50 –0.10 +.008 (Mounting height) .059 –.004 0˚~8˚ 0.10±0.10 (.004±.004) (Stand off) INDEX 176 45 "A" LEAD No. 1 44 0.50(.020) C 2004 FUJITSU LIMITED F176013S-c-1-1 0.22±0.05 (.009±.002) 0.08(.003) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.25(.010) M Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0402