KSMD13N15 KERSMI ELECTRONIC CO.,LTD. 150V N-channel MOSFET Description This N-channel MOSFETS use advanced trench technology and design to provide excellent RDS(on) with low gate charge. It can be used in a wide variety of applications. Features BVDSS 150V 1) 2) 3) 4) RDSON ID 14A 0.18Ω Low gate charge. Green device available. Advanced high cell denity trench technology for ultra RDS(ON) Excellent package for good heat dissipation. TO-252 Absolute Maximum Ratings TC=25℃,unless otherwise noted Symbol Parameter Ratings Units VDS Drain-Source Voltage 150 VGS Gate-Source Voltage ±20 V V Continuous Drain Current-1 9.8 Continuous Drain Current-T=100℃ 56 Pulsed Drain Current2 86 EAS Single Pulse Avalanche Energy3 — PD Power Dissipation4 86 TJ, TSTG Operating and Storage Junction Temperature Range -55 to +175 ℃ Ratings Units ID A mJ W Thermal Characteristics Symbol Parameter RƟJC Thermal Resistance ,Junction to Case1 — RƟJA Thermal Resistance, Junction to Ambient1 — www.kersemi.com ℃/W 1 KSMD13N15 KERSMI ELECTRONIC CO.,LTD. 150V N-channel MOSFET Package Marking and Ordering Information Part NO. Marking Package KSMD13N15 KSMD13N15 TO-252 Electrical Characteristics TC=25℃ Symbol Parameter unless otherwise noted Conditions Min Typ Max Units Off Characteristics BVDSS Drain-Sourtce Breakdown Voltage VDS=0V,ID=250μA 150 — — IDSS Zero Gate Voltage Drain Current VDS=0V, VDS=32V — — 2 IGSS Gate-Source Leakage Current VDS=±20V, VDS=0A — — ±100 v μA nA VDS=VDS, ID=250μA 3.0 — 5.5 V VDS=10V,ID=6A — — 0.18 VDS=2.5V,ID=5A — — — VDS=5V,ID=12A 5.0 — — — 620 — — 130 — — 38 — — 8.0 — — 26 — — 12 — — 11 — On Characteristics VGS(th) GATE-Source Threshold Voltage RDS(ON) Drain-Source On Resistance² GFS Forward Transconductance Ω S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS=15V,VGS=0V, f=1MHz pF Switching Characteristics — 19 29 Gate-SourceCharge VGS=4.5V, VDS=20V, — 5.5 8.2 Gate-Drain “Miller” Charge ID=6A — 9.4 14 ns ns ns ns nC nC nC — — 1.3 V — 110 — ns — 520 — nC td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qgs Qgd VDS=20V, VGS=10V,RGEN=3.3Ω Drain-Source Diode Characteristics VSD Source-Drain Diode ForwardVoltage² trr Reverse Recovery Time Qrr Reverse Recovery Charge VGS=0V,IS =1A IF=7A,di/dt=100A/μS Notes: www.kersemi.com 2 KSMD13N15 KERSMI ELECTRONIC CO.,LTD. 150V N-channel MOSFET 1. The data tested by surface mounted on a 1 inch²FR-4 board 2OZ copper. 2. The data tested by pulse width≤300us,duty cycle≤2% 3. The EAS data shows Max.rating.The test condition is VDD=25v,VGS=10V,L=0.1mH,iAS=17.8A 4. The power dissipation is limited by 150℃ junction temperature. Typical Characteristics TJ=25℃ Fig 1. Typical Output Characteristics Fig 3. Typical Transfer Characteristics unless otherwise noted Fig 2. Typical Output Characteristics Fig 4. Normalized On-Resistance Vs. Temperature www.kersemi.com 3 KSMD13N15 KERSMI ELECTRONIC CO.,LTD. 150V N-channel MOSFET Fig 5. Typical Capacitance vs. Drain-to-Source Voltage Fig 7. Typical Source-Drain Diode Forward Voltage Fig 6. Typical Gate Charge vs. Drain-to-Source Voltage Fig 8. Maximum Safe Operating Area Fig 9. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.kersemi.com 4