BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Rev. 9 — 18 March 2015 Product data sheet 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package NXP Configuration JEITA 1PS70SB40 SOT323 SC-70 single diode 1PS76SB40 SOD323 SC-76 single diode 1PS79SB40 SOD523 SC-79 single diode BAS40 SOT23 - single diode BAS40H SOD123F - single diode BAS40L SOD882 - single diode BAS40W SOT323 SC-70 single diode 1PS70SB44 SOT323 SC-70 dual series BAS40-04 SOT23 - dual series BAS40-04W SOT323 SC-70 dual series 1PS70SB45 SOT323 SC-70 dual common cathode 1PS75SB45 SOT416 SC-75 dual common cathode BAS40-05 SOT23 - dual common cathode BAS40-05W SOT323 SC-70 dual common cathode 1PS70SB46 SOT323 SC-70 dual common anode BAS40-06 SOT23 - dual common anode BAS40-06W SOT323 SC-70 dual common anode BAS40-07 SOT143B - dual isolated BAS40-07V SOT666 - dual isolated BAS40-05V SOT666 - quadruple common cathode/ common cathode 1PS88SB48 SOT363 SC-88 quadruple common cathode/ common cathode BAS40XY SOT363 SC-88 quadruple; 2 series BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 1.2 Features and benefits High switching speed High breakdown voltage AEC-Q101 qualified Low leakage current Low capacitance 1.3 Applications Ultra high-speed switching Voltage clamping 1.4 Quick reference data Table 2. Symbol Quick reference data Parameter Conditions Min Typ Max Unit - - 120 mA Per diode forward current IF VF forward voltage VR reverse voltage [1] [1] IF = 1 mA - - 380 mV - - 40 V Pulse test: tp 300 s; 0.02. 2. Pinning information Table 3. Pin Pinning Description Simplified outline Symbol BAS40H; 1PS76SB40; 1PS79SB40 1 cathode 2 anode [1] 1 1 2 2 sym001 001aab540 BAS40L 1 cathode 2 anode [1] 1 1 2 2 sym001 Transparent top view BAS40; BAS40W; 1PS70SB40 1 anode 2 not connected 3 cathode 3 3 1 2 n.c. 006aaa436 1 2 006aaa144 BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes Table 3. Pinning …continued Pin Description Simplified outline Symbol BAS40-04; BAS40-04W; 1PS70SB44 1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1), anode (diode 2) 3 3 1 2 006aaa437 1 2 006aaa144 BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45 1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1), cathode (diode 2) 3 3 1 2 1 2 006aaa144 006aaa438 BAS40-06; BAS40-06W; 1PS70SB46 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1), anode (diode 2) 3 3 1 2 006aaa439 1 2 006aaa144 BAS40-07 1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 2) 4 anode (diode 1) 4 1 3 4 2 1 3 2 006aaa434 BAS40-07V 1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 BAS40_1PSXXSB4X_SER Product data sheet cathode (diode 1) All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 6 5 4 1 2 3 6 5 4 1 2 3 006aaa440 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 22 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Table 3. Pin Pinning …continued Description Simplified outline Symbol BAS40-05V; 1PS88SB48 1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 3), cathode (diode 4) 4 anode (diode 3) 5 anode (diode 4) 6 6 5 1 2 4 6 5 1 2 4 3 001aab555 3 006aaa446 cathode (diode 1), cathode (diode 2) BAS40XY 1 anode (diode 1) 2 cathode (diode 2) 3 anode (diode 3), cathode (diode 4) 4 anode (diode 4) 5 cathode (diode 3) 6 cathode (diode 1), anode (diode 2) [1] BAS40_1PSXXSB4X_SER Product data sheet 6 5 4 1 2 3 6 5 4 1 2 3 006aaa256 The marking bar indicates the cathode. All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 3. Ordering information Table 4. Ordering information Type number BAS40_1PSXXSB4X_SER Product data sheet Package Name Description Version 1PS70SB40 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS76SB40 SC-76 plastic surface-mounted package; 2 leads SOD323 1PS79SB40 SC-79 plastic surface-mounted package; 2 leads SOD523 BAS40 - plastic surface-mounted package; 3 leads SOT23 BAS40H - plastic surface-mounted package; 2 leads SOD123F BAS40L - leadless ultra small plastic package; 2 terminals; body 1.0 0.6 0.5 mm SOD882 BAS40W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB44 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-04 - plastic surface-mounted package; 3 leads SOT23 BAS40-04W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB45 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS75SB45 SC-75 plastic surface-mounted package; 3 leads SOT416 BAS40-05 - plastic surface-mounted package; 3 leads SOT23 BAS40-05W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB46 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-06 - plastic surface-mounted package; 3 leads SOT23 BAS40-06W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-07 - plastic surface-mounted package; 4 leads SOT143B BAS40-07V - plastic surface-mounted package; 6 leads SOT666 BAS40-05V - plastic surface-mounted package; 6 leads SOT666 1PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT363 BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT363 All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 4. Marking Table 5. Marking codes Type number Marking code[1] Type number Marking code[1] 1PS70SB40 6*3 1PS75SB45 45 1PS76SB40 S4 BAS40-05 45* 1PS79SB40 T BAS40-05W 65* BAS40 43* 1PS70SB46 6*6 BAS40H AJ BAS40-06 46* BAS40L S6 BAS40-06W 66* BAS40W 63* BAS40-07 47* 1PS70SB44 6*4 BAS40-07V 67 BAS40-04 44* BAS40-05V 65 BAS40-04W 64* 1PS88SB48 8*5 1PS70SB45 6*5 BAS40XY 40* [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VR reverse voltage - 40 V IF forward current - 120 mA IFRM repetitive peak forward current tp 1 s; 0.5 - 120 mA IFSM non-repetitive peak forward current tp 10 ms - 200 mA Tj junction temperature - 150 C Tamb ambient temperature 65 +150 C Tstg storage temperature 65 +150 C [1] BAS40_1PSXXSB4X_SER Product data sheet [1] Tj = 25 C prior to surge. All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 22 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 6. Thermal characteristics Table 7. Symbol Thermal characteristics Parameter Conditions Min Typ Max Unit thermal resistance from junction to ambient in free air SOT23 - - 500 K/W SOT143B - - 500 K/W SOT363 (1PS88SB48) - - 416 K/W Per device Rth(j-a) [1] SOT416 - - 833 K/W SOT666 (BAS40-05V) [2] - - 225 K/W SOT666 (BAS40-07V) [2] - - 416 K/W SOD123F [2] - - 330 K/W - - 450 K/W SOD523 [2] - - 450 K/W SOD882 [2] - - 500 K/W - - 625 K/W - - 260 K/W SOD323 SOT323 Rth(j-sp) thermal resistance from junction to solder point [3] SOT363 (BAS40XY) [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6. 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IF = 1 mA - - 380 mV IF = 10 mA - - 500 mV Per diode VF IR Cd [1] BAS40_1PSXXSB4X_SER Product data sheet [1] forward voltage reverse current diode capacitance IF = 40 mA - - 1 V VR = 30 V - - 1 A VR = 40 V - - 10 A VR = 0 V; f = 1 MHz - - 5 pF Pulse test: tp 300 s; 0.02. All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes mlc361 102 mlc362 103 IR (μA) IF (mA) (1) 102 10 10 (1) (2) (3) (4) (2) 1 1 10−1 10−1 (3) 10−2 0 0.2 0.4 0.6 0.8 VF (V) 1 10−2 0 10 (1) Tamb = 125 C (1) Tamb = 125 C (2) Tamb = 85 C (2) Tamb = 85 C (3) Tamb = 25 C (3) Tamb = 25 C 20 30 VR (V) 40 (4) Tamb = 40 C Fig 1. Forward current as a function of forward voltage; typical values Fig 2. mlc364 103 Reverse current as a function of reverse voltage; typical values mlc363 5 Cd (pF) rdif (Ω) 4 102 3 2 10 1 1 10−1 1 10 IF (mA) 0 102 0 Differential resistance as a function of forward current; typical values BAS40_1PSXXSB4X_SER Product data sheet 20 30 VR (V) 40 Tamb = 25 C; f = 1 MHz f = 10 kHz Fig 3. 10 Fig 4. Diode capacitance as a function of reverse voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 1.35 1.15 0.45 0.15 1 2.7 2.3 0.85 0.75 1.1 0.8 1 1.65 1.25 1.55 1.15 1.8 1.6 2 2 0.40 0.25 0.25 0.10 Dimensions in mm Fig 5. 0.65 0.58 0.34 0.26 03-12-17 Package outline SOD323 (SC-76) 3.0 2.8 0.17 0.11 Dimensions in mm Fig 6. 02-12-13 Package outline SOD523 (SC-79) 1.7 1.5 1.1 0.9 1.2 1.0 1 3 0.55 0.35 0.45 0.15 2.5 1.4 2.1 1.2 3.6 3.4 1 2 1.9 0.48 0.38 Dimensions in mm Fig 7. Product data sheet 2 0.15 0.09 04-11-04 Package outline SOT23 (TO-236AB) BAS40_1PSXXSB4X_SER 2.7 2.5 0.70 0.55 0.25 0.10 Dimensions in mm Fig 8. 04-11-29 Package outline SOD123F All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.2 1.8 0.50 0.46 0.62 0.55 1.1 0.8 0.45 0.15 3 2 0.30 0.22 1.02 0.95 0.65 0.30 0.22 1 1 0.55 0.47 0.4 0.3 0.25 0.10 1.3 03-04-17 Package outline SOD882 Dimensions in mm 04-11-04 Fig 10. Package outline SOT323 (SC-70) 3.0 2.8 2.2 1.8 1.1 0.9 1.9 4 2.5 2.1 2 cathode marking on top side (if applicable) Dimensions in mm Fig 9. 2.2 1.35 2.0 1.15 6 3 1.1 0.8 5 4 2 3 0.45 0.15 0.45 0.15 1.4 1.2 2.2 1.35 2.0 1.15 1 pin 1 index 2 0.88 0.78 0.48 0.38 1 0.15 0.09 1.7 1.3 Dimensions in mm 04-11-16 Fig 11. Package outline SOT143B Dimensions in mm 14-10-03 Fig 12. Package outline SOT363 (SC-88) 1.7 1.5 0.95 0.60 1.8 1.4 3 0.25 0.10 0.3 0.2 0.65 6 0.45 0.15 0.6 0.5 5 4 0.3 0.1 1.75 0.9 1.45 0.7 1.7 1.5 1.3 1.1 pin 1 index 1 2 1 0.30 0.15 0.25 0.10 0.27 0.17 0.18 0.08 1 Dimensions in mm 04-11-04 Fig 13. Package outline SOT416 (SC-75) Product data sheet 3 0.5 1 BAS40_1PSXXSB4X_SER 2 Dimensions in mm 04-11-08 Fig 14. Package outline SOT666 All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 4000 8000 10000 1PS70SB40 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS76SB40 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS79SB40 SOD523 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40L SOD882 2 mm pitch, 8 mm tape and reel - - - -315 BAS40W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB44 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB45 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS75SB45 SOT416 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS70SB46 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - BAS40-05V SOT666 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel 1PS88SB48 BAS40XY BAS40_1PSXXSB4X_SER Product data sheet SOT363 SOT363 - -115 - - 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165 [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 11. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Dimensions in mm Fig 15. Reflow soldering footprint SOD323 (SC-76) 5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20 msa415 preferred transport direction during soldering Dimensions in mm Fig 16. Wave soldering footprint SOD323 (SC-76) 2.15 0.50 0.60 1.20 solder lands solder paste 0.30 0.40 solder resist occupied area 1.80 1.90 mgs343 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 17. Reflow soldering footprint SOD523 (SC-79) BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.90 2.50 solder lands solder resist 2 0.85 1 2.70 1.30 3.00 0.85 3 occupied area solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm Fig 18. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 1 4.60 4.00 1.20 3 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 19. Wave soldering footprint SOT23 (TO-236AB) BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 13 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F 1.30 R = 0.05 (8×) 0.30 0.60 0.70 0.80 (2×) (2×) (2×) 0.90 solder lands solder paste solder resist R = 0.05 (8×) 0.30 (2×) 0.40 (2×) 0.50 (2×) occupied area mbl872 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 21. Reflow soldering footprint SOD882 BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 14 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.60 2.35 0.85 (3×) 0.50 (3×) 1.90 3 solder resist occupied area 1 Dimensions in mm 0.55 (3×) 2.40 msa429 Fig 22. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3.65 2.10 3 2.70 solder lands 1 0.90 (2×) solder resist occupied area Dimensions in mm preferred transport direction during soldering msa419 Fig 23. Wave soldering footprint SOT323 (SC-70) BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 15 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 3.25 0.60 (3x) 0.50 (3x) solder lands 0.60 (4x) solder resist 4 3 2.70 occupied area 1.30 3.00 1 2 solder paste msa441 0.90 1.00 2.50 Dimensions in mm Fig 24. Reflow soldering footprint SOT143B 4.45 1.20 (3×) 4 3 1.15 4.00 4.60 solder lands 1 solder resist 2 occupied area Dimensions in mm 1.00 3.40 preferred transport direction during soldering msa422 Fig 25. Wave soldering footprint SOT143B BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 16 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.65 solder lands 2.35 1.5 0.4 (2×) 0.6 0.5 (4×) (4×) solder resist solder paste 0.5 (4×) 0.6 (2×) occupied area 0.6 (4×) Dimensions in mm 1.8 sot363_fr Fig 26. Reflow soldering footprint SOT363 (SC-88) 1.5 solder lands 0.3 2.5 4.5 solder resist occupied area 1.5 Dimensions in mm 1.3 1.3 preferred transport direction during soldering 2.45 5.3 sot363_fw Fig 27. Wave soldering footprint SOT363 (SC-88) BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 17 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 2.2 0.6 1.1 0.7 2 2.0 3 0.85 1.5 1 0.6 (3x) 1.9 0.5 (3x) msa438 solder lands solder resist Dimensions in mm solder paste occupied area Fig 28. Reflow soldering footprint SOT416 2.75 2.45 2.1 1.6 solder lands 0.4 (6×) 0.25 (2×) 0.538 2 1.7 1.075 0.3 (2×) 0.55 (2×) placement area solder paste occupied area 0.325 0.375 (4×) (4×) Dimensions in mm 1.7 0.45 (4×) 0.6 (2×) 0.5 (4×) 0.65 (2×) sot666_fr Reflow soldering is the only recommended soldering method. Fig 29. Reflow soldering footprint SOT666 BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 18 of 22 BAS40 series; 1PSxxSB4x series NXP Semiconductors General-purpose Schottky diodes 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BAS40_1PSXXSB4X_SER v.9 20150318 Product data sheet - BAS40_1PSXXSB4X_SER_8 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. BAS40_1PSXXSB4X_SER_8 20100113 Product data sheet - BAS40_1PSXXSB4X_SER_7 BAS40_1PSXXSB4X_SER_7 20060512 Product data sheet - BAS40_1PSXXSB4X_SER_6 BAS40_1PSXXSB4X_SER_6 20050809 Product data sheet - 1PS70SB40_3 1PS75SB45_2 1PS76SB40_3 1PS79SB40_2 1PS88SB48_3 BAS40H_1 BAS40L_1 BAS40-05V_1 BAS40-07V_1 BAS40W_3 BAS40_SERIES_5 1PS70SB40_3 19990426 Product specification - 1PS70SB40_2 1PS75SB45_2 19990426 Product specification - 1PS75SB45_1 1PS76SB40_3 20040126 Product specification - 1PS76SB40_2 1PS79SB40_2 19990426 Product specification - 1PS79SB40_1 1PS88SB48_3 20021107 Product specification - 1PS88SB48_2 BAS40H_1 20050425 Product data sheet - - BAS40L_1 20030520 Product specification - - BAS40-05V_1 20021121 Product specification - - BAS40-07V_1 20020327 Product specification - - BAS40W_3 19990426 Product specification - BAS40W_2 BAS40_SERIES_5 20011010 Product specification - BAS40_4 BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 19 of 22 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BAS40_1PSXXSB4X_SER Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 20 of 22 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAS40_1PSXXSB4X_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 March 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 21 of 22 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information . . . . . . . . . . . . . . . . . . . . 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information. . . . . . . . . . . . . . . . . . . . . 21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 18 March 2015 Document identifier: BAS40_1PSXXSB4X_SER