Data Sheet

BAS40 series;
1PSxxSB4x series
General-purpose Schottky diodes
Rev. 9 — 18 March 2015
Product data sheet
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
Table 1.
Product overview
Type number
Package
NXP
Configuration
JEITA
1PS70SB40
SOT323
SC-70
single diode
1PS76SB40
SOD323
SC-76
single diode
1PS79SB40
SOD523
SC-79
single diode
BAS40
SOT23
-
single diode
BAS40H
SOD123F
-
single diode
BAS40L
SOD882
-
single diode
BAS40W
SOT323
SC-70
single diode
1PS70SB44
SOT323
SC-70
dual series
BAS40-04
SOT23
-
dual series
BAS40-04W
SOT323
SC-70
dual series
1PS70SB45
SOT323
SC-70
dual common cathode
1PS75SB45
SOT416
SC-75
dual common cathode
BAS40-05
SOT23
-
dual common cathode
BAS40-05W
SOT323
SC-70
dual common cathode
1PS70SB46
SOT323
SC-70
dual common anode
BAS40-06
SOT23
-
dual common anode
BAS40-06W
SOT323
SC-70
dual common anode
BAS40-07
SOT143B
-
dual isolated
BAS40-07V
SOT666
-
dual isolated
BAS40-05V
SOT666
-
quadruple common cathode/
common cathode
1PS88SB48
SOT363
SC-88
quadruple common cathode/
common cathode
BAS40XY
SOT363
SC-88
quadruple; 2 series
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
1.2 Features and benefits
 High switching speed
 High breakdown voltage
 AEC-Q101 qualified
 Low leakage current
 Low capacitance
1.3 Applications
 Ultra high-speed switching
 Voltage clamping
1.4 Quick reference data
Table 2.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
-
-
120
mA
Per diode
forward current
IF
VF
forward voltage
VR
reverse voltage
[1]
[1]
IF = 1 mA
-
-
380
mV
-
-
40
V
Pulse test: tp  300 s;   0.02.
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Symbol
BAS40H; 1PS76SB40; 1PS79SB40
1
cathode
2
anode
[1]
1
1
2
2
sym001
001aab540
BAS40L
1
cathode
2
anode
[1]
1
1
2
2
sym001
Transparent
top view
BAS40; BAS40W; 1PS70SB40
1
anode
2
not connected
3
cathode
3
3
1
2
n.c.
006aaa436
1
2
006aaa144
BAS40_1PSXXSB4X_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
Table 3.
Pinning …continued
Pin
Description
Simplified outline
Symbol
BAS40-04; BAS40-04W; 1PS70SB44
1
anode (diode 1)
2
cathode (diode 2)
3
cathode (diode 1),
anode (diode 2)
3
3
1
2
006aaa437
1
2
006aaa144
BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45
1
anode (diode 1)
2
anode (diode 2)
3
cathode (diode 1),
cathode (diode 2)
3
3
1
2
1
2
006aaa144
006aaa438
BAS40-06; BAS40-06W; 1PS70SB46
1
cathode (diode 1)
2
cathode (diode 2)
3
anode (diode 1),
anode (diode 2)
3
3
1
2
006aaa439
1
2
006aaa144
BAS40-07
1
cathode (diode 1)
2
cathode (diode 2)
3
anode (diode 2)
4
anode (diode 1)
4
1
3
4
2
1
3
2
006aaa434
BAS40-07V
1
anode (diode 1)
2
not connected
3
cathode (diode 2)
4
anode (diode 2)
5
not connected
6
BAS40_1PSXXSB4X_SER
Product data sheet
cathode (diode 1)
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 March 2015
6
5
4
1
2
3
6
5
4
1
2
3
006aaa440
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NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
Table 3.
Pin
Pinning …continued
Description
Simplified outline
Symbol
BAS40-05V; 1PS88SB48
1
anode (diode 1)
2
anode (diode 2)
3
cathode (diode 3),
cathode (diode 4)
4
anode (diode 3)
5
anode (diode 4)
6
6
5
1
2
4
6
5
1
2
4
3
001aab555
3
006aaa446
cathode (diode 1),
cathode (diode 2)
BAS40XY
1
anode (diode 1)
2
cathode (diode 2)
3
anode (diode 3),
cathode (diode 4)
4
anode (diode 4)
5
cathode (diode 3)
6
cathode (diode 1),
anode (diode 2)
[1]
BAS40_1PSXXSB4X_SER
Product data sheet
6
5
4
1
2
3
6
5
4
1
2
3
006aaa256
The marking bar indicates the cathode.
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
4 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
3. Ordering information
Table 4.
Ordering information
Type number
BAS40_1PSXXSB4X_SER
Product data sheet
Package
Name
Description
Version
1PS70SB40
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS76SB40
SC-76
plastic surface-mounted package; 2 leads
SOD323
1PS79SB40
SC-79
plastic surface-mounted package; 2 leads
SOD523
BAS40
-
plastic surface-mounted package; 3 leads
SOT23
BAS40H
-
plastic surface-mounted package; 2 leads
SOD123F
BAS40L
-
leadless ultra small plastic package; 2 terminals;
body 1.0  0.6  0.5 mm
SOD882
BAS40W
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS70SB44
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS40-04
-
plastic surface-mounted package; 3 leads
SOT23
BAS40-04W
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS70SB45
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS75SB45
SC-75
plastic surface-mounted package; 3 leads
SOT416
BAS40-05
-
plastic surface-mounted package; 3 leads
SOT23
BAS40-05W
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS70SB46
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS40-06
-
plastic surface-mounted package; 3 leads
SOT23
BAS40-06W
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS40-07
-
plastic surface-mounted package; 4 leads
SOT143B
BAS40-07V
-
plastic surface-mounted package; 6 leads
SOT666
BAS40-05V
-
plastic surface-mounted package; 6 leads
SOT666
1PS88SB48
SC-88
plastic surface-mounted package; 6 leads
SOT363
BAS40XY
SC-88
plastic surface-mounted package; 6 leads
SOT363
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
4. Marking
Table 5.
Marking codes
Type number
Marking code[1]
Type number
Marking code[1]
1PS70SB40
6*3
1PS75SB45
45
1PS76SB40
S4
BAS40-05
45*
1PS79SB40
T
BAS40-05W
65*
BAS40
43*
1PS70SB46
6*6
BAS40H
AJ
BAS40-06
46*
BAS40L
S6
BAS40-06W
66*
BAS40W
63*
BAS40-07
47*
1PS70SB44
6*4
BAS40-07V
67
BAS40-04
44*
BAS40-05V
65
BAS40-04W
64*
1PS88SB48
8*5
1PS70SB45
6*5
BAS40XY
40*
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per diode
VR
reverse voltage
-
40
V
IF
forward current
-
120
mA
IFRM
repetitive peak forward
current
tp  1 s;   0.5
-
120
mA
IFSM
non-repetitive peak forward
current
tp  10 ms
-
200
mA
Tj
junction temperature
-
150
C
Tamb
ambient temperature
65
+150
C
Tstg
storage temperature
65
+150
C
[1]
BAS40_1PSXXSB4X_SER
Product data sheet
[1]
Tj = 25 C prior to surge.
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
6. Thermal characteristics
Table 7.
Symbol
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance from
junction to ambient
in free air
SOT23
-
-
500
K/W
SOT143B
-
-
500
K/W
SOT363 (1PS88SB48)
-
-
416
K/W
Per device
Rth(j-a)
[1]
SOT416
-
-
833
K/W
SOT666 (BAS40-05V)
[2]
-
-
225
K/W
SOT666 (BAS40-07V)
[2]
-
-
416
K/W
SOD123F
[2]
-
-
330
K/W
-
-
450
K/W
SOD523
[2]
-
-
450
K/W
SOD882
[2]
-
-
500
K/W
-
-
625
K/W
-
-
260
K/W
SOD323
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
[3]
SOT363 (BAS40XY)
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF = 1 mA
-
-
380
mV
IF = 10 mA
-
-
500
mV
Per diode
VF
IR
Cd
[1]
BAS40_1PSXXSB4X_SER
Product data sheet
[1]
forward voltage
reverse current
diode capacitance
IF = 40 mA
-
-
1
V
VR = 30 V
-
-
1
A
VR = 40 V
-
-
10
A
VR = 0 V; f = 1 MHz
-
-
5
pF
Pulse test: tp  300 s;   0.02.
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
mlc361
102
mlc362
103
IR
(μA)
IF
(mA)
(1)
102
10
10
(1)
(2)
(3)
(4)
(2)
1
1
10−1
10−1
(3)
10−2
0
0.2
0.4
0.6
0.8
VF (V)
1
10−2
0
10
(1) Tamb = 125 C
(1) Tamb = 125 C
(2) Tamb = 85 C
(2) Tamb = 85 C
(3) Tamb = 25 C
(3) Tamb = 25 C
20
30
VR (V)
40
(4) Tamb = 40 C
Fig 1.
Forward current as a function of forward
voltage; typical values
Fig 2.
mlc364
103
Reverse current as a function of reverse
voltage; typical values
mlc363
5
Cd
(pF)
rdif
(Ω)
4
102
3
2
10
1
1
10−1
1
10
IF (mA)
0
102
0
Differential resistance as a function of forward
current; typical values
BAS40_1PSXXSB4X_SER
Product data sheet
20
30
VR (V)
40
Tamb = 25 C; f = 1 MHz
f = 10 kHz
Fig 3.
10
Fig 4.
Diode capacitance as a function of reverse
voltage; typical values
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
1.35
1.15
0.45
0.15
1
2.7
2.3
0.85
0.75
1.1
0.8
1
1.65 1.25
1.55 1.15
1.8
1.6
2
2
0.40
0.25
0.25
0.10
Dimensions in mm
Fig 5.
0.65
0.58
0.34
0.26
03-12-17
Package outline SOD323 (SC-76)
3.0
2.8
0.17
0.11
Dimensions in mm
Fig 6.
02-12-13
Package outline SOD523 (SC-79)
1.7
1.5
1.1
0.9
1.2
1.0
1
3
0.55
0.35
0.45
0.15
2.5 1.4
2.1 1.2
3.6
3.4
1
2
1.9
0.48
0.38
Dimensions in mm
Fig 7.
Product data sheet
2
0.15
0.09
04-11-04
Package outline SOT23 (TO-236AB)
BAS40_1PSXXSB4X_SER
2.7
2.5
0.70
0.55
0.25
0.10
Dimensions in mm
Fig 8.
04-11-29
Package outline SOD123F
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Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.2
1.8
0.50
0.46
0.62
0.55
1.1
0.8
0.45
0.15
3
2
0.30
0.22
1.02
0.95
0.65
0.30
0.22
1
1
0.55
0.47
0.4
0.3
0.25
0.10
1.3
03-04-17
Package outline SOD882
Dimensions in mm
04-11-04
Fig 10. Package outline SOT323 (SC-70)
3.0
2.8
2.2
1.8
1.1
0.9
1.9
4
2.5
2.1
2
cathode marking on top side (if applicable)
Dimensions in mm
Fig 9.
2.2 1.35
2.0 1.15
6
3
1.1
0.8
5
4
2
3
0.45
0.15
0.45
0.15
1.4
1.2
2.2 1.35
2.0 1.15
1
pin 1
index
2
0.88
0.78
0.48
0.38
1
0.15
0.09
1.7
1.3
Dimensions in mm
04-11-16
Fig 11. Package outline SOT143B
Dimensions in mm
14-10-03
Fig 12. Package outline SOT363 (SC-88)
1.7
1.5
0.95
0.60
1.8
1.4
3
0.25
0.10
0.3
0.2
0.65
6
0.45
0.15
0.6
0.5
5
4
0.3
0.1
1.75 0.9
1.45 0.7
1.7
1.5
1.3
1.1
pin 1 index
1
2
1
0.30
0.15
0.25
0.10
0.27
0.17
0.18
0.08
1
Dimensions in mm
04-11-04
Fig 13. Package outline SOT416 (SC-75)
Product data sheet
3
0.5
1
BAS40_1PSXXSB4X_SER
2
Dimensions in mm
04-11-08
Fig 14. Package outline SOT666
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Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
Packing quantity
3000 4000 8000 10000
1PS70SB40
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS76SB40
SOD323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS79SB40
SOD523
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40H
SOD123F 4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40L
SOD882
2 mm pitch, 8 mm tape and reel
-
-
-
-315
BAS40W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS70SB44
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40-04
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40-04W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS70SB45
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS75SB45
SOT416
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40-05
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40-05W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS70SB46
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40-06
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40-06W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40-07
SOT143B 4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40-07V
SOT666
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-
-115
-
-
BAS40-05V
SOT666
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
1PS88SB48
BAS40XY
BAS40_1PSXXSB4X_SER
Product data sheet
SOT363
SOT363
-
-115
-
-
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-
-165
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-
-165
[1]
For further information and the availability of packing methods, see Section 14.
[2]
T1: normal taping
[3]
T2: reverse taping
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Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
11. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2×)
msa433
Dimensions in mm
Fig 15. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
solder lands
solder resist
occupied area
2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 16. Wave soldering footprint SOD323 (SC-76)
2.15
0.50 0.60
1.20
solder lands
solder paste
0.30
0.40
solder resist
occupied area
1.80
1.90
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 17. Reflow soldering footprint SOD523 (SC-79)
BAS40_1PSXXSB4X_SER
Product data sheet
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.90
2.50
solder lands
solder resist
2
0.85
1
2.70
1.30
3.00
0.85
3
occupied area
solder paste
0.60
(3x)
0.50 (3x)
0.60 (3x)
1.00
3.30
MSA439
Dimensions in mm
Fig 18. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 19. Wave soldering footprint SOT23 (TO-236AB)
BAS40_1PSXXSB4X_SER
Product data sheet
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Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD123F
1.30
R = 0.05 (8×)
0.30
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
solder lands
solder paste
solder resist
R = 0.05 (8×)
0.30
(2×)
0.40
(2×)
0.50
(2×)
occupied area
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 21. Reflow soldering footprint SOD882
BAS40_1PSXXSB4X_SER
Product data sheet
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Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.65
0.75
1.325
1.30
solder lands
2
solder paste
0.60
2.35 0.85
(3×)
0.50
(3×) 1.90
3
solder resist
occupied area
1
Dimensions in mm
0.55
(3×)
2.40
msa429
Fig 22. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
2
3.65
2.10
3
2.70
solder lands
1
0.90
(2×)
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
msa419
Fig 23. Wave soldering footprint SOT323 (SC-70)
BAS40_1PSXXSB4X_SER
Product data sheet
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Rev. 9 — 18 March 2015
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
3.25
0.60 (3x)
0.50 (3x)
solder lands
0.60
(4x)
solder resist
4
3
2.70
occupied area
1.30 3.00
1
2
solder paste
msa441
0.90
1.00
2.50
Dimensions in mm
Fig 24. Reflow soldering footprint SOT143B
4.45
1.20 (3×)
4
3
1.15 4.00 4.60
solder lands
1
solder resist
2
occupied area
Dimensions in mm
1.00
3.40
preferred transport direction during soldering
msa422
Fig 25. Wave soldering footprint SOT143B
BAS40_1PSXXSB4X_SER
Product data sheet
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.65
solder lands
2.35 1.5
0.4 (2×)
0.6 0.5
(4×) (4×)
solder resist
solder paste
0.5
(4×)
0.6
(2×)
occupied area
0.6
(4×)
Dimensions in mm
1.8
sot363_fr
Fig 26. Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
0.3 2.5
4.5
solder resist
occupied area
1.5
Dimensions in mm
1.3
1.3
preferred transport
direction during soldering
2.45
5.3
sot363_fw
Fig 27. Wave soldering footprint SOT363 (SC-88)
BAS40_1PSXXSB4X_SER
Product data sheet
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
17 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
2.2
0.6
1.1
0.7
2
2.0
3
0.85
1.5
1
0.6
(3x)
1.9
0.5
(3x)
msa438
solder lands
solder resist
Dimensions in mm
solder paste
occupied area
Fig 28. Reflow soldering footprint SOT416
2.75
2.45
2.1
1.6
solder lands
0.4
(6×) 0.25
(2×)
0.538
2
1.7 1.075
0.3
(2×)
0.55
(2×)
placement area
solder paste
occupied area
0.325 0.375
(4×) (4×)
Dimensions in mm
1.7
0.45
(4×)
0.6
(2×)
0.5
(4×)
0.65
(2×)
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 29. Reflow soldering footprint SOT666
BAS40_1PSXXSB4X_SER
Product data sheet
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
18 of 22
BAS40 series; 1PSxxSB4x series
NXP Semiconductors
General-purpose Schottky diodes
12. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAS40_1PSXXSB4X_SER
v.9
20150318
Product data sheet
-
BAS40_1PSXXSB4X_SER_8
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
BAS40_1PSXXSB4X_SER_8 20100113
Product data sheet
-
BAS40_1PSXXSB4X_SER_7
BAS40_1PSXXSB4X_SER_7 20060512
Product data sheet
-
BAS40_1PSXXSB4X_SER_6
BAS40_1PSXXSB4X_SER_6 20050809
Product data sheet
-
1PS70SB40_3
1PS75SB45_2
1PS76SB40_3
1PS79SB40_2
1PS88SB48_3 BAS40H_1
BAS40L_1 BAS40-05V_1
BAS40-07V_1 BAS40W_3
BAS40_SERIES_5
1PS70SB40_3
19990426
Product specification
-
1PS70SB40_2
1PS75SB45_2
19990426
Product specification
-
1PS75SB45_1
1PS76SB40_3
20040126
Product specification
-
1PS76SB40_2
1PS79SB40_2
19990426
Product specification
-
1PS79SB40_1
1PS88SB48_3
20021107
Product specification
-
1PS88SB48_2
BAS40H_1
20050425
Product data sheet
-
-
BAS40L_1
20030520
Product specification
-
-
BAS40-05V_1
20021121
Product specification
-
-
BAS40-07V_1
20020327
Product specification
-
-
BAS40W_3
19990426
Product specification
-
BAS40W_2
BAS40_SERIES_5
20011010
Product specification
-
BAS40_4
BAS40_1PSXXSB4X_SER
Product data sheet
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Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
19 of 22
NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BAS40_1PSXXSB4X_SER
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
20 of 22
NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAS40_1PSXXSB4X_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
21 of 22
NXP Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 5
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality information . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information . . . . . . . . . . . . . . . . . . . . 11
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Contact information. . . . . . . . . . . . . . . . . . . . . 21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 March 2015
Document identifier: BAS40_1PSXXSB4X_SER
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