Data Sheet

PMEG3010EB
1 A very low VF MEGA Schottky barrier rectifier
Rev. 2 — 15 March 2012
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD523 ultra small and flat
lead Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
 Forward current: IF ≤ 1 A
 AEC-Q101 qualified
 Reverse voltage: VR ≤ 30 V
 Ultra small and flat lead SMD plastic
package
 Very low forward voltage
1.3 Applications
 Low voltage rectification
 Reverse polarity protection
 High efficiency DC-to-DC conversion
 Low power consumption applications
 Switch mode power supply
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF
forward current
Tsp ≤ 55 °C
-
-
1
A
VR
reverse voltage
-
-
30
V
VF
forward voltage
IF = 1 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ;
Tamb = 25 °C
-
610
680
mV
Simplified outline
Graphic symbol
2. Pinning information
Table 2.
Pin
Pinning information
Symbol Description
1
K
cathode[1]
2
A
anode
1
1
2
2
sym001
SOD523
[1]
The marking bar indicates the cathode.
PMEG3010EB
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
3. Ordering information
Table 3.
Ordering information
Type number
Package
PMEG3010EB
Name
Description
Version
-
plastic surface-mounted package; 2 leads
SOD523
4. Marking
Table 4.
Marking codes
Type number
Marking code
PMEG3010EB
KA
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VR
reverse voltage
IF
forward current
IFRM
Min
Max
Unit
-
30
V
Tsp ≤ 55 °C
-
1
A
repetitive peak forward current
tp ≤ 1 ms; δ ≤ 0.25
-
3
A
IFSM
non-repetitive peak forward
current
tp = 8 ms; Tj(init) = 25 °C; square wave
-
5
A
Ptot
total power dissipation
Tamb ≤ 25 °C
-
310
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-65
150
°C
Tstg
storage temperature
-65
150
°C
[1]
Conditions
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
6. Thermal characteristics
Table 6.
Symbol
Thermal characteristics
Parameter
Rth(j-a)
thermal resistance
from junction to
ambient
Rth(j-sp)
thermal resistance
from junction to solder
point
Conditions
in free air
Min
Typ
Max
Unit
[1][2]
-
-
400
K/W
[3]
-
-
75
K/W
[1]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a
significant part of the total power losses.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Soldering point of cathode tab.
PMEG3010EB
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 March 2012
© NXP B.V. 2012. All rights reserved.
2 of 9
PMEG3010EB
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
7. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 0.1 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tamb = 25 °C
-
90
180
mV
IF = 1 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tamb = 25 °C
-
150
200
mV
IF = 10 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tamb = 25 °C
-
210
270
mV
IF = 100 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tamb = 25 °C
-
295
360
mV
IF = 500 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02 ; Tamb = 25 °C
-
430
500
mV
IF = 1 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02 ;
Tamb = 25 °C
-
610
680
mV
VR = 10 V; Tamb = 25 °C
-
15
200
µA
VR = 30 V; Tamb = 25 °C
-
70
500
µA
VR = 1 V; f = 1 MHz; Tamb = 25 °C
-
24
30
pF
reverse current
IR
diode capacitance
Cd
006aaa855
104
IR
(μA)
IF
(mA)
006aaa856
105
(1)
104
(2)
103
(3)
103
102
102
(4)
10
10
(1)
(2)
(3)
(4)
(5)
1
1
10−1
10−2
10−1
10−3
0
Fig 1.
(5)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
VF (V)
0
5
10
(1) Tamb = 150 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(5) Tamb = −40 °C
Forward current as a function of forward
voltage; typical values
PMEG3010EB
Product data sheet
Fig 2.
15
20
25
30
VR (V)
Reverse current as a function of reverse
voltage; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 March 2012
© NXP B.V. 2012. All rights reserved.
3 of 9
PMEG3010EB
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
006aaa857
40
Cd
(pF)
30
20
10
0
0
10
20
30
VR (V)
f = 1 MHz; Tamb = 25 °C
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
8. Test information
P
tcy
duty cycle δ =
tp
tcy
tp
t
006aac658
Fig 4.
Duty cycle definition
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PMEG3010EB
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 March 2012
© NXP B.V. 2012. All rights reserved.
4 of 9
PMEG3010EB
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
9. Package outline
0.85
0.75
0.65
0.58
1
1.65 1.25
1.55 1.15
2
0.34
0.26
0.17
0.11
Dimensions in mm
Fig 5.
02-12-13
Package outline SOD523
10. Soldering
2.15
1.1
solder lands
solder resist
0.5 0.6
(2×) (2×)
1.2
solder paste
occupied area
Dimensions in mm
0.7
(2×)
0.8
(2×)
Fig 6.
sod523_fr
Reflow soldering footprint for SOD523
PMEG3010EB
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 March 2012
© NXP B.V. 2012. All rights reserved.
5 of 9
PMEG3010EB
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
11. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG3010EB v.2
20120315
Product data sheet
-
PMEG3010EB v.1
Modifications:
PMEG3010EB v.1
PMEG3010EB
Product data sheet
•
•
•
1 “Product profile” updated
5 “Limiting values”:IFRM and IFSM values corrected
8 “Test information” updated
20061201
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 March 2012
-
© NXP B.V. 2012. All rights reserved.
6 of 9
PMEG3010EB
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
12. Legal information
12.1 Data sheet status
Document status[1] [2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URLhttp://www.nxp.com.
12.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with theTerms and conditions of commercial sale of NXP Semiconductors.
PMEG3010EB
Product data sheet
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
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malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
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applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 March 2012
© NXP B.V. 2012. All rights reserved.
7 of 9
PMEG3010EB
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published athttp://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
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conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
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Notice: All referenced brands, product names, service names and trademarks
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G
reenChip,HiPerSmart,HITAG,I²C-bus
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In the event that customer uses the product for design-in and use in
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Corporation.
13. Contact information
For more information, please visit:http://www.nxp.com
For sales office addresses, please send an email to:salesaddresses@nxp.com
PMEG3010EB
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 March 2012
© NXP B.V. 2012. All rights reserved.
8 of 9
PMEG3010EB
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
12.1
12.2
12.3
12.4
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .1
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
Thermal characteristics . . . . . . . . . . . . . . . . . . .2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Test information . . . . . . . . . . . . . . . . . . . . . . . . . .4
Quality information . . . . . . . . . . . . . . . . . . . . . . .4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .6
Legal information. . . . . . . . . . . . . . . . . . . . . . . . .7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .7
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Contact information. . . . . . . . . . . . . . . . . . . . . . .8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 March 2012
Document identifier: PMEG3010EB