3.3 V Hex inverter

74LVT04
3.3 V Hex inverter
Rev. 2 — 28 April 2014
Product data sheet
1. General description
The 74LVT04 is a high-performance product designed for VCC operation at 3.3 V.
The 74LVT04 provides six inverting buffers.
2. Features and benefits
 TTL input and output switching levels
 Latch-up protection
 JESD78 class II exceeds 500 mA
 ESD protection:
 HBM JESD22-A114E exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V
 Specified from 40 C to +85 C
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVT04D
40 C to +85 C
SO14
plastic small outline package; 14 leads; body width
3.9 mm
SOT108-1
74LVT04DB
40 C to +85 C
SSOP14
plastic shrink small outline package; 14 leads; body
width 5.3 mm
SOT337-1
74LVT04PW
40 C to +85 C
TSSOP14
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT402-1
74LVT04
NXP Semiconductors
3.3 V Hex inverter
4. Functional diagram
$
<
$
<
$
<
$
<
$
<
$
<
PQD
Logic symbol
Fig 1.
Y
A
PQD
Fig 2.
mna341
IEC logic symbol
Fig 3.
Logic diagram for one gate
5. Pinning information
5.1 Pinning
1A
1
14 VCC
1Y
2
13 6A
2A
3
12 6Y
2Y
4
3A
5
3Y
6
9
4A
GND
7
8
4Y
04
11 5A
10 5Y
001aac915
Fig 4.
Pin configuration SOT108-1 (SO14), SOT337-1 (SSOP14) and SOT402-1 (TSSOP14)
74LVT04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
nA
1, 3, 5, 9, 11, 13
data input
nY
2, 4, 6, 8, 10, 12
data output
GND
7
ground (0 V)
VCC
14
supply voltage
6. Functional description
Table 3.
Function table[1]
Input
Output
nA
nY
L
H
H
L
[1]
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+4.6
V
0.5
+7.0
V
input voltage
[1]
VO
output voltage
output in OFF-state or HIGH-state
[1]
0.5
+7.0
V
IIK
input clamping current
VI < 0 V
50
-
mA
IOK
output clamping current
VO < 0 V
50
-
mA
IO
output current
output in LOW-state
-
64
mA
output in HIGH-state
-
32
mA
Tstg
storage temperature
65
+150
C
Tj
junction temperature
[2]
-
150
C
[3]
-
500
mW
VI
total power dissipation
Ptot
Tamb = 40 °C to +85 °C
[1]
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
[2]
The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability.
[3]
For SO14 packages: above 70 C derate linearly with 8 mW/K.
For SSOP14 and TSSOP14 packages: above 60 C derate linearly with 5.5 mW/K.
74LVT04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VCC
Conditions
Min
Max
Unit
supply voltage
2.7
3.6
V
VI
input voltage
0
5.5
V
VIH
HIGH-level input voltage
2.0
-
V
VIL
LOW-level input voltage
-
0.8
V
IOH
HIGH-level output current
-
20
mA
IOL
LOW-level output current
-
32
mA
Tamb
ambient temperature
in free air
40
+85
C
t/V
input transition rise and fall rate
outputs enabled
-
10
ns/V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
40 C to +85 C
Conditions
Typ[1]
Min
Unit
Max
VIK
input clamp voltage
VCC = 2.7 V; IIK = 18 mA
-
-
1.2
V
VOH
LOW-level input voltage
VCC = 2.7 V to 3.6 V; IOH = 100 A
VCC  0.2
-
-
V
VCC = 2.7 V; IOH = 6 mA
2.4
-
-
V
VCC = 3.0 V; IOH = 20 mA
2.0
-
-
V
VCC = 2.7 V; IOL = 100 A
-
-
0.2
V
VCC = 2.7 V; IOL = 24 mA
-
-
0.5
V
VCC = 3.0 V; IOL = 32 mA
-
-
0.5
V
-
-
10
A
LOW-level output voltage
VOL
II
input leakage current
VCC = 0 V or 3.6 V; VI = 5.5 V
VCC = 3.6 V; VI = VCC or GND
-
-
±1
A
IOFF
output off current
VCC = 0 V; VI or VO = 0 V to 4.5 V
-
-
±100
A
ICCH
quiescent supply current
VCC = 3.6 V; outputs HIGH;
VI = GND or VCC, IO = 0 V
-
-
0.02
mA
ICCL
quiescent supply current
VCC = 3.6 V; outputs LOW;
VI = GND or VCC; IO = 0 V
-
1.5
3
mA
ICC
additional supply current
per input pin[2]
VCC = 3 V to 3.6 V;
one input at VCC  0.6 V;
other inputs at VCC or GND
-
-
0.2
A
CI
input capacitance
VI = 3 V or 0 V
-
3
-
pF
[1]
All typical values are at VCC = 3.3 V and Tamb = 25C.
[2]
This is the increase in supply current for each input at the specified voltage level other than VCC or GND.
74LVT04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
10. Dynamic characteristics
Table 7.
Dynamic characteristics
GND = 0 V; for test circuit, see Figure 6.
Symbol Parameter
LOW to OFF-state
propagation delay
tPLH
40 C to +85 C
Conditions
OFF-state to LOW
propagation delay
VCC = 2.7 V
Max
-
-
4.7
ns
1.0
2.6
3.9
ns
nA to nY; see Figure 5
ns
VCC = 2.7 V
VCC = 3.3 V  0.3 V
[1]
Min
nA to nY; see Figure 5
VCC = 3.3 V  0.3 V
tPHL
Unit
Typ[1]
-
-
3.2
1.0
2.5
3.5
ns
All typical values are at VCC = 3.3 V and Tamb = 25C.
11. Waveforms
9,
90
Q$LQSXW
90
*1'
W 3+/
W 3/+
92+
90
Q<RXWSXW
92/
90
PQD
VM = 50%; VI = GND to VCC.
VM = 1.5 V; VI = GND to 2.7 V
Fig 5.
The input nA to output nY propagation delays
74LVT04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
tW
VI
90 %
negative
pulse
VM
VM
10 %
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
VM
VM
10 %
0V
tW
VCC
VI
PULSE
GENERATOR
VO
DUT
RT
CL
RL
001aaf615
Test data is given in Table 8.
Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
RL = Load resistance.
Fig 6.
Table 8.
Test circuit for measuring switching times
Test data
Input
Load
VI
fi
2.7 V
 10 MHz 500 ns
74LVT04
Product data sheet
tW
tr, tf
CL
RL
2.5 ns
50 pF
500 
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
12. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
inches
0.010 0.057
0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
Fig 7.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Package outline SOT108-1 (SO14)
74LVT04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
7 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
D
SOT337-1
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
7
1
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.4
0.9
8o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT337-1
Fig 8.
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-150
Package outline SOT337-1 (SSOP14)
74LVT04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
8 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP
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SLQLQGH[
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GHWDLO;
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ES
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ES
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Fig 9.
5()(5(1&(6
,(&
-('(&
-(,7$
(8523($1
352-(&7,21
,668('$7(
02
Package outline SOT402-1 (TSSOP14)
74LVT04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
9 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
13. Abbreviations
Table 9.
Abbreviations
Acronym
Description
ESD
ElectroStatic Discharge
HBM
Human Body Model
14. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVT04 v.2
20140428
Product data sheet
-
74LVT04_1
Modifications:
74LVT04_1
74LVT04
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Imported the data sheet into the latest template
19960828
Product specification
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
-
© NXP Semiconductors N.V. 2014. All rights reserved.
10 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVT04
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 13
74LVT04
NXP Semiconductors
3.3 V Hex inverter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVT04
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 April 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
12 of 13
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NXP Semiconductors
3.3 V Hex inverter
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 April 2014
Document identifier: 74LVT04