Data Sheet

PMEG2010AEJ
20 V, 1 A very low VF MEGA Schottky barrier rectifier in
SOD323F package
Rev. 03 — 15 January 2010
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) very
small and flat lead Surface Mounted Device (SMD) plastic package.
1.2 Features
„
„
„
„
Forward current: ≤ 1 A
Reverse voltage: ≤ 20 V
Very low forward voltage
Very small and flat lead SMD plastic package
1.3 Applications
„
„
„
„
„
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Inverse polarity protection
Low power consumption applications
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF
forward current
Tsp ≤ 55 °C
-
-
1
A
VR
reverse voltage
-
-
20
V
-
480
550
mV
VF
[1]
forward voltage
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
IF = 1000 mA
[1]
PMEG2010AEJ
NXP Semiconductors
20 V, 1 A very low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Symbol
[1]
1
1
2
2
sym001
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
PMEG2010AEJ
Package
Name
Description
Version
SC-90
plastic surface mounted package; 2 leads
SOD323F
4. Marking
Table 4.
Marking codes
Type number
Marking code
PMEG2010AEJ
EM
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Max
Unit
-
20
V
-
1
A
VR
reverse voltage
IF
forward current
IFRM
repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25
-
5.5
A
IFSM
non-repetitive peak forward
current
square wave;
tp = 8 ms
-
10
A
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
-
360
mW
[2]
-
830
mW
Tsp ≤ 55 °C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PMEG2010AEJ_3
Product data sheet
Min
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
2 of 9
PMEG2010AEJ
NXP Semiconductors
20 V, 1 A very low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
Rth(j-sp)
Conditions
thermal resistance from
junction to ambient
in free air
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
[1][2]
-
-
350
K/W
[1][3]
-
-
150
K/W
[4]
-
-
55
K/W
[1]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating are available on request.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4]
Solder point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
VF
IR
Cd
[1]
Parameter
Conditions
Min
Typ
Max
Unit
IF = 10 mA
-
240
270
mV
IF = 100 mA
-
300
350
mV
IF = 500 mA
-
400
460
mV
[1]
forward voltage
reverse current
diode capacitance
IF = 1000 mA
-
480
550
mV
VR = 5 V
-
5
10
μA
VR = 8 V
-
7
20
μA
VR = 10 V
-
8
30
μA
VR = 15 V
-
10
50
μA
VR = 20 V
-
15
70
μA
VR = 1 V; f = 1 MHz
-
40
50
pF
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PMEG2010AEJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
3 of 9
PMEG2010AEJ
NXP Semiconductors
20 V, 1 A very low VF MEGA Schottky barrier rectifier
006aaa361
104
IF
(mA)
103
(1)
(2)
103
(1)
102
006aaa362
105
IR
(μA) 104
(2)
(3)
102
10
(4)
10
1
(3)
1
(4)
10−1
(5)
10−1
(5)
10−2
10−2
10−3
0
0.1
0.2
0.3
0.4
0.5
0
0.6
0.7
VF (V)
5
15
20
VR (V)
(1) Tamb = 150 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(5) Tamb = −40 °C
Fig 1.
10
Forward current as a function of forward
voltage; typical values
Fig 2.
Reverse current as a function of reverse
voltage; typical values
006aaa363
80
Cd
(pF)
60
40
20
0
0
5
10
15
20
VR (V)
Tamb = 25 °C; f = 1 MHz
Fig 3.
Diode capacitance as a function of reverse voltage; typical values
PMEG2010AEJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
4 of 9
PMEG2010AEJ
NXP Semiconductors
20 V, 1 A very low VF MEGA Schottky barrier rectifier
8. Package outline
1.35
1.15
0.80
0.65
0.5
0.3
1
2.7
2.3
1.8
1.6
2
0.25
0.10
0.40
0.25
Dimensions in mm
Fig 4.
04-09-13
Package outline SOD323F (SC-90)
9. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
PMEG2010AEJ
[1]
Package
SOD323F
Description
Packing quantity
4 mm pitch, 8 mm tape and reel
3000
10000
-115
-135
For further information and the availability of packing methods, see Section 14.
10. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2×)
001aab169
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5.
Reflow soldering footprint SOD323F (SC-90)
PMEG2010AEJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
5 of 9
PMEG2010AEJ
NXP Semiconductors
20 V, 1 A very low VF MEGA Schottky barrier rectifier
11. Mounting
43.4
43.4
10
0.6
10
0.6
0.6
40
40
0.6
0.6
0.5
0.5
0.6
Dimensions in mm
006aaa487
Dimensions in mm
PCB thickness: d = 1.6 mm
Fig 6.
FR4 PCB, standard footprint
SOD323F (SC-90)
PMEG2010AEJ_3
Product data sheet
006aaa488
PCB thickness: d = 1.6 mm
Fig 7.
FR4 PCB, mounting pad for
cathode 1 cm2 SOD323F (SC-90)
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
6 of 9
PMEG2010AEJ
NXP Semiconductors
20 V, 1 A very low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG2010AEJ_3
20100115
Product data sheet
-
PMEG2010AEJ_2
Modifications:
•
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
PMEG2010AEJ_2
20051014
Product data sheet
-
PMEG2010AEJ_1
PMEG2010AEJ_1
20050302
Product data sheet
-
-
PMEG2010AEJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
7 of 9
PMEG2010AEJ
NXP Semiconductors
20 V, 1 A very low VF MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PMEG2010AEJ_3
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 15 January 2010
8 of 9
PMEG2010AEJ
NXP Semiconductors
20 V, 1 A very low VF MEGA Schottky barrier rectifier
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information . . . . . . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
2
3
3
5
5
5
6
7
8
8
8
8
8
8
9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 January 2010
Document identifier: PMEG2010AEJ_3
Similar pages