LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY (0.56 Inch) LFD511/22V-XX DATA SHEET DOC. NO : QW0905- LFD511/22V-XX REV. : A DATE : 31 - Dec - 2004 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD511/22V-XX Page 1/8 Package Dimensions 8.0 (0.315") 50.4(1.984") DIG.1 DIG.2 DIG.3 14.2 (0.56") DIG.4 19.0 (0.748") 15.24 (0.6") ψ1.6(0.063") LFD511/22V-XX LIGITEK A F G E B C 4.8±0.5 0.51 TYP D 2.54X17=43.18(1.7") PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/8 PART NO. LFD511/22V-XX Internal Circuit Diagram LFD5112V-XX 34 33 3 2 1 36 35 4 A B C D E F G DP 29 28 8 6 5 30 7 9 A B C D E F G DP 25 24 12 11 10 27 26 13 A B C D E F G DP 20 19 17 15 14 21 16 18 A B C D E F G DP LFD5122V-XX DIG. 1 32 DIG. 2 31 DIG. 3 23 DIG. 4 22 34 33 3 2 1 36 35 4 A B C D E F G DP 29 28 8 6 5 30 7 9 A B C D E F G DP 25 24 12 11 10 27 26 13 A B C D E F G DP 20 19 17 15 14 21 16 18 A B C D E F G DP DIG. 1 32 DIG. 2 31 DIG. 3 23 DIG. 4 22 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD511/22V-XX Page 3/8 Electrical Connection PIN NO. LFD5112V-XX PIN NO. 1 Anode E Dig.1 19 Anode B Dig.4 2 Anode D Dig.1 20 Anode A Dig.4 3 Anode C Dig.1 21 Anode F Dig.4 4 Anode DP Dig.1 22 Common Cathode Dig.4 5 Anode E Dig.2 23 Common Cathode Dig.3 6 Anode D Dig.2 24 Anode B Dig.3 7 Anode G Dig.2 25 Anode A Dig.3 8 Anode C Dig.2 26 Anode G Dig.3 9 Anode DP Dig.2 27 Anode F Dig.3 10 Anode E Dig.3 28 Anode B Dig.2 11 Anode D Dig.3 29 Anode A Dig.2 12 Anode C Dig.3 30 Anode F Dig.2 13 Anode DP Dig.3 31 Common Cathode Dig.2 14 Anode E Dig.4 32 Common Cathode Dig.1 15 Anode D Dig.4 33 Anode B Dig.1 16 Anode G Dig.4 34 Anode A Dig.1 17 Anode C Dig.4 35 Anode G Dig.1 18 Anode DP Dig.4 36 Anode F Dig.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD511/22V-XX Page 4/8 Electrical Connection PIN NO. LFD5122V-XX PIN NO. 1 Cathode E Dig.1 19 Cathode B Dig.4 2 Cathode D Dig.1 20 Cathode A Dig.4 3 Cathode C Dig.1 21 Cathode F Dig.4 4 Cathode DP Dig.1 22 Common Anode Dig.4 5 Cathode E Dig.2 23 Common Anode Dig.3 6 Cathode D Dig.2 24 Cathode B Dig.3 7 Cathode G Dig.2 25 Cathode A Dig.3 8 Cathode C Dig.2 26 Cathode G Dig.3 9 Cathode DP Dig.2 27 Cathode F Dig.3 10 Cathode E Dig.3 28 Cathode B Dig.2 11 Cathode D Dig.3 29 Cathode A Dig.2 12 Cathode C Dig.3 30 Cathode F Dig.2 13 Cathode DP Dig.3 31 Common Anode Dig.2 14 Cathode E Dig.4 32 Common Anode Dig.1 15 Cathode D Dig.4 33 Cathode B Dig.1 16 Cathode G Dig.4 34 Cathode A Dig.1 17 Cathode C Dig.4 35 Cathode G Dig.1 18 Cathode DP Dig.4 36 Cathode F Dig.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD511/22V-XX Page 5/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT VG Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 120 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode Material Emitted or anode CHIP PART NO △λ Vf(v) (nm) Min. Iv(mcd) Typ. Max. Min. IV-M Typ. Common Anode LFD5112V-XX GaP LFD5122V-XX Electrical λP (nm) 565 Green 30 1.7 2.1 Common Cathode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 2.6 2.35 3.5 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD511/22V-XX Page 6/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Emission Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD511/22V-XX Page 7/8 Typical Electro-Optical Characteristics Curve VG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 1.0 5.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature(℃) Ambient Temperature(℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD511/22V-XX Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11