Data Sheet

DF
N1
00
6D
-2
PMEG6002ELD
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
5 February 2014
Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with
an integrated guard ring for stress protection, encapsulated in a leadless ultra small
SOD882D (DFN1006D-2) Surface-Mounted Device (SMD) plastic package with visible
and solderable side pads.
2. Features and benefits
•
•
•
•
•
•
Average forward current: IF(AV) ≤ 0.2 A
Reverse voltage: VR ≤ 60 V
Low forward voltage VF ≤ 600 mV
AEC-Q101 qualified
Solderable side pads
Package height typ. 0.37 mm
3. Applications
•
•
•
•
•
LED backlight for mobile application
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Low power consumption applications
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
IF(AV)
average forward
current
δ = 0.5; f = 20 kHz; Tamb ≤ 130 °C;
[1]
Min
Typ
Max
Unit
-
-
0.2
A
-
-
0.2
A
square wave
δ = 0.5; f = 20 kHz; Tsp ≤ 140 °C;
square wave
VR
reverse voltage
Tj = 25 °C
-
-
60
V
VF
forward voltage
IF = 200 mA; pulsed; tp ≤ 300 µs;
-
540
600
mV
-
2
10
µA
δ ≤ 0.02; Tj = 25 °C
IR
reverse current
VR = 10 V; pulsed; tp ≤ 2 ms; δ ≤ 0.02;
Tj = 25 °C
[1]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
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PMEG6002ELD
NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
5. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
K
cathode[1]
2
A
anode
Simplified outline
Graphic symbol
1
1
2
2
sym001
Transparent
top view
DFN1006D-2 (SOD882D)
[1]
The marking bar indicates the cathode.
6. Ordering information
Table 3.
Ordering information
Type number
PMEG6002ELD
Package
Name
Description
Version
DFN1006D-2
DFN1006D-2: leadless ultra small plastic package; 2 terminals
SOD882D
7. Marking
Table 4.
Marking codes
Type number
Marking code
PMEG6002ELD
1111 1010
CATHODE BAR
READING DIRECTION
VENDOR CODE
READING EXAMPLE:
0111
1011
MARKING CODE
(EXAMPLE)
READING DIRECTION
006aac477
Fig. 1.
SOD882D binary marking code description
PMEG6002ELD
Product data sheet
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NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage
Tj = 25 °C
-
60
V
IF
forward current
Tsp ≤ 140 °C
-
0.28
A
IF(AV)
average forward current
δ = 0.5; f = 20 kHz; Tamb ≤ 130 °C;
-
0.2
A
-
0.2
A
[1]
square wave
δ = 0.5; f = 20 kHz; Tsp ≤ 140 °C;
square wave
IFRM
repetitive peak forward current
tp ≤ 1 ms; δ ≤ 0.25
-
1
A
IFSM
non-repetitive peak forward
current
tp = 8 ms; Tj(init) = 25 °C; square wave
-
3
A
Ptot
total power dissipation
Tamb ≤ 25 °C
[2]
-
370
mW
[3]
-
735
mW
[1]
-
1090
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1]
[2]
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm .
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
Rth(j-sp)
thermal resistance
from junction to solder
point
[1]
[2]
[3]
[4]
[5]
PMEG6002ELD
Product data sheet
Min
Typ
Max
Unit
[1][2]
-
-
340
K/W
[1][3]
-
-
170
K/W
[1][4]
-
-
115
K/W
[5]
-
-
20
K/W
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm .
Device mounted on a ceramic PCB, Al2O3, standard footprint.
Soldering point of cathode tab.
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PMEG6002ELD
NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
aaa-007593
103
Zth(j-a)
(K/W)
duty cycle = 1
0.75
102
0.33
0.2
0.5
0.25
0.1
0.05
0.02
10
0.01
0
1
10-5
10-4
10-3
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, standard footprint
Fig. 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-007595
103
Zth(j-a)
(K/W)
duty cycle = 1
102
0.75
0.33
0.2
0.5
0.25
0.1
10
0.05
0.01
1
10-5
0.02
0
10-4
10-3
10-2
FR4 PCB, mounting pad for cathode 1 cm
Fig. 3.
10-1
1
10
102
tp (s)
103
2
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG6002ELD
Product data sheet
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PMEG6002ELD
NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
aaa-007596
103
Zth(j-a)
(K/W)
102
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
10
0.1
0.05
0.02
0
0.01
1
10-5
10-4
10-3
10-2
10-1
1
102
10
tp (s)
103
Ceramic PCB, Al2O3, standard footprint
Fig. 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
10. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 0.1 mA; pulsed; tp ≤ 300 µs;
-
130
170
mV
-
190
230
mV
-
260
300
mV
-
410
470
mV
-
540
600
mV
-
2
10
µA
-
20
100
µA
-
310
-
µA
-
2
-
mA
δ ≤ 0.02; Tj = 25 °C
IF = 1 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C
IF = 10 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02; Tj = 25 °C
IF = 100 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02; Tj = 25 °C
IF = 200 mA; pulsed; tp ≤ 300 µs;
δ ≤ 0.02; Tj = 25 °C
IR
reverse current
VR = 10 V; pulsed; tp ≤ 2 ms; δ ≤ 0.02;
Tj = 25 °C
VR = 60 V; pulsed; tp ≤ 2 ms; δ ≤ 0.02;
Tj = 25 °C
VR = 10 V; pulsed; tp ≤ 300 µs;
δ ≤ 0.02; Tamb = 100 °C
VR = 60 V; pulsed; tp ≤ 300 µs;
δ ≤ 0.02; Tamb = 100 °C
Cd
diode capacitance
VR = 1 V; f = 1 MHz; Tj = 25 °C
-
15
20
pF
trr
reverse recovery time
IF = 10 mA; IR = 10 mA; RL = 100 Ω;
-
4.5
-
ns
IR(meas) = 1 mA; Tj = 25 °C
PMEG6002ELD
Product data sheet
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PMEG6002ELD
NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
006aaa765
103
006aaa766
5
IR 10
(µA)
104
IF
(mA)
102
(1)
(2)
103
(3)
102
10
10
(1)
(2)
(3)
(4)
(5)
1
(4)
1
10- 1
10- 2
10- 1
Fig. 5.
0
0.2
0.4
0.6
0.8
VF (V)
10- 3
1.0
(5)
0
20
(1) Tj = 150 °C
(1) Tj = 150 °C
(2) Tj = 125 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(4) Tj = 25 °C
(5) Tj = −40 °C
(5) Tj = −40 °C
Forward current as a function of forward
voltage; typical values
Fig. 6.
006aaa767
30
40
Reverse current as a function of reverse
voltage; typical values
aaa-007597
0.20
PF(AV)
(W)
Cd
(pF)
60
VR (V)
(4)
0.16
(3)
20
0.12
(2)
(1)
0.08
10
0.04
0
Fig. 7.
0
20
40
VR (V)
0
60
0
0.1
f = 1 MHz; Tamb = 25 °C
Tj = 150 °C
Diode capacitance as a function of reverse
voltage; typical values
(1) δ = 0.1; f = 20 kHz
(2) δ = 0.2; f = 20 kHz
(3) δ = 0.5; f = 20 kHz
(4) δ = 1 (DC)
Fig. 8.
PMEG6002ELD
Product data sheet
IF(AV) (A)
0.3
Average forward power dissipation as a
function of average forward current; typical
values
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NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
aaa-007598
0.5
PR(AV)
(W)
PR(AV)
(W)
(1)
0.4
aaa-007599
0.05
0.04
(2)
(3)
(1)
0.3
(2)
(3)
0.03
(4)
0.2
0.02
(4)
0.1
0
Fig. 9.
0.01
0
20
40
VR (V)
0
60
0
20
40
Tj = 125 °C
Tj = 85 °C
(1) δ = 1 (DC)
(2) δ = 0.9; f = 20 kHz
(3) δ = 0.8; f = 20 kHz
(4) δ = 0.5; f = 20 kHz
(1) δ = 1 (DC)
(2) δ = 0.9; f = 20 kHz
(3) δ = 0.8; f = 20 kHz
(4) δ = 0.5; f = 20 kHz
Average reverse power dissipation as a
function of reverse voltage; typical values
aaa-007600
0.3
(1)
IF(AV)
(A)
0.2
aaa-007601
0.3
(1)
0.2
(3)
0.1
(2)
(3)
0.1
(4)
0
0
60
Fig. 10. Average reverse power dissipation as a
function of reverse voltage; typical values
IF(AV)
(A)
(2)
VR (V)
(4)
25
50
75
100
125
0
150
175
Tamb (°C)
FR4 PCB, standard footprint
Tj = 150 °C
50
75
100
125
150
175
Tamb (°C)
2
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 11. Average forward current as a function of
ambient temperature; typical values
Product data sheet
25
FR4 PCB, mounting pad for cathode 1 cm
Tj = 150 °C
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
PMEG6002ELD
0
Fig. 12. Average forward current as a function of
ambient temperature; typical values
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PMEG6002ELD
NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
aaa-007602
0.3
(1)
IF(AV)
(A)
0.2
(1)
IF(AV)
(A)
0.2
(2)
(3)
0.1
aaa-007603
0.3
(2)
(3)
0.1
(4)
0
0
(4)
25
50
75
100
125
0
150
175
Tamb (°C)
0
25
50
75
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
Tj = 150 °C
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 13. Average forward current as a function of
ambient temperature; typical values
PMEG6002ELD
Product data sheet
100
125
150
175
Tamb (°C)
Fig. 14. Average forward current as a function of solder
point temperature; typical values
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NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
11. Test information
tr
D.U.T.
IF
RS = 50 Ω
tp
10 %
t
+ IF
SAMPLING
OSCILLOSCOPE
trr
t
Ri = 50 Ω
V = VR + IF × RS
mga881
(1)
90 %
VR
input signal
output signal
(1) IR = 1 mA
Fig. 15. Reverse recovery time: test circuit and waveforms
P
tcy
duty cycle δ =
tp
tcy
tp
t
006aac658
Fig. 16. Duty cycle definition
The current ratings for the typical waveforms are calculated according to the equations:
IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with
IRMS defined as RMS current.
11.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PMEG6002ELD
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60 V, 0.2 A low VF MEGA Schottky barrier rectifier
12. Package outline
0.65
0.55
0.4
max
2
0.30
0.22
1.05
0.95
0.65
1
0.30
0.22
0.55
0.45
cathode marking on top side (if applicable)
Dimensions in mm
12-05-01
Fig. 17. Package outline DFN1006D-2 (SOD882D)
13. Soldering
1.4
0.2
solder lands
0.8
(2×)
0.6
(2×)
solder resist
0.7
(2×)
solder paste
Dimensions in mm
0.3
0.4
1
1.3
sod882d_fr
Fig. 18. Reflow soldering footprint for DFN1006D-2 (SOD882D)
PMEG6002ELD
Product data sheet
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60 V, 0.2 A low VF MEGA Schottky barrier rectifier
14. Revision history
Table 8.
Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PMEG6002ELD v.3
20140205
Product data sheet
-
PMEG6002ELD v.2
Modifications:
•
PMEG6002ELD v.2
20131210
Product data sheet
-
PMEG6002ELD v.1
PMEG6002ELD v.1
20130503
Product data sheet
-
-
PMEG6002ELD
Product data sheet
Table 7. Characteristics: IR conditions corrected
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PMEG6002ELD
NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
15. Legal information
15.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
15.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
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representations or warranties as to the accuracy or completeness of
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of use of such information.
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with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
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data sheet shall define the specification of the product as agreed between
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customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
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Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
PMEG6002ELD
Product data sheet
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make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
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Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
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inclusion and/or use of NXP Semiconductors products in such equipment or
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Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
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damage, costs or problem which is based on any weakness or default
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and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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products are sold subject to the general terms and conditions of commercial
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purchase of NXP Semiconductors products by customer.
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60 V, 0.2 A low VF MEGA Schottky barrier rectifier
No offer to sell or license — Nothing in this document may be interpreted
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grant, conveyance or implication of any license under any copyrights, patents
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15.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
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PMEG6002ELD
NXP Semiconductors
60 V, 0.2 A low VF MEGA Schottky barrier rectifier
16. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 2
6
Ordering information ............................................. 2
7
Marking ................................................................... 2
8
Limiting values .......................................................3
9
Thermal characteristics .........................................3
10
Characteristics ....................................................... 5
11
11.1
Test information ..................................................... 9
Quality information ............................................... 9
12
Package outline ................................................... 10
13
Soldering .............................................................. 10
14
Revision history ................................................... 11
15
15.1
15.2
15.3
15.4
Legal information .................................................12
Data sheet status ............................................... 12
Definitions ...........................................................12
Disclaimers .........................................................12
Trademarks ........................................................ 13
© NXP N.V. 2014. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 5 February 2014
PMEG6002ELD
Product data sheet
All information provided in this document is subject to legal disclaimers.
5 February 2014
© NXP N.V. 2014. All rights reserved
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