A6260 Datasheet

A6260
High Brightness LED Current Regulator
Features and Benefits
Description
▪ AEC Q-100 qualified
▪ LED drive current up to 350 mA
▪ 6 to 40 V supply
▪ Reverse battery protection
▪ Low drop-out voltage
▪ LED short circuit and thermal protection
▪ 10 μA maximum shutdown current
▪ PWM dimming control input
▪ Current slew rate limiting
The A6260 is a linear, programmable current regulator
providing up to 350 mA for driving high-brightness LEDs.
The LED current, accurate to 4%, is set by a single low-power
sense resistor. Driving LEDs with constant current ensures
safe operation with maximum possible light output.
For automotive applications, optimum performance is
achieved when driving between 1 and 3 LEDs at currents up to 350 mA.
The low dropout voltage of the A6260 allows a single white
LED to be driven safely, at full current, with a supply voltage
down to 6 V.
An enable input allows PWM dimming and can be used to
enable low-current sleep mode. The rate of change of current
during PWM switching is limited to reduce EMI.
Overcurrent detection is provided to protect the LEDs and
the A6260 during short-to-supply or short-to-ground at any
LED terminal.
The integrated temperature monitor can be used to reduce
the LED drive current if the chip temperature exceeds the
thermal limit.
The device is available in an 8-pin SOIC package with exposed
thermal pad (suffix LJ). The device is lead (Pb) free with 100%
matte-tin leadframe plating.
Package: 8-pin SOICN with exposed
thermal pad (suffix LJ)
Not to scale
Not to scale
Typical Application
7 to 20 V
(–14 V min, 40 V max)
VIN
PWM Dimming
and
On-Off Control
LA
EN
A6260
Automotive
12 V Power Net
THTH
LC
LSS
SENSE
GND
6260-DS, Rev. 7 DRAFT sept10 2013
A6260
High Brightness LED Current Regulator
Selection Guide
Part Number
A6260KLJTR-T
A6260SLJTR-T
Ambient Temperature, TA
(°C)
Packing
3000 pieces per reel
3000 pieces per reel
–40 to 125
–20 to 85
Absolute Maximum Ratings*
Characteristic
Symbol
Notes
Rating
Units
Load Supply Voltage
VIN
–14 to 40
V
EN Pin Voltage
VEN
–14 to 40
V
LA and LC Pins Voltage
VLx
–0.3 to 40
V
VLSS
–0.3 to 0.3
V
SENSE Pin Voltage
VSENSE
–0.3 to 0.3
V
THTH Pin Voltage
VTHTH
–0.3 to 7
V
Range K
–40 to 125
ºC
Range S
–20 to 85
ºC
–40 to 150
ºC
LSS Pin Voltage
Ambient Operating Temperature Range
TA
Junction Operating Temperature Range
TJ
Storage Temperature Range
Tstg
–55 to 150
ºC
ESD Rating, Human Body Model
AEC-Q100-002, all pins
2000
V
ESD Rating, Charged Device Model
AEC-Q100-011, all pins
1050
V
*With respect to GND.
Thermal Characteristics*may require derating at maximum conditions, see application section for optimization
Characteristic
Symbol
Package Thermal Resistance
(Junction to Ambient)
RθJA
Package Thermal Resistance
(Junction to Pad)
RθJP
Value
Unit
On 4-layer PCB based on JEDEC standard
Test Conditions*
35
ºC/W
On 2-layer generic test PCB with 0.8 in.2 of copper area each side
62
ºC/W
2
ºC/W
*Additional thermal information available on the Allegro™ website.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
A6260
High Brightness LED Current Regulator
Functional Block Diagram
VBATT
VIN
Current Limited
Reg
EN
THTH
Control
Output
Logic
Monitor
Temp
Temp
Comp
Monitor
LC
Current
Slew
Reference
R
LA
Switch
Regulator
Limit
Generator
LSS
SENSE
TH
Pad
GND
RS
Pin-out Diagram
8 LSS
SENSE
1
GND
2
THTH
3
6 LA
EN
4
5 VIN
Pad
7 LC
Terminal List Table
Number
Name
Description
1
SENSE
2
GND
3
THTH
4
EN
Enable input
5
VIN
Main supply
Current sense input
Ground reference
Thermal threshold input
6
LA
LED anode (+) connection
7
LC
LED cathode (-) connection
8
LSS
Low-side sense connection
9
Pad
Exposed pad for enhanced thermal dissipation
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
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3
A6260
High Brightness LED Current Regulator
ELECTRICAL CHARACTERISTICS valid at TJ = –40°C to 150°C, VIN = 7 to 40 V, unless noted otherwise
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Supply and Reference
VIN Functional Operating Range1
VIN
6
–
40
V
VIN Quiescent Current
IINQ
LA, LC unconnected
–
–
4
mA
VIN Shutdown Current
IINS
EN < 400 mV
–
1
10
μA
Startup Time
tON
EN 2 V to 35 mA ILC
9
18
27
μs
Current Regulation
Maximum Current Sink
Current Sink
Current Sink Accuracy
SENSE Reference Voltage
ILCmax
RS = 250 mΩ, VIN – VLA > 2 V
350
–
–
mA
ILC
RS = 286 mΩ, VIN – VLA > 2 V
333
350
367
mA
100 mA < ILC < 350 mA
–5
±4
5
%
97
102
107
mV
VIN – VLA , ILOAD = 350 mA
–
2.25
2.35
V
VIN – VLA , ILOAD = 150 mA
–
1.35
1.4
V
VLC – VSENSE, ILOAD = 350 mA
–
500
550
mV
VLC – VSENSE, ILOAD = 150 mA
–
250
275
mV
errILC
VSENREF 260 mΩ < RS < 1Ω
Switch Dropout Voltage
VDO
Regulator Saturation Voltage
VSAT
Output Current Slew Time
tr
Current rising from 10% to 90%
50
80
120
μs
tf
Current falling from 90% to 10%
60
100
150
μs
Logic Input
Input Low Voltage
VIL
–
–
0.8
V
Input High Voltage
VIH
2
–
–
V
VIhys
150
350
–
mV
–600
–500
–400
mA
–
3
–
μs
–
1.5×
ILAOC
–
mA
Measured at VLC, when rising
1.0
1.2
1.4
V
mA
Input Hysteresis
Protection
Switch Overcurrent Trip Level
ILAOC
Overcurrent Detection Time2
tOCD
Switch Current Limit
ILALIM
LC Short Circuit Release Voltage
Short Circuit Source
Current2
VSCCR
From detection to ISCU > –1.2 mA
ISCU
When short is detected
–1.5
–1.1
–0.7
Thermal Monitor Activation Temperature
TJM
TJ at ILC = 90%, THTH open
90
105
120
ºC
Thermal Monitor Low Current Temperature
TJL
TJ at ILC = 25%, THTH open
110
130
150
ºC
TJF
Temperature increasing
–
165
–
ºC
TJhys
Recovery = TJF – TJhys
–
15
–
ºC
Overtemperature Shutdown Threshold
Overtemperature Hysteresis
1Functions
2For
correctly, but parameters are not guaranteed, below the general limit (7 V).
input and output current specifications, negative current is defined as coming out of (sourcing) the specified device pin.
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
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4
A6260
High Brightness LED Current Regulator
Functional Description
The A6260 is a linear current regulator that is designed to provide
drive current and protection for series-connected, high brightness LEDs in automotive applications. It provides programmable
current output at load voltages up to 3 V below the main supply
voltage. For automotive applications optimum performance is
achieved when driving 1 to 3 LEDs at currents up to 350 mA.
The LED current is set by a single low-power sense resistor and
the LED brightness can be further controlled by a PWM input to
the EN pin. The EN input can also be used as an on/off switched
input and the A6260 will enter a low current (<10 μA) sleep
mode if EN is held low.
For incandescent replacement configurations, the EN input can
be connected directly to the VIN pin with the supply to VIN controlled by a simple on/off switch.
The LEDs and the regulator are protected from excessive currents
caused by short circuits to ground or supply or by reversal of the
power supply connections.
Integrated thermal management circuits can be used to reduce
the regulated current level at high temperatures to limit power
dissipation.
LA Pin Switched and protected current source connected to the
anode of the LEDs.
LC Pin Controlled current sink connected to the cathode of the
LEDs.
LSS Pin Low-side current sink connection from the current regu-
lator to power ground via a sense resistor. A current sense resistor
(240 mΩ to 3 Ω) is connected between LSS and power ground.
SENSE Pin LED current sense input. The high impedance
SENSE input should have an independent connection to the top
(LSS connection side) of the sense resistor.
LED Current Level
The LED current is controlled by the internal current regulator
between the LC and LSS pins. This current, defined as the current
into the LC pin, ILC, is set by the value, RS , of the sense resistor. The voltage across the sense resistor, measured between the
SENSE pin and the GND pin, is compared to a reference voltage,
nominally 102 mV, allowing the use of a low-value sense resistor
with low power dissipation.
The LED current is thus defined as:
ILC = VSENREF / RS
conversely:
RS = VSENREF / ILC
Pin Functions
VIN Pin Supply to the control circuit. A small-value ceramic
bypass capacitor (typically 100 nF) should be connected from
close to this pin to the GND pin.
GND Pin Ground reference connection. Should be connected
directly to the negative supply as close as possible to the bottom
(ground connection) of the sense resistor.
EN Pin Logic input to enable operation. Can be used as a direct
PWM input. Chip enters a low-power sleep mode when this pin is
held low.
(1)
The nominal output current settings, ILC, versus the current
setting resistor values, RS, are given in the following table. The
current level defined here is the 100% current level before any
current reduction effects due to the temperature monitor,
described later in this document.
Sense Resistor Selection
ILC
(mA)
RS
(mΩ)
PD(RS)
(mW)
ILC
(mA)
RS
(mΩ)
PD(RS)
(mW)
350
286
35
125
800
13
300
333
30
100
1000
10
250
400
25
70
1429
7
THTH Pin Sets the thermal monitor threshold, TJM, where the
200
500
20
50
2000
5
output current starts to be reduced with increasing temperature.
When this pin is left open, the threshold temperature will typically be the specified default value. A resistor connected between
THTH and GND can be used to increase the threshold temperature. A resistor connected between THTH and VIN can be used to
decrease the threshold temperature. Connecting THTH directly to
GND disables the thermal monitor function.
150
667
15
35
2857
4
Parallel operation
The A6260 is a constant current controller, that is, it controls the
output current irrespective of output voltage (within the compliance range). This allows the outputs of two or more A6260s to be
connected in parallel (see figure 7, in the Applications Information section). In this configuration, each A6260 must have a
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A6260
High Brightness LED Current Regulator
dedicated sense resistor, which determines its share of the current
provided to the LED.
that the complete circuit, including LEDs, may remain connected
to the power supply under all conditions.
LED Brightness
Safety Features
Although the LED brightness can be controlled by changing the
current (intensity) this may slightly affect the color or the color
temperature of the light from the LED. When multiple LEDs
are used, it is usually more desirable to control the brightness by
switching the fixed LED current with a pulse width modulated
signal. This allows the LED brightness to be set using a digital
control input with little effect on the LED color.
The circuit includes several features to ensure safe operation and
to protect the LEDs and the A6260:
In the A6260, the brightness level can be controlled by a PWM
signal applied to the EN input. This controls both the low-side
linear regulator and the high-side switch.
When EN is switched from high to low, the low-side regulator
reduces the current to zero before allowing the high-side switch
to turn off.
▪ The high-side switch between VIN and LA has overcurrent
detection and a current limiter. It assumes that a short circuit is
present if the current exceeds the trip value, ILAOC , for longer
than the overcurrent detection time, tOCD.
▪ The current regulator between LC and LSS provides a natural
current limit due to the regulation.
▪ The thermal monitor reduces the regulated current as the
temperature rises.
▪ Thermal shutdown completely disables the outputs under
extreme overtemperature conditions.
Short Circuit Detection
A total of five short circuit conditions can exist as illustrated in
figure 1.
When EN is switched from low to high, the high-side switch is
turned on before the low-side regulator increases the current to
the full operating level.
LA Short to Supply (figure 1a) This condition is permitted
To assist EMC, the rate of change of the LED current is limited
and the current will rise and fall within the limits (tr, tf) defined in
the Electrical Characteristics table.
because the current remains regulated by the current sink. This
configuration may also be used in applications with low supply
voltages (see figure 4d in the Applications Information section).
Note that EN can be used for PWM dimming even when the
high-side switch is bypassed. (See figure 7(d)).
LA Short to Ground (figure 1b) This condition is detected when
Sleep Mode
When EN is held low, the A6260 will be in shutdown mode and
all internal circuits will be in a low-power sleep mode. In this
mode, the input current, IINS , will be less than 10 μA. This means
VIN
LA
A6260
VIN
LA
A6260
LC
GND
VIN
LA
A6260
LC
GND
the high-side switch current exceeds the trip value, ILAOC , for
longer than the overcurrent detection time, tOCD (3 μs typical).
When a short is detected, the switch and the regulator are both
disabled. When the voltage at LC drops below the short release
voltage, VSCCR, a low value current, ISCU (1.1 mA typical), is
then sourced from LA to provide a short circuit monitor. When
VIN
LC
GND
VIN
LA
A6260
LA
A6260
LC
LC
GND
GND
(a) LA Short to Supply
(b) LA Short to Ground
(c) LC Short to Supply
(d) LC Short to Ground
(e) LA Short to LC
Permitted because
current remains
regulated
Detected when switch
current exceeds trip
value for longer than
3 μs, released when
VLC >VSCCR
Current remains
regulated, thermal
shutdown provides
protection
Detected when switch
current exceeds trip
value for longer than
3 μs, released when
VLC >VSCCR
Current remains
regulated, thermal
shutdown provides
protection
Figure 1. Short circuit conditions detected
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A6260
High Brightness LED Current Regulator
the short circuit is removed the short circuit source current, ISCU ,
pulls the voltage at the LC pin above VSCCR, and the switch and
regulator are re-enabled.
LC Short to Supply (figure 1c) In this condition, the current
into the LC pin remains regulated but the power dissipated in
the A6260 increases. This higher dissipation causes the thermal
monitor to reduce the current to protect the regulator. In extreme
cases, or in cases where the thermal monitor is disabled, the
increased dissipation may cause temperature to reach the thermal
shutdown level, at which point the regulator will be disabled.
LC Short to Ground (figure 1d) This condition is detected when
the high-side switch current exceeds the trip value, ILAOC , for
longer than the overcurrent detection time, tOCD (3 μs typical).
When a short is detected, the switch and the regulator are both
disabled. When the voltage at LC drops below the short release
voltage, VSCCR, a low value current, ISCU (1.1 mA typical), is
then sourced from LA to provide a short circuit monitor. When
the short circuit is removed, ISCU pulls the voltage at the LC pin
above VSCCR, and the switch and regulator are re-enabled.
LA Short to LC (figure 1e) This condition is effectively the same
per degree Celsius typically, until the point at which the current drops
to 25% of the full level. The junction temperature at the 25% current
level is defined as TJL. If the temperature continues to rise above
TJL, the temperature monitor would continue to reduce current, but
at a slower rate, until the temperature reaches the overtemperature
shutdown temperature, TJF.
The temperature at which the current reduction begins can be
adjusted by changing the voltage on the THTH pin. When THTH
is left open, the temperature at which the current reduction begins
is typically 98°C. The thermal monitor activation temperature,
TJM, is defined in the Electrical Characteristics table at the 90%
current level.
TJM can be increased by reducing the voltage at the THTH pin,
VTHTH, and is defined as approximately:
1.503 − V THTH
TJM =
(2)
0.00363
where TJM is in °C.
A resistor connected between THTH and a reference supply
greater than 2 V will increase VTHTH and reduce TJM.
as the LC Short-to-Supply condition. In this condition, the current into the LC pin remains regulated but the power dissipated in
the A6260 increases. This higher dissipation causes the thermal
monitor to reduce the current to protect the regulator. In extreme
cases, or in cases where the thermal monitor is disabled, the
increased dissipation may cause temperature to reach the thermal
shutdown level, at which point the regulator will be disabled.
The primary function of the temperature monitor included in the
A6260 is to limit the power dissipation of the A6260 and maintain
the junction temperature below the maximum. However, it can
also be used to reduce LED current as LED temperature increases.
This can be achieved by mounting the A6260 on the same thermal
substrate as the LEDs, so that temperature rise in the LEDs would
also affect the A6260. As the junction temperature of the A6260
increases, the integrated temperature monitor lowers the regulated
current level, reducing the dissipated power in the A6260 and in the
LEDs. As shown in figure 2, from the full 100% current level (see
the LED Current Level section), current is reduced at a rate of 4%
90
Relative LED Current, ILC (%)
Temperature Monitor
100
80
60
40
25
20
0
70
90
TJM
110
TJL
130
150
170
Junction Temperature, TJ (°C)
Figure 2. Temperature monitor current reduction
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High Brightness LED Current Regulator
LED Current, Power Loss, and Junction Temperature
Calculations
1.40
900
1.35
800
1.30
700
TH
500
RTH pull-up
to 5 V
400
1.10
1.05
1.00
100
0.95
0.90
60
80
Figure 4 shows LED current versus input voltage and figure 5
shows junction temperature versus input voltage. Test conditions
were:
120
140
Figure 3. TJM versus RTH (pull-up or –down), and VTHTH
400
380
Without thermal monitor
ILED
360
340
320
With thermal monitor
ILEDM
300
280
260
then the RθJA for the device, when mounted on a typical application board, 30 °C/W. If thermal derating is used, ILED current is
reduced at a rate of 4% per °C (typ) from TJM.
100
TJM (°C)
I LED(mA)
(4)
1.15
200
40
if VSENREF = 0.102 V, IINQ = 3 mA (typ), and given
1.20
300
Power loss across IC, PD = (VIN – VLED – VSENREF)
× ILED + VIN × IINQ
(3)
VLED=7V
I LED=350mA
TA=50°C
240
220
RθJA= 30 °C/W
200
8
10
12
VIN (V)
14
16
Figure 4. LED current, ILED, versus input voltage, VIN, both with and
without thermal monitor
• VLED = 7 V,
150
• ILED = 350 mA,
140
Without thermal monitor
TJ
130
• TA = 50°C,
120
TJ(°C)
• RθJA = 30 °C/W, and
• The THTH pin open for thermal monitor testing
RTH pull-down
to GND
TH
0
The maximum LED current the A6260 can deliver depends on
voltage drop across the IC ( VIN – VLED ), ambient temperature
( TA ), and thermal resistance ( RθJA ) from the IC junction to ambient. RθJA depends on board construction, and air flow, and can be
calculated as follows:
Junction temperature, TJ = PD × RθJA
1.25
V
600
RTH (kΩ)
In extreme cases, if the chip temperature exceeds the overtemperature limit, TJF, both the sink regulator and the source switch
will be disabled. The temperature will continue to be monitored
and the output re-activated when the temperature drops below the
threshold provided by the specified hysteresis, TJhys.
1000
(V)
Figure 3 shows how the nominal value of the thermal monitor
activation temperature varies with the voltage at THTH and with
a pull-down resistor, RTH, to GND or with a pull-up resistor, RTH,
to 5 V.
V
A6260
110
100
With thermal
monitor, TJM
90
80
VLED=7V
I LED=350mA
TA=50°C
RθJA= 30 °C/W
70
60
50
8
10
12
VIN (V)
14
16
Figure 5. Junction temperature, TJ, versus input voltage, VIN, both with and
without thermal monitor
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A6260
High Brightness LED Current Regulator
Thermal Dissipation
Optimizing Thermal Layout
The amount of heat that can pass from the silicon of the A6260
to the surrounding ambient environment depends on the thermal
resistance of the structures connected to the A6260. The thermal
resistance, RθJA , is a measure of the temperature rise created by
power dissipation and is usually measured in degrees Celsius per
watt (°C/W).
The features of the printed circuit board, including heat conduction and adjacent thermal sources such as other components,
have a very significant effect on the thermal performance of the
device. To optimize thermal performance, the following should
be taken into account:
The temperature rise, ΔT, is calculated from the power dissipated,
PD , and the thermal resistance, RθJA , as:
ΔT = PD × RθJA
(5)
A thermal resistance from silicon to ambient, RθJA , of approximately 35°C/W can be achieved by mounting the A6260 on a
standard FR4 double-sided printed circuit board (PCB) with a
copper area of a few square inches on each side of the board
under the A6260. Additional improvements in the range of 20%
may be achieved by optimizing the PCB design.
• The device exposed thermal pad should be connected to as
much copper area as is available.
• Copper thickness should be as high as possible (for example,
2 oz. or greater for higher power applications).
• The greater the quantity of thermal vias, the better the dissipation. If the expense of vias is a concern, studies have shown
that concentrating the vias directly under the device in a tight
pattern, as shown in figure 6, has the greatest effect.
• Additional exposed copper area on the opposite side of the
board should be connected by means of the thermal vias. The
copper should cover as much area as possible.
• Other thermal sources should be placed as remote from the
device as possible
Signal traces
LJ package
footprint
0.7 mm
0.7 mm
LJ package
exposed
thermal pad
Top-layer
exposed copper
Ø0.3 mm via
Figure 6. Suggested PCB layout for thermal optimization
(maximum available bottom-layer copper recommended)
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A6260
High Brightness LED Current Regulator
Applications Information
Automotive
12V Power Net
Automotive
12V Power Net
VIN
LA
VIN
LA
A6260
PWM Dimming
and
On-Off Control
A6260
PWM Dimming
and
On-Off Control
EN
EN
LC
THTH
GND
LC
THTH
LSS
SENSE
LSS
GND
Ground
SENSE
Ground
(a) Basic circuit with PWM
Automotive
12 V Power Net
(b) Switched supply plus high-side PWM source
Low Voltage
(>6V) Supply
VIN
VIN
LA
LA
A6260
A6260
PWM Dimming
and
On-Off Control
EN
THTH
GND
EN
LC
THTH
LSS
SENSE
GND
Ground
LC
LSS
SENSE
Ground
(c) Simple switched supply (lamp replacement)
Automotive
12 V Power Net
(d) Low voltage operation
VIN
VIN
LA
LA
A6260
PWM Dimming
and
On-Off Control
A6260
EN
THTH
GND
EN
LC
LSS
SENSE
LC
LSS
SENSE
THTH
GND
Ground
(e) Parallel operation for higher LED current
Figure 7. Typical applications circuits
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A6260
High Brightness LED Current Regulator
Package LJ 8-Pin SOICN with Exposed Thermal Pad
4.90 ±0.10
0.65
8°
0°
8
B
A
1
3.90 ±0.10
6.00 ±0.20
2
SEATING PLANE
GAUGE PLANE
Branded Face
SEATING
PLANE
0.10 C
1.27 BSC
1
1.27
0.40
0.25 BSC
0.51
0.31
2.41
1.04 REF
3.30 NOM
8X
C
5.60
2
3.30
C
PCB Layout Reference View
For Reference Only; not for tooling use (reference MS-012BA)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
1.70 MAX
0.15
0.00
1.27
1.75
0.25
0.17
2.41 NOM
8
A Terminal #1 mark area
B
Exposed thermal pad (bottom surface); dimensions may vary with device
C
Reference land pattern layout (reference IPC7351
SOIC127P600X175-9AM); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
A6260
High Brightness LED Current Regulator
Revision History
Revision
Revision Date
Rev. 7
September 12, 2013
Description of Revision
Update functional description
Copyright ©2007-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
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