LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only OFFICE:7F.,NO.208,SEC.3,JHONGYANG Rd.,Tucheng City Taipei Hsien,Taiwan R.O.C TEL:(02)22677686(REP) FAX:(02)22675286,(02)22695616 SINGLE DIGIT LED DISPLAY (0.8 Inch) LSD805/62V-XX DATA SHEET DOC. NO : QW0905-LSD805/62V-XX REV. : A DATE : 03 - Nov - 2004 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD805/62V-XX Page 1/7 Package Dimensions 19.7(0.776") 8.2(0.323") PIN NO.1 27.5 (1.083") 20.3 (0.8") LSD805/62V-XX LIGITEK ψ2.2(0.087") □0.51 TYP 5.0±0.5 15.24(0.6") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.54X7=17.78 (0.7") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD805/62V-XX Page 2/7 Internal Circuit Diagram LSD8052V-XX 3,5,11,16 A B C D E 1 14 12 10 4 F G DP 2 13 9 LSD8162V-XX 3,5,11,16 A B C D E 1 14 12 10 4 F G DP 2 13 9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO. LSD805/62V-XX Electrical Connection LSD8052V-XX PIN NO. LSD8062V-XX PIN NO. 1 Anode A 1 Cathode A 2 Anode F 2 Cathode F 3 Common Cathode 3 Common Anode 4 Anode E 4 Cathode E 5 Common Cathode 5 Common Anode 6 Nc 6 Nc 7 No Pin 7 No Pin 8 No Pin 8 No Pin 9 Anode DP 9 Cathode DP 10 Anode D 10 Cathode D 11 Common Cathode 11 Common Anode 12 Anode C 12 Cathode C 13 Anode G 13 Cathode G 14 Anode B 14 Cathode B 15 No Pin 15 No Pin 16 Common Cathode 16 Common Anode LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD805/62V-XX Page 4/7 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT VG Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 120 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode emitted CHIP PART NO material Electrical λp (nm) △λ Iv(mcd) Vf(v) (nm) Min. Typ. Max. Min. Typ. IV-M LSD8052V-XX GaP Green Common Cathode 565 35 1.7 2.1 2.6 2.35 6.1 2:1 LSD8062V-XX GaP Green Common Anode 565 35 1.7 2.1 2.6 2.35 6.1 2:1 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD805/62V-XX Page 5/7 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λp nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD805/62V-XX Page 6/7 Typical Electro-Optical Characteristics Current VG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 1.0 5.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature(℃) Ambient Temperature(℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7 PART NO. LSD805/62V-XX Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11