Reliability Report

AOS Semiconductor
Product Reliability Report
AON6782,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AON6782.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AON6782
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
TM
SRFET AON6782 uses advanced trench technology with a monolithically integrated
Schottky diode to provide excellent RDS(ON),and low gate charge. This device is suitable for
use as a low side FET in SMPS, load switching and general purpose applications.
-RoHS Compliant
-Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AON6782
Standard sub-micron
Low voltage N channel
Package Type
DFN 5x6
Lead Frame
Cu
Die Attach
Solder paste
Bonding Wire
N.A for Cu clip
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AON6782
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
Number
of
Failures
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
-
HTGB
Temp = 150°°c,
Vgs=100% of
Vgsmax
168hrs
500 hrs
1000 hrs
Temp = 150°°c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
11 lots
1815pcs
0
JESD22A113
231pcs
0
JESD22A108
77pcs / lot
231pcs
0
JESD22A108
3 lots
130 +/- 2°°c,
85%RH, 33.3 psi,
Vgs = 100% of
Vgs max
121°°c, 29.7psi,
RH=100%
100 hrs
(Note A*)
11 lots
77pcs / lot
605pcs
0
JESD22A110
96 hrs
(Note A*)
11 lots
55pcs / lot
605pcs
0
JESD22A102
-65°°c to 150°°c,
air to air
250 / 500
cycles
(Note A*)
11 lots
55pcs / lot
605pcs
0
JESD22A104
(Note A*)
55pcs / lot
3 lots
(Note A*)
HTRB
HAST
Pressure Pot
Temperature
Cycle
Standard
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 8
MTTF = 14871 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AON6782). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
8
MTTF = 10 / FIT = 1.30 x 10 hrs = 14871 years
/ [2x2x3x77x1000 x258] = 8
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K